DE68916253T2 - Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff. - Google Patents

Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff.

Info

Publication number
DE68916253T2
DE68916253T2 DE68916253T DE68916253T DE68916253T2 DE 68916253 T2 DE68916253 T2 DE 68916253T2 DE 68916253 T DE68916253 T DE 68916253T DE 68916253 T DE68916253 T DE 68916253T DE 68916253 T2 DE68916253 T2 DE 68916253T2
Authority
DE
Germany
Prior art keywords
based top
performance epoxy
thermosetting bonding
top layer
bonding layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE68916253T
Other languages
English (en)
Other versions
DE68916253D1 (de
Inventor
Thomas F Gardeski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CPFilms Inc
Original Assignee
Courtaulds Performance Films Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Courtaulds Performance Films Inc filed Critical Courtaulds Performance Films Inc
Publication of DE68916253D1 publication Critical patent/DE68916253D1/de
Application granted granted Critical
Publication of DE68916253T2 publication Critical patent/DE68916253T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/18—Polyesters or polycarbonates according to C08L67/00 - C08L69/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/20—Macromolecular compounds having nitrogen in the main chain according to C08L75/00 - C08L79/00; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
    • C08L2666/14—Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
    • C08L2666/22—Macromolecular compounds not provided for in C08L2666/16 - C08L2666/20
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
    • C08L2666/28—Non-macromolecular organic substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
DE68916253T 1989-11-30 1989-11-30 Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff. Expired - Fee Related DE68916253T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP89312451A EP0436745B1 (de) 1989-11-30 1989-11-30 Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff

Publications (2)

Publication Number Publication Date
DE68916253D1 DE68916253D1 (de) 1994-07-21
DE68916253T2 true DE68916253T2 (de) 1994-11-24

Family

ID=8202864

Family Applications (1)

Application Number Title Priority Date Filing Date
DE68916253T Expired - Fee Related DE68916253T2 (de) 1989-11-30 1989-11-30 Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff.

Country Status (2)

Country Link
EP (1) EP0436745B1 (de)
DE (1) DE68916253T2 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3632964B1 (de) 2018-10-03 2022-09-28 3M Innovative Properties Company Härtbarer vorläufer einer strukturellen klebstoffzusammensetzung

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4288493A (en) * 1979-07-16 1981-09-08 Minnesota Mining And Manufacturing Company Water-activatable crosslinked adhesive and energy control film made therewith
CA1240440A (en) * 1985-04-02 1988-08-09 Madan H. Bagga Curable compositions

Also Published As

Publication number Publication date
EP0436745A1 (de) 1991-07-17
DE68916253D1 (de) 1994-07-21
EP0436745B1 (de) 1994-06-15

Similar Documents

Publication Publication Date Title
KR860005864A (ko) 접착제 합성물
DE68902340D1 (de) Klebemasse.
DE68912910T2 (de) Festklebender Schutzkragen.
DE3864484D1 (de) Modifizierte epoxidharze.
DE59207136D1 (de) Direktes substratbonden
DE3579978D1 (de) Klebstoffharze und beschichtete gegenstaende.
DE58907670D1 (de) Modifizierte Epoxidharze.
DE3851098D1 (de) Haftmittel.
KR900700518A (ko) 개질된 에폭시 수지
DE68920160T2 (de) Klebstoffmischungen und Laminate.
DE3872552D1 (de) In der elektronik verwendbare epoxydharzklebschicht.
NO862578D0 (no) Gasstett laminat.
DE58904705D1 (de) Vorgelierbarer klebstoff.
KR860005093A (ko) 표층상의 부착성 라벨
DE3789329T2 (de) Verbundstoff-Teilchen aus Akrylharz.
DE68920086T2 (de) Hitzehärtbare Epoxidharz-Zusammensetzung.
DE68920062D1 (de) Wärmehärtbare Epoxydharzzusammensetzung.
DE3852687D1 (de) Phenolmodifizierter Epoxydharzklebstoff.
DE68910674D1 (de) Behandelbares polyimid-klebemittel und matrizen-kompositharz.
DE68927692D1 (de) Harzlaminate
DE59105383D1 (de) Heisshärtbarer Klebstoff.
ATA106389A (de) Klebstoff
DE68916253D1 (de) Hochleistungs-Deckschicht auf Epoxyd-Basis und wärmehärtbarer Bindungsschichtklebstoff.
ATA141686A (de) Schichtverleimter werkstoff
KR900702593A (ko) 안테나 어셈블리 및 그 적층 접합방법

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee