DE69820477T2 - Vorrichtung zur Druckmessung in einem Raum mit einem Halbleiterchip - Google Patents

Vorrichtung zur Druckmessung in einem Raum mit einem Halbleiterchip Download PDF

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Publication number
DE69820477T2
DE69820477T2 DE69820477T DE69820477T DE69820477T2 DE 69820477 T2 DE69820477 T2 DE 69820477T2 DE 69820477 T DE69820477 T DE 69820477T DE 69820477 T DE69820477 T DE 69820477T DE 69820477 T2 DE69820477 T2 DE 69820477T2
Authority
DE
Germany
Prior art keywords
room
semiconductor chip
measuring pressure
measuring
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69820477T
Other languages
English (en)
Other versions
DE69820477D1 (de
Inventor
Gerardus Brouwer
T Veen Dani L Van
Gerard Borgers
Groot Ron De
Jan Koelling
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Application granted granted Critical
Publication of DE69820477D1 publication Critical patent/DE69820477D1/de
Publication of DE69820477T2 publication Critical patent/DE69820477T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/142—Multiple part housings
    • G01L19/143—Two part housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/003—Fluidic connecting means using a detachable interface or adapter between the process medium and the pressure gauge
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
DE69820477T 1997-10-23 1998-10-23 Vorrichtung zur Druckmessung in einem Raum mit einem Halbleiterchip Expired - Fee Related DE69820477T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1007339 1997-10-23
PCT/NL1998/000607 WO1999020990A1 (en) 1997-10-23 1998-10-23 Device for performing measurements in a space by means of a chip

Publications (2)

Publication Number Publication Date
DE69820477D1 DE69820477D1 (de) 2004-01-22
DE69820477T2 true DE69820477T2 (de) 2004-10-07

Family

ID=19765886

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69820477T Expired - Fee Related DE69820477T2 (de) 1997-10-23 1998-10-23 Vorrichtung zur Druckmessung in einem Raum mit einem Halbleiterchip

Country Status (5)

Country Link
US (1) US6405597B1 (de)
EP (1) EP1029227B1 (de)
AU (1) AU9766498A (de)
DE (1) DE69820477T2 (de)
WO (1) WO1999020990A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4380028B2 (ja) * 1999-11-02 2009-12-09 株式会社デンソー 圧力センサ
IT1311270B1 (it) * 1999-12-22 2002-03-12 Bitron Spa Dispositivo rilevatore di pressione, particolarmente per un impiantodi climatizzazione.
DE10314875B4 (de) * 2003-04-01 2009-12-03 Eads Deutschland Gmbh Temperaturbeständiges elektronisches Bauteil in Form eines Sensors oder Aktors und Verfahren zu seiner Herstellung
US7635077B2 (en) * 2005-09-27 2009-12-22 Honeywell International Inc. Method of flip chip mounting pressure sensor dies to substrates and pressure sensors formed thereby
US10107662B2 (en) 2015-01-30 2018-10-23 Honeywell International Inc. Sensor assembly

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129042A (en) * 1977-11-18 1978-12-12 Signetics Corporation Semiconductor transducer packaged assembly
US4763098A (en) * 1985-04-08 1988-08-09 Honeywell Inc. Flip-chip pressure transducer
KR920022482A (ko) 1991-05-09 1992-12-19 가나이 쯔도무 전자부품 탑재모듈
US5213676A (en) * 1992-05-11 1993-05-25 Eastman Kodak Company Method of generating a substrate electrode for flip chip and other applications
US5581038A (en) * 1994-04-04 1996-12-03 Sentir, Inc. Pressure measurement apparatus having a reverse mounted transducer and overpressure guard
JPH08178778A (ja) * 1994-12-27 1996-07-12 Mitsubishi Electric Corp 半導体圧力検出装置

Also Published As

Publication number Publication date
DE69820477D1 (de) 2004-01-22
US6405597B1 (en) 2002-06-18
EP1029227A1 (de) 2000-08-23
AU9766498A (en) 1999-05-10
WO1999020990A1 (en) 1999-04-29
EP1029227B1 (de) 2003-12-10

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee