DE69630314D1 - LIFTING PIN FROM MOLDED MEMORY ALLOY FOR A SYSTEM FOR TREATING SEMICONDUCTORS - Google Patents

LIFTING PIN FROM MOLDED MEMORY ALLOY FOR A SYSTEM FOR TREATING SEMICONDUCTORS

Info

Publication number
DE69630314D1
DE69630314D1 DE69630314T DE69630314T DE69630314D1 DE 69630314 D1 DE69630314 D1 DE 69630314D1 DE 69630314 T DE69630314 T DE 69630314T DE 69630314 T DE69630314 T DE 69630314T DE 69630314 D1 DE69630314 D1 DE 69630314D1
Authority
DE
Germany
Prior art keywords
lift pins
memory alloy
lifting pin
lift
molded memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69630314T
Other languages
German (de)
Other versions
DE69630314T2 (en
Inventor
Kevin Shufflebotham
Christopher Griffin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Application granted granted Critical
Publication of DE69630314D1 publication Critical patent/DE69630314D1/en
Publication of DE69630314T2 publication Critical patent/DE69630314T2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G03F7/70708—Chucks, e.g. chucking or un-chucking operations or structural details being electrostatic; Electrostatically deformable vacuum chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/914—Differential etching apparatus including particular materials of construction

Abstract

A lift pin arrangement for use in semiconductor processing apparatus wherein the lift pins are of a shape memory alloy. The lift pins exhibit superelasticity and/or shape memory effects which allows the lift pins to withstand substantial bending forces without permanent deformation thereof, and in the case where the lift pins become deformed it is possible to restraighten the lift pins simply by heating the lift pins to an appropriate temperature.
DE69630314T 1995-12-22 1996-12-18 LIFTING PIN FROM MOLDED MEMORY ALLOY FOR A SYSTEM FOR TREATING SEMICONDUCTORS Expired - Lifetime DE69630314T2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/577,520 US5669977A (en) 1995-12-22 1995-12-22 Shape memory alloy lift pins for semiconductor processing equipment
US577520 1995-12-22
PCT/US1996/020028 WO1997023899A1 (en) 1995-12-22 1996-12-18 Shape memory alloy lift pins for semiconductor processing equipment

Publications (2)

Publication Number Publication Date
DE69630314D1 true DE69630314D1 (en) 2003-11-13
DE69630314T2 DE69630314T2 (en) 2004-07-29

Family

ID=24309090

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69630314T Expired - Lifetime DE69630314T2 (en) 1995-12-22 1996-12-18 LIFTING PIN FROM MOLDED MEMORY ALLOY FOR A SYSTEM FOR TREATING SEMICONDUCTORS

Country Status (8)

Country Link
US (1) US5669977A (en)
EP (1) EP0868741B1 (en)
JP (1) JP2000502508A (en)
KR (1) KR100461996B1 (en)
CN (1) CN1209216A (en)
AT (1) ATE251800T1 (en)
DE (1) DE69630314T2 (en)
WO (1) WO1997023899A1 (en)

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US5885353A (en) * 1996-06-21 1999-03-23 Micron Technology, Inc. Thermal conditioning apparatus
US5848670A (en) * 1996-12-04 1998-12-15 Applied Materials, Inc. Lift pin guidance apparatus
US6168668B1 (en) * 1998-11-25 2001-01-02 Applied Materials, Inc. Shadow ring and guide for supporting the shadow ring in a chamber
JP2000223549A (en) * 1999-01-29 2000-08-11 Canon Inc Substrate carrier, substrate carrying method, hand mechanism for carrying substrate, ashing apparatus and ashing method
US6236300B1 (en) 1999-03-26 2001-05-22 R. Sjhon Minners Bistable micro-switch and method of manufacturing the same
US6958098B2 (en) * 2000-02-28 2005-10-25 Applied Materials, Inc. Semiconductor wafer support lift-pin assembly
US6572708B2 (en) * 2000-02-28 2003-06-03 Applied Materials Inc. Semiconductor wafer support lift-pin assembly
US6640432B1 (en) * 2000-04-12 2003-11-04 Formfactor, Inc. Method of fabricating shaped springs
US7324635B2 (en) 2000-05-04 2008-01-29 Telemaze Llc Branch calling and caller ID based call routing telephone features
US6422010B1 (en) * 2000-06-11 2002-07-23 Nitinol Technologies, Inc. Manufacturing of Nitinol parts and forms
KR100769826B1 (en) * 2001-05-22 2007-10-23 엘지.필립스 엘시디 주식회사 Lifter-pin Unit
TW588403B (en) * 2001-06-25 2004-05-21 Tokyo Electron Ltd Substrate treating device and substrate treating method
DE10134513A1 (en) * 2001-07-16 2003-01-30 Unaxis Balzers Ag Lifting and support device
DE10232478A1 (en) * 2002-07-17 2004-02-12 Infineon Technologies Ag Wafer lifting device for semiconductor electronics and chip production and testing has guides for lifting pins which are attached to the wafer holder
US6779963B2 (en) * 2002-11-21 2004-08-24 General Electric Company Apparatus and method to control force exerted on steam turbines by inlet pipes
EP1475667A1 (en) * 2003-05-09 2004-11-10 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
EP1762898A3 (en) * 2003-05-09 2007-03-28 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100808374B1 (en) * 2003-12-27 2008-02-27 동부일렉트로닉스 주식회사 Device for baking Photo resist
CN100371783C (en) * 2005-01-27 2008-02-27 中华映管股份有限公司 Jacking pin device for reaction chamber
US7744730B2 (en) * 2005-04-14 2010-06-29 Tango Systems, Inc. Rotating pallet in sputtering system
EP1955369B1 (en) * 2005-11-23 2012-10-24 Materials and Technologies Corporation Device and method for holding a substrate
US7867176B2 (en) * 2005-12-27 2011-01-11 Cordis Corporation Variable stiffness guidewire
US7785317B2 (en) 2006-03-29 2010-08-31 Codman & Shurtleff, Inc. Joined metal tubing and method of manufacture
US8690938B2 (en) * 2006-05-26 2014-04-08 DePuy Synthes Products, LLC Occlusion device combination of stent and mesh with diamond-shaped porosity
US8118859B2 (en) * 2006-05-26 2012-02-21 Codman & Shurtleff, Inc. Occlusion device combination of stent and mesh having offset parallelogram porosity
US7766935B2 (en) * 2006-06-12 2010-08-03 Codman & Shurtleff, Inc. Modified headpiece for hydraulic coil deployment system
US7670353B2 (en) * 2006-06-12 2010-03-02 Codman & Shurtleff, Inc. Modified headpiece for hydraulic coil deployment system
US8585732B2 (en) * 2006-06-14 2013-11-19 DePuy Synthes Products, LLC Retrieval device with sidewall grippers
TWI456683B (en) * 2007-06-29 2014-10-11 Ulvac Inc Substrate transfer robot
US20100013626A1 (en) * 2008-07-15 2010-01-21 Applied Materials, Inc. Substrate lift pin sensor
US9105705B2 (en) 2011-03-14 2015-08-11 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8802545B2 (en) 2011-03-14 2014-08-12 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8946058B2 (en) 2011-03-14 2015-02-03 Plasma-Therm Llc Method and apparatus for plasma dicing a semi-conductor wafer
US8643313B2 (en) * 2011-12-29 2014-02-04 General Electric Company Cyclotron actuator using a shape memory alloy
JP6436090B2 (en) * 2013-10-30 2018-12-12 株式会社ニコン Substrate holding apparatus, exposure apparatus, and device manufacturing method
US20150203955A1 (en) * 2013-11-07 2015-07-23 Carnegie Mellon University, A Pennsylvania Non-Profit Corporation Apparatus and method for making composition spread alloy films
CN105363627A (en) * 2015-10-09 2016-03-02 昆山希盟自动化科技有限公司 LOCA jointing machine for CCD alignment
CN106711080A (en) * 2015-11-16 2017-05-24 北京北方微电子基地设备工艺研究中心有限责任公司 Bearing apparatus and semiconductor processing equipment
US10784142B2 (en) 2018-01-09 2020-09-22 Varian Semiconductor Equipment Associates, Inc. Lift pin system for wafer handling
KR102420343B1 (en) * 2019-11-04 2022-07-14 세메스 주식회사 A processing chamber
US11335585B2 (en) * 2020-05-08 2022-05-17 Taiwan Semiconductor Manufacturing Co., Ltd. Vacuum wafer chuck for manufacturing semiconductor devices

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Also Published As

Publication number Publication date
JP2000502508A (en) 2000-02-29
US5669977A (en) 1997-09-23
DE69630314T2 (en) 2004-07-29
EP0868741B1 (en) 2003-10-08
KR100461996B1 (en) 2005-04-08
CN1209216A (en) 1999-02-24
EP0868741A1 (en) 1998-10-07
ATE251800T1 (en) 2003-10-15
KR19990076703A (en) 1999-10-15
WO1997023899A1 (en) 1997-07-03

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Legal Events

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