DE69831664D1 - Härtbare dichtungsmittelzusammensetzung - Google Patents

Härtbare dichtungsmittelzusammensetzung

Info

Publication number
DE69831664D1
DE69831664D1 DE69831664T DE69831664T DE69831664D1 DE 69831664 D1 DE69831664 D1 DE 69831664D1 DE 69831664 T DE69831664 T DE 69831664T DE 69831664 T DE69831664 T DE 69831664T DE 69831664 D1 DE69831664 D1 DE 69831664D1
Authority
DE
Germany
Prior art keywords
sealant composition
hardenable sealant
hardenable
composition
sealant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69831664T
Other languages
English (en)
Other versions
DE69831664T2 (de
Inventor
T Pachl
Donald Taylor
W Scrivens
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denovus LLC
Original Assignee
Denovus LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denovus LLC filed Critical Denovus LLC
Publication of DE69831664D1 publication Critical patent/DE69831664D1/de
Application granted granted Critical
Publication of DE69831664T2 publication Critical patent/DE69831664T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Paints Or Removers (AREA)
  • Sealing Material Composition (AREA)
DE69831664T 1997-05-21 1998-05-20 Härtbare dichtungsmittelzusammensetzung Expired - Fee Related DE69831664T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4729097P 1997-05-21 1997-05-21
US7920498P 1998-03-24 1998-03-24
PCT/US1998/010320 WO1998053008A1 (en) 1997-05-21 1998-05-20 Curable sealant composition

Publications (2)

Publication Number Publication Date
DE69831664D1 true DE69831664D1 (de) 2006-02-02
DE69831664T2 DE69831664T2 (de) 2006-06-14

Family

ID=26724848

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69831664T Expired - Fee Related DE69831664T2 (de) 1997-05-21 1998-05-20 Härtbare dichtungsmittelzusammensetzung

Country Status (5)

Country Link
EP (1) EP0983320B9 (de)
AU (1) AU750635B2 (de)
CA (1) CA2290425A1 (de)
DE (1) DE69831664T2 (de)
WO (1) WO1998053008A1 (de)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189781B2 (en) 2003-03-13 2007-03-13 H.B. Fuller Licensing & Finance Inc. Moisture curable, radiation curable sealant composition
US6803412B2 (en) 2003-03-13 2004-10-12 H.B. Fuller Licensing & Financing Inc. Moisture curable hot melt sealants for glass constructions
US7368171B2 (en) 2004-09-03 2008-05-06 H.B. Fuller Licensing & Financing, Inc. Laminating adhesive, laminate including the same, and method of making a laminate
US7713628B2 (en) 2005-05-31 2010-05-11 Chemque, Inc. Actinic radiation curable coating compositions
GB0806434D0 (en) 2008-04-09 2008-05-14 Zephyros Inc Improvements in or relating to structural adhesives
WO2009140001A1 (en) * 2008-05-14 2009-11-19 Dow Global Technologies Inc. Epoxy toughening using linear co-polyesters
GB0916205D0 (en) 2009-09-15 2009-10-28 Zephyros Inc Improvements in or relating to cavity filling
US9096039B2 (en) 2010-03-04 2015-08-04 Zephyros, Inc. Structural composite laminates
US10577522B2 (en) 2013-07-26 2020-03-03 Zephyros, Inc. Thermosetting adhesive films including a fibrous carrier
GB201417985D0 (en) 2014-10-10 2014-11-26 Zephyros Inc Improvements in or relating to structural adhesives
PL3668907T3 (pl) 2017-08-18 2023-07-24 Fina Technology, Inc. Epoksydowany polifarnezen i sposoby jego wytwarzania

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4874798A (en) * 1983-02-07 1989-10-17 Union Carbide Corporation Photocopolymerizable compositions based on epoxy and hydroxyl-containing organic materials and substituted cycloaliphatic monoepoxide reactive diluents
DE19534664A1 (de) * 1995-09-19 1997-03-20 Thera Ges Fuer Patente Lichtinitiiert kationisch härtende, dauerflexible Epoxidharzmasse und ihre Verwendung

Also Published As

Publication number Publication date
AU7583498A (en) 1998-12-11
EP0983320B9 (de) 2006-06-28
EP0983320B1 (de) 2005-09-21
WO1998053008A1 (en) 1998-11-26
AU750635B2 (en) 2002-07-25
DE69831664T2 (de) 2006-06-14
CA2290425A1 (en) 1998-11-26
EP0983320A1 (de) 2000-03-08

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee