DE60315170D1 - METHOD FOR PRE-TREATING A SURFACE OF A NON-LEADING MATERIAL TO BE COATED WITH METAL - Google Patents
METHOD FOR PRE-TREATING A SURFACE OF A NON-LEADING MATERIAL TO BE COATED WITH METALInfo
- Publication number
- DE60315170D1 DE60315170D1 DE60315170T DE60315170T DE60315170D1 DE 60315170 D1 DE60315170 D1 DE 60315170D1 DE 60315170 T DE60315170 T DE 60315170T DE 60315170 T DE60315170 T DE 60315170T DE 60315170 D1 DE60315170 D1 DE 60315170D1
- Authority
- DE
- Germany
- Prior art keywords
- metal
- sub
- ions
- metal ions
- sup
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1889—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/2006—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30
- C23C18/2046—Pretreatment of the material to be coated of organic surfaces, e.g. resins by other methods than those of C23C18/22 - C23C18/30 by chemical pretreatment
- C23C18/2073—Multistep pretreatment
- C23C18/208—Multistep pretreatment with use of metal first
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/285—Sensitising or activating with tin based compound or composition
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/28—Sensitising or activating
- C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Abstract
A method for pretreating a surface of a non-conducting material to be plated through precipitation of metal where an adsorbing metal oxide is initially deposited, such as MnO<SUB>2 </SUB>or Fe<SUB>2</SUB>O<SUB>3 </SUB>on the surface, whereafter said surface is treated with a solution of transition metal ions, such as Sn<SUP>++</SUP> ions, and then with a solution of metal ions of a catalytic metal catalyzing chemical plating, such as a metal of the platinum group. The transition metal ions used are selected among such ions that can reduce catalytic metal ions into catalytic metal. The method renders it possible to plate non-conducting materials, such as plastic materials, which cannot or only with great difficulty can be plated by a conventional activation by means of colloidal palladium.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DK200201429A DK175025B1 (en) | 2002-09-26 | 2002-09-26 | Process for pretreating a surface of a non-conductive material to be plated |
PCT/DK2003/000617 WO2004029327A1 (en) | 2002-09-26 | 2003-09-23 | Method for pretreating a surface of a non-conducting material to be plated |
Publications (1)
Publication Number | Publication Date |
---|---|
DE60315170D1 true DE60315170D1 (en) | 2007-09-06 |
Family
ID=32039054
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60315170T Expired - Lifetime DE60315170D1 (en) | 2002-09-26 | 2003-09-23 | METHOD FOR PRE-TREATING A SURFACE OF A NON-LEADING MATERIAL TO BE COATED WITH METAL |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060000720A1 (en) |
EP (1) | EP1546435B1 (en) |
AT (1) | ATE368136T1 (en) |
AU (1) | AU2003266486A1 (en) |
DE (1) | DE60315170D1 (en) |
DK (1) | DK175025B1 (en) |
WO (1) | WO2004029327A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6900236B1 (en) | 1999-10-18 | 2005-05-31 | University Of Connecticut | Cannabimimetic indole derivatives |
US20050199587A1 (en) * | 2004-03-12 | 2005-09-15 | Jon Bengston | Non-chrome plating on plastic |
DE102010021553A1 (en) | 2010-05-21 | 2011-11-24 | Siemens Aktiengesellschaft | Component with a catalytic surface, process for its preparation and use of this component |
DE102010021554A1 (en) | 2010-05-21 | 2011-11-24 | Siemens Aktiengesellschaft | Component with a catalytic surface, process for its preparation and use of this component |
CN111519226A (en) * | 2020-06-05 | 2020-08-11 | 麦德美科技(苏州)有限公司 | Polyetherimide chemical roughening electroplating process |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579428A (en) * | 1967-09-30 | 1971-05-18 | Mitsubishi Petrochemical Co | Method of manufacturing plated polypropylene shaped articles |
GB1404855A (en) * | 1971-07-28 | 1975-09-03 | Mitsui Mining & Smelting Co | Catalytic purification of exhaust gases |
GB1401600A (en) * | 1972-12-13 | 1975-07-16 | Kollmorgen Corp | Composition and process for the activation of resinous bodies for adherent metallization |
US4073740A (en) * | 1975-06-18 | 1978-02-14 | Kollmorgen Technologies Corporation | Composition for the activation of resinous bodies for adherent metallization |
DE3816494A1 (en) * | 1988-05-10 | 1989-11-16 | Schering Ag | SOLUTION AND METHOD FOR THE AETZING AND ACTIVATION OF INSULATED SURFACES |
US5078889A (en) * | 1989-02-28 | 1992-01-07 | Csa Division, Lake Industries, Inc. | Selective removal of contaminants from water sources using inorganic media |
US4999251A (en) * | 1989-04-03 | 1991-03-12 | General Electric Company | Method for treating polyetherimide substrates and articles obtained therefrom |
DE3928435A1 (en) * | 1989-08-24 | 1991-02-28 | Schering Ag | METHOD FOR DIRECTLY METALLIZING A NON-CONDUCTIVE SUBSTRATE |
US5693209A (en) * | 1989-09-14 | 1997-12-02 | Atotech Deutschland Gmbh | Process for metallization of a nonconductor surface |
US5648125A (en) * | 1995-11-16 | 1997-07-15 | Cane; Frank N. | Electroless plating process for the manufacture of printed circuit boards |
-
2002
- 2002-09-26 DK DK200201429A patent/DK175025B1/en not_active IP Right Cessation
-
2003
- 2003-09-23 WO PCT/DK2003/000617 patent/WO2004029327A1/en active IP Right Grant
- 2003-09-23 AU AU2003266486A patent/AU2003266486A1/en not_active Abandoned
- 2003-09-23 DE DE60315170T patent/DE60315170D1/en not_active Expired - Lifetime
- 2003-09-23 EP EP03798083A patent/EP1546435B1/en not_active Expired - Lifetime
- 2003-09-23 US US10/529,467 patent/US20060000720A1/en not_active Abandoned
- 2003-09-23 AT AT03798083T patent/ATE368136T1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP1546435B1 (en) | 2007-07-25 |
DK175025B1 (en) | 2004-05-03 |
WO2004029327A1 (en) | 2004-04-08 |
DK200201429A (en) | 2004-03-27 |
EP1546435A1 (en) | 2005-06-29 |
ATE368136T1 (en) | 2007-08-15 |
US20060000720A1 (en) | 2006-01-05 |
AU2003266486A1 (en) | 2004-04-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8332 | No legal effect for de |