DE68916516T2 - Triplate-Streifenleitung. - Google Patents

Triplate-Streifenleitung.

Info

Publication number
DE68916516T2
DE68916516T2 DE1989616516 DE68916516T DE68916516T2 DE 68916516 T2 DE68916516 T2 DE 68916516T2 DE 1989616516 DE1989616516 DE 1989616516 DE 68916516 T DE68916516 T DE 68916516T DE 68916516 T2 DE68916516 T2 DE 68916516T2
Authority
DE
Germany
Prior art keywords
triplate stripline
triplate
stripline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE1989616516
Other languages
English (en)
Other versions
DE68916516D1 (de
Inventor
Jean-Francois Beauferey
Remy Herbert
Reynier Patrick
F- Saint Pierre Des Co Patrick
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Commissariat a lEnergie Atomique et aux Energies Alternatives CEA
Original Assignee
Commissariat a lEnergie Atomique CEA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Commissariat a lEnergie Atomique CEA filed Critical Commissariat a lEnergie Atomique CEA
Application granted granted Critical
Publication of DE68916516D1 publication Critical patent/DE68916516D1/de
Publication of DE68916516T2 publication Critical patent/DE68916516T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0237High frequency adaptations
    • H05K1/024Dielectric details, e.g. changing the dielectric material around a transmission line
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0393Flexible materials
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0137Materials
    • H05K2201/015Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/46Manufacturing multilayer circuits
    • H05K3/4644Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676Single layer compositions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Insulated Conductors (AREA)
DE1989616516 1988-11-23 1989-11-21 Triplate-Streifenleitung. Expired - Fee Related DE68916516T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8815271A FR2639505A1 (fr) 1988-11-23 1988-11-23 Circuit imprime perfectionne

Publications (2)

Publication Number Publication Date
DE68916516D1 DE68916516D1 (de) 1994-08-04
DE68916516T2 true DE68916516T2 (de) 1995-01-05

Family

ID=9372155

Family Applications (1)

Application Number Title Priority Date Filing Date
DE1989616516 Expired - Fee Related DE68916516T2 (de) 1988-11-23 1989-11-21 Triplate-Streifenleitung.

Country Status (3)

Country Link
EP (1) EP0370898B1 (de)
DE (1) DE68916516T2 (de)
FR (1) FR2639505A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2922407B1 (fr) * 2007-10-15 2012-06-15 Porcher Ind Materiaux pour la realisation de dispositifs electroniques ou electriques

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3767470A (en) * 1968-02-19 1973-10-23 F Hines Thermally compensated heat flow sensors
FR2118246A5 (de) * 1970-12-15 1972-07-28 Thomson Csf
EP0016952B1 (de) * 1979-04-06 1983-01-19 International Business Machines Corporation Verfahren zum Herstellen von mit Abdeckungen versehenen Leiterplatten
FR2551618B1 (fr) * 1983-09-02 1989-12-01 Inf Milit Spatiale Aeronaut Procede de fabrication d'un circuit imprime a couches enterrees et circuit imprime obtenu par un tel procede
US4707671A (en) * 1985-05-31 1987-11-17 Junkosha Co., Ltd. Electrical transmission line

Also Published As

Publication number Publication date
EP0370898B1 (de) 1994-06-29
FR2639505A1 (fr) 1990-05-25
EP0370898A3 (de) 1991-05-15
DE68916516D1 (de) 1994-08-04
EP0370898A2 (de) 1990-05-30

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee