DE69409655D1 - Herstellung von mikrolinsen auf festkörper-bildaufnehmer - Google Patents

Herstellung von mikrolinsen auf festkörper-bildaufnehmer

Info

Publication number
DE69409655D1
DE69409655D1 DE69409655T DE69409655T DE69409655D1 DE 69409655 D1 DE69409655 D1 DE 69409655D1 DE 69409655 T DE69409655 T DE 69409655T DE 69409655 T DE69409655 T DE 69409655T DE 69409655 D1 DE69409655 D1 DE 69409655D1
Authority
DE
Germany
Prior art keywords
manufacture
solid image
micro lenses
image recorders
recorders
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69409655T
Other languages
English (en)
Other versions
DE69409655T2 (de
Inventor
Christopher Needham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intellectual Ventures I LLC
Original Assignee
Polaroid Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polaroid Corp filed Critical Polaroid Corp
Application granted granted Critical
Publication of DE69409655D1 publication Critical patent/DE69409655D1/de
Publication of DE69409655T2 publication Critical patent/DE69409655T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H01L31/02327—Optical elements or arrangements associated with the device the optical elements being integrated or being directly associated to the device, e.g. back reflectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
DE69409655T 1993-09-17 1994-08-10 Herstellung von mikrolinsen auf festkörper-bildaufnehmer Expired - Lifetime DE69409655T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12313893A 1993-09-17 1993-09-17
PCT/US1994/009008 WO1995008192A1 (en) 1993-09-17 1994-08-10 Forming microlenses on solid state imager

Publications (2)

Publication Number Publication Date
DE69409655D1 true DE69409655D1 (de) 1998-05-20
DE69409655T2 DE69409655T2 (de) 1998-08-06

Family

ID=22406927

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69409655T Expired - Lifetime DE69409655T2 (de) 1993-09-17 1994-08-10 Herstellung von mikrolinsen auf festkörper-bildaufnehmer

Country Status (7)

Country Link
US (1) US5670384A (de)
EP (1) EP0719457B1 (de)
JP (1) JPH09502836A (de)
KR (1) KR960705347A (de)
CA (1) CA2169923A1 (de)
DE (1) DE69409655T2 (de)
WO (1) WO1995008192A1 (de)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3405620B2 (ja) * 1995-05-22 2003-05-12 松下電器産業株式会社 固体撮像装置
JPH0964325A (ja) * 1995-08-23 1997-03-07 Sony Corp 固体撮像素子とその製造方法
US6294456B1 (en) * 1998-11-27 2001-09-25 Taiwan Semiconductor Manufacturing Company Method of prefilling of keyhole at the top metal level with photoresist to prevent passivation damage even for a severe top metal rule
US6171883B1 (en) 1999-02-18 2001-01-09 Taiwan Semiconductor Manufacturing Company Image array optoelectronic microelectronic fabrication with enhanced optical stability and method for fabrication thereof
US6583438B1 (en) * 1999-04-12 2003-06-24 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device
FR2803395A1 (fr) * 1999-12-30 2001-07-06 Commissariat Energie Atomique Microsysteme optique solide a face plane et procede de realisation d'un tel microsysteme
JP2004079608A (ja) * 2002-08-12 2004-03-11 Sanyo Electric Co Ltd 固体撮像装置および固体撮像装置の製造方法
KR20040060509A (ko) * 2002-12-30 2004-07-06 동부전자 주식회사 Ｃｍｏｓ 이미지 센서
US7061028B2 (en) * 2003-03-12 2006-06-13 Taiwan Semiconductor Manufacturing, Co., Ltd. Image sensor device and method to form image sensor device
US20040223071A1 (en) 2003-05-08 2004-11-11 David Wells Multiple microlens system for image sensors or display units
US7205526B2 (en) 2003-12-22 2007-04-17 Micron Technology, Inc. Methods of fabricating layered lens structures
KR100538149B1 (ko) * 2003-12-27 2005-12-21 동부아남반도체 주식회사 이미지 센서
KR100595898B1 (ko) * 2003-12-31 2006-07-03 동부일렉트로닉스 주식회사 이미지 센서 및 그 제조방법
US7078260B2 (en) * 2003-12-31 2006-07-18 Dongbu Electronics Co., Ltd. CMOS image sensors and methods for fabricating the same
KR100649023B1 (ko) * 2004-11-09 2006-11-28 동부일렉트로닉스 주식회사 씨모스 이미지 센서의 제조방법

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5990466A (ja) * 1982-11-15 1984-05-24 Mitsubishi Electric Corp 固体撮像素子
JPS5992567A (ja) * 1982-11-18 1984-05-28 Mitsubishi Electric Corp 固体撮像素子用微小集光レンズの製造方法
JPS6047472A (ja) * 1983-08-26 1985-03-14 Hitachi Ltd 固体撮像素子
JPS60145776A (ja) * 1984-01-09 1985-08-01 Matsushita Electronics Corp 固体撮像装置
JPS6132469A (ja) * 1984-07-24 1986-02-15 Toppan Printing Co Ltd カラー固体撮像素子の製造方法
JPS6132409A (ja) * 1984-07-24 1986-02-15 Hitachi Ltd 負荷時タツプ切換変圧器
JPS61287263A (ja) * 1985-06-14 1986-12-17 Mitsubishi Electric Corp 固体撮像装置及びその製造方法
JPH0640161B2 (ja) * 1985-06-18 1994-05-25 三菱電機株式会社 マイクロレンズ
JPH0712091B2 (ja) * 1985-07-09 1995-02-08 松下電子工業株式会社 受光素子
JPS6223161A (ja) * 1985-07-23 1987-01-31 Mitsubishi Electric Corp マイクロレンズ付固体撮像装置
JPS6292468A (ja) * 1985-10-18 1987-04-27 Sanyo Electric Co Ltd 固体撮像素子
JPS63188102A (ja) * 1987-01-30 1988-08-03 Fujitsu Ltd カラ−固体撮像素子
JP2737946B2 (ja) * 1988-08-30 1998-04-08 ソニー株式会社 固体撮像装置の製造方法
US4910155A (en) * 1988-10-28 1990-03-20 International Business Machines Corporation Wafer flood polishing
US4966831A (en) * 1989-04-20 1990-10-30 Eastman Kodak Company Lens arrays for light sensitive devices
JPH0425073A (ja) * 1990-05-16 1992-01-28 Toppan Printing Co Ltd 固体撮像素子用マイクロレンズと固体撮像素子、およびマイクロレンズの製造方法と固体撮像素子の製造方法
JPH0424964A (ja) * 1990-05-16 1992-01-28 Olympus Optical Co Ltd 固体撮像装置
JP2956132B2 (ja) * 1990-06-01 1999-10-04 日本電気株式会社 固体撮像素子
GB2248964A (en) * 1990-10-17 1992-04-22 Philips Electronic Associated Plural-wavelength infrared detector devices
JP3420776B2 (ja) * 1991-04-22 2003-06-30 オリンパス光学工業株式会社 固体撮像装置の製造方法
US5321249A (en) * 1991-10-31 1994-06-14 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
US5384231A (en) * 1993-08-24 1995-01-24 Eastman Kodak Company Fabricating lens array structures for imaging devices

Also Published As

Publication number Publication date
EP0719457B1 (de) 1998-04-15
DE69409655T2 (de) 1998-08-06
CA2169923A1 (en) 1995-03-23
EP0719457A1 (de) 1996-07-03
US5670384A (en) 1997-09-23
JPH09502836A (ja) 1997-03-18
WO1995008192A1 (en) 1995-03-23
KR960705347A (ko) 1996-10-09

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: POLAROID CORP., WALTHAM, MASS., US

8327 Change in the person/name/address of the patent owner

Owner name: SENSHIN CAPITAL, LLC, WILMINGTON, DEL., US