DE69909659D1 - Elektrische Durchführung für Hochtemperatur - Ofen - Google Patents

Elektrische Durchführung für Hochtemperatur - Ofen

Info

Publication number
DE69909659D1
DE69909659D1 DE69909659T DE69909659T DE69909659D1 DE 69909659 D1 DE69909659 D1 DE 69909659D1 DE 69909659 T DE69909659 T DE 69909659T DE 69909659 T DE69909659 T DE 69909659T DE 69909659 D1 DE69909659 D1 DE 69909659D1
Authority
DE
Germany
Prior art keywords
high temperature
temperature furnace
electrical feedthrough
feedthrough
electrical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69909659T
Other languages
English (en)
Other versions
DE69909659T2 (de
Inventor
Glen Eugene Schmidt
Eugene Lee Kesselhuth
Jeffrey John Bolduc
Ray Dean Dorris
Albert Eugene Waldorf
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Application granted granted Critical
Publication of DE69909659D1 publication Critical patent/DE69909659D1/de
Publication of DE69909659T2 publication Critical patent/DE69909659T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B17/00—Insulators or insulating bodies characterised by their form
    • H01B17/26—Lead-in insulators; Lead-through insulators
    • H01B17/30—Sealing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4641—Manufacturing multilayer circuits by laminating two or more circuit boards having integrally laminated metal sheets or special power cores

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
DE69909659T 1998-01-09 1999-01-07 Elektrische Durchführung für Hochtemperatur - Ofen Expired - Lifetime DE69909659T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/004,960 US6055160A (en) 1998-01-09 1998-01-09 High temperature oven electrical feed through
US4960 1998-01-09

Publications (2)

Publication Number Publication Date
DE69909659D1 true DE69909659D1 (de) 2003-08-28
DE69909659T2 DE69909659T2 (de) 2004-06-09

Family

ID=21713408

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69909659T Expired - Lifetime DE69909659T2 (de) 1998-01-09 1999-01-07 Elektrische Durchführung für Hochtemperatur - Ofen

Country Status (3)

Country Link
US (1) US6055160A (de)
EP (1) EP0929081B1 (de)
DE (1) DE69909659T2 (de)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8276268B2 (en) 2008-11-03 2012-10-02 General Electric Company System and method of forming a patterned conformal structure
BR112014028259B1 (pt) * 2012-05-17 2020-05-05 Micro Motion Inc passagem de alimentação à prova de chama adaptada para uso com uma abertura, e, método de formar uma passagem de alimentação à prova de chama adaptada para uso com uma abertura
CN107524965B (zh) * 2016-06-22 2024-04-05 赛尔富电子有限公司 一种使用led灯具的货架的取电系统

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0278372U (de) * 1988-12-06 1990-06-15
US5617300A (en) * 1993-08-23 1997-04-01 Nagano Japan Radio Co., Ltd. Connecting method of printed substrate and apparatus
US5557064A (en) * 1994-04-18 1996-09-17 Motorola, Inc. Conformal shield and method for forming same
DE29514398U1 (de) * 1995-09-07 1995-10-19 Siemens AG, 80333 München Abschirmung für Flachbaugruppen
US5761031A (en) * 1996-11-15 1998-06-02 International Business Machines Corporation Conductive shock mount for reducing electromagnetic interference in a disk drive system

Also Published As

Publication number Publication date
EP0929081B1 (de) 2003-07-23
US6055160A (en) 2000-04-25
DE69909659T2 (de) 2004-06-09
EP0929081A3 (de) 2000-09-13
EP0929081A2 (de) 1999-07-14

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition