DE69427401T2 - Lead frames for integrated circuit arrangements - Google Patents

Lead frames for integrated circuit arrangements

Info

Publication number
DE69427401T2
DE69427401T2 DE69427401T DE69427401T DE69427401T2 DE 69427401 T2 DE69427401 T2 DE 69427401T2 DE 69427401 T DE69427401 T DE 69427401T DE 69427401 T DE69427401 T DE 69427401T DE 69427401 T2 DE69427401 T2 DE 69427401T2
Authority
DE
Germany
Prior art keywords
integrated circuit
lead frames
circuit arrangements
arrangements
frames
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69427401T
Other languages
German (de)
Other versions
DE69427401D1 (en
Inventor
Renato Poinelli
Mauro Mazzola
Paolo Casati
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
STMicroelectronics SRL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by STMicroelectronics SRL filed Critical STMicroelectronics SRL
Priority claimed from EP94830403A external-priority patent/EP0698922B1/en
Publication of DE69427401D1 publication Critical patent/DE69427401D1/en
Application granted granted Critical
Publication of DE69427401T2 publication Critical patent/DE69427401T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
DE69427401T 1994-08-12 1994-08-12 Lead frames for integrated circuit arrangements Expired - Fee Related DE69427401T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP94830403A EP0698922B1 (en) 1994-08-12 1994-08-12 Leadframe for supporting integrated semiconductor devices

Publications (2)

Publication Number Publication Date
DE69427401D1 DE69427401D1 (en) 2001-07-12
DE69427401T2 true DE69427401T2 (en) 2001-10-04

Family

ID=8218507

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69427401T Expired - Fee Related DE69427401T2 (en) 1994-08-12 1994-08-12 Lead frames for integrated circuit arrangements

Country Status (1)

Country Link
DE (1) DE69427401T2 (en)

Also Published As

Publication number Publication date
DE69427401D1 (en) 2001-07-12

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee