DE69205009D1 - Verfahren und Vorrichtung für Beschichtung mittels Katodenzerstäubung mit Verwendung Maschine-lesbarer Indizes von Target-Anordnung getragen worden. - Google Patents

Verfahren und Vorrichtung für Beschichtung mittels Katodenzerstäubung mit Verwendung Maschine-lesbarer Indizes von Target-Anordnung getragen worden.

Info

Publication number
DE69205009D1
DE69205009D1 DE69205009T DE69205009T DE69205009D1 DE 69205009 D1 DE69205009 D1 DE 69205009D1 DE 69205009 T DE69205009 T DE 69205009T DE 69205009 T DE69205009 T DE 69205009T DE 69205009 D1 DE69205009 D1 DE 69205009D1
Authority
DE
Germany
Prior art keywords
coating
machine
carried
cathode sputtering
target arrangement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69205009T
Other languages
English (en)
Other versions
DE69205009T2 (de
Inventor
Frank Shinneman
Steven Hurwitt
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Materials Research Corp
Original Assignee
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Materials Research Corp filed Critical Materials Research Corp
Application granted granted Critical
Publication of DE69205009D1 publication Critical patent/DE69205009D1/de
Publication of DE69205009T2 publication Critical patent/DE69205009T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3414—Targets
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Manufacturing Optical Record Carriers (AREA)
DE69205009T 1991-11-13 1992-11-12 Verfahren und Vorrichtung für Beschichtung mittels Katodenzerstäubung mit Verwendung Maschine-lesbarer Indizes von Target-Anordnung getragen worden. Expired - Fee Related DE69205009T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/791,415 US5284561A (en) 1991-11-13 1991-11-13 Method and apparatus for sputter coating employing machine readable indicia carried by target assembly
PCT/US1992/009807 WO1993010276A1 (en) 1991-11-13 1992-11-12 Method and apparatus for sputter coating employing machine readable indicia carried by target assembly

Publications (2)

Publication Number Publication Date
DE69205009D1 true DE69205009D1 (de) 1995-10-26
DE69205009T2 DE69205009T2 (de) 1996-05-30

Family

ID=25153645

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69205009T Expired - Fee Related DE69205009T2 (de) 1991-11-13 1992-11-12 Verfahren und Vorrichtung für Beschichtung mittels Katodenzerstäubung mit Verwendung Maschine-lesbarer Indizes von Target-Anordnung getragen worden.

Country Status (8)

Country Link
US (2) US5284561A (de)
EP (1) EP0612358B1 (de)
KR (1) KR100284214B1 (de)
AU (1) AU3135693A (de)
CA (1) CA2122720A1 (de)
DE (1) DE69205009T2 (de)
TW (1) TW238340B (de)
WO (1) WO1993010276A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5284561A (en) * 1991-11-13 1994-02-08 Materials Research Corporation Method and apparatus for sputter coating employing machine readable indicia carried by target assembly
US5490914A (en) * 1995-02-14 1996-02-13 Sony Corporation High utilization sputtering target for cathode assembly
US6689254B1 (en) 1990-10-31 2004-02-10 Tokyo Electron Limited Sputtering apparatus with isolated coolant and sputtering target therefor
US5721263A (en) * 1993-06-07 1998-02-24 Takeda Chemical Industries, Ltd. Pharmaceutical composition for angiotensin II-mediated diseases
US6221217B1 (en) * 1995-07-10 2001-04-24 Cvc, Inc. Physical vapor deposition system having reduced thickness backing plate
US6416635B1 (en) 1995-07-24 2002-07-09 Tokyo Electron Limited Method and apparatus for sputter coating with variable target to substrate spacing
US5830336A (en) * 1995-12-05 1998-11-03 Minnesota Mining And Manufacturing Company Sputtering of lithium
US5846389A (en) * 1997-05-14 1998-12-08 Sony Corporation Sputtering target protection device
US6348113B1 (en) 1998-11-25 2002-02-19 Cabot Corporation High purity tantalum, products containing the same, and methods of making the same
JP2000169961A (ja) * 1998-12-02 2000-06-20 Matsushita Electric Ind Co Ltd スパッタ装置
DE19939774C2 (de) * 1999-08-21 2001-06-28 Rofin Sinar Laser Gmbh Festkörperlaser (Scheibenlaser) mit direktem Kontakt des aktiven Mediums zu einer Kühlmittelflüssigkeit
US6350317B1 (en) 1999-12-30 2002-02-26 Lam Research Corporation Linear drive system for use in a plasma processing system
US9782949B2 (en) 2008-05-30 2017-10-10 Corning Incorporated Glass laminated articles and layered articles
DE102014000030A1 (de) * 2014-01-05 2015-07-09 Oerlikon Trading Ag Überwachungsmethode zur richtigen Bestückung von Beschichtungsanlagen
KR102306695B1 (ko) * 2014-03-14 2021-09-28 어플라이드 머티어리얼스, 인코포레이티드 스마트 챔버 및 스마트 챔버 컴포넌트들
TW201544615A (zh) * 2014-05-30 2015-12-01 Tosoh Smd Inc 射頻辨識金屬內安裝以及用於濺鍍標靶之隔離
US10896812B2 (en) 2017-01-25 2021-01-19 Materion Corporation Sputtering target having RFID information
BE1027175B1 (nl) * 2019-04-05 2020-11-03 Soleras Advanced Coatings Bv Magneetstaaf met aangehechte sensor
DE102020128802A1 (de) 2020-11-02 2022-05-05 VON ARDENNE Asset GmbH & Co. KG Verfahren, Steuervorrichtung und Speichermedium

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4166783A (en) * 1978-04-17 1979-09-04 Varian Associates, Inc. Deposition rate regulation by computer control of sputtering systems
US4508612A (en) * 1984-03-07 1985-04-02 International Business Machines Corporation Shield for improved magnetron sputter deposition into surface recesses
FR2600450B1 (fr) * 1986-06-19 1988-08-26 Pechiney Aluminium Procede de marquage individuel des anodes precuites pour la production electrolytique d'aluminium
US4902398A (en) * 1988-04-27 1990-02-20 American Thim Film Laboratories, Inc. Computer program for vacuum coating systems
US5130005A (en) * 1990-10-31 1992-07-14 Materials Research Corporation Magnetron sputter coating method and apparatus with rotating magnet cathode
US4957605A (en) * 1989-04-17 1990-09-18 Materials Research Corporation Method and apparatus for sputter coating stepped wafers
US5126028A (en) * 1989-04-17 1992-06-30 Materials Research Corporation Sputter coating process control method and apparatus
US5009765A (en) * 1990-05-17 1991-04-23 Tosoh Smd, Inc. Sputter target design
US5284561A (en) * 1991-11-13 1994-02-08 Materials Research Corporation Method and apparatus for sputter coating employing machine readable indicia carried by target assembly

Also Published As

Publication number Publication date
EP0612358B1 (de) 1995-09-20
DE69205009T2 (de) 1996-05-30
US5449445A (en) 1995-09-12
EP0612358A1 (de) 1994-08-31
US5284561A (en) 1994-02-08
JPH07501105A (ja) 1995-02-02
AU3135693A (en) 1993-06-15
CA2122720A1 (en) 1993-05-27
WO1993010276A1 (en) 1993-05-27
TW238340B (de) 1995-01-11
KR100284214B1 (ko) 2001-03-02

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee