DE602004007573D1 - A method of preventing deposits of contaminant particles on the surface of a microcomponent, microcompartment storage device, and thin film deposition apparatus - Google Patents
A method of preventing deposits of contaminant particles on the surface of a microcomponent, microcompartment storage device, and thin film deposition apparatusInfo
- Publication number
- DE602004007573D1 DE602004007573D1 DE602004007573T DE602004007573T DE602004007573D1 DE 602004007573 D1 DE602004007573 D1 DE 602004007573D1 DE 602004007573 T DE602004007573 T DE 602004007573T DE 602004007573 T DE602004007573 T DE 602004007573T DE 602004007573 D1 DE602004007573 D1 DE 602004007573D1
- Authority
- DE
- Germany
- Prior art keywords
- microcomponent
- storage device
- particles
- microcompartment
- contaminant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002245 particle Substances 0.000 title abstract 7
- 239000000356 contaminant Substances 0.000 title abstract 5
- 238000000034 method Methods 0.000 title abstract 3
- 238000000427 thin-film deposition Methods 0.000 title 1
- 239000000463 material Substances 0.000 abstract 2
- 238000005507 spraying Methods 0.000 abstract 2
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 230000008021 deposition Effects 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/4401—Means for minimising impurities, e.g. dust, moisture or residual gas, in the reaction chamber
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/134—Plasma spraying
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- General Chemical & Material Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacturing Of Magnetic Record Carriers (AREA)
Abstract
Preventing the deposition of polarized particles (7) from a contaminant source (5) on the surface of a microcomponent in a vacuum chamber (3) comprises spraying a beam (8) of oppositely polarized particles between the contaminant source and the microcomponent to entrain the contaminant particles away from the microcomponent to a collector (10). Independent claims are also included for the following: (1) a storage device comprising a vacuum chamber containing a microcomponent and, for carrying out the above process, a source emitting the beam of oppositely polarized particles parallel to and close to the surface of the microcomponent; and (2) a thin layer coating device comprising a vacuum chamber containing a microcomponent substrate (2) and a device for spraying a stream of material (6) for forming a thin layer on the surface of the microcomponent and, for carrying out the above process, a source emitting the beam of oppositely polarized particles in the direction of the stream of material so as to entrain the contaminant particles in the stream away from the microcomponent.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0305169A FR2854169B1 (en) | 2003-04-28 | 2003-04-28 | PROCESS FOR PREVENTING DEPOSITION OF CONTAMINANT PARTICLES ON THE SURFACE OF A MICRO COMPONENT, DEVICE FOR STORING A MICRO COMPONENT, AND DEVICE FOR DEPOSITING THIN LAYERS |
FR0305169 | 2003-04-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE602004007573D1 true DE602004007573D1 (en) | 2007-08-30 |
DE602004007573T2 DE602004007573T2 (en) | 2008-04-17 |
Family
ID=32982313
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE602004007573T Expired - Lifetime DE602004007573T2 (en) | 2003-04-28 | 2004-04-02 | A method of preventing deposits of contaminant particles on the surface of a microcomponent, microcompartment storage device, and thin film deposition apparatus |
Country Status (6)
Country | Link |
---|---|
US (1) | US20050051421A1 (en) |
EP (1) | EP1473381B1 (en) |
JP (1) | JP4597565B2 (en) |
AT (1) | ATE367457T1 (en) |
DE (1) | DE602004007573T2 (en) |
FR (1) | FR2854169B1 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6972420B2 (en) * | 2004-04-28 | 2005-12-06 | Intel Corporation | Atomic beam to protect a reticle |
CN101681114B (en) | 2007-06-12 | 2013-05-08 | 皇家飞利浦电子股份有限公司 | Optical device and method of in situ treating an EUV optical component to enhance a reduced reflectivity |
US8084757B2 (en) * | 2008-01-17 | 2011-12-27 | Applied Materials, Inc. | Contamination prevention in extreme ultraviolet lithography |
KR20210091345A (en) | 2018-12-10 | 2021-07-21 | 어플라이드 머티어리얼스, 인코포레이티드 | Removal of adhesion features from photomasks in extreme ultraviolet lithography applications |
KR20210118198A (en) * | 2019-02-11 | 2021-09-29 | 어플라이드 머티어리얼스, 인코포레이티드 | Method for Particle Removal from Wafers via Plasma Modification in Pulsed PVD |
KR102467650B1 (en) * | 2021-11-16 | 2022-11-21 | 덕우세미텍 주식회사 | Apparatus for blocking particle transfer and lothography using charged beam in vacuum system |
KR20230143794A (en) * | 2022-04-06 | 2023-10-13 | 덕우세미텍 주식회사 | Lithography apparatus using charged beam in vacuum system |
KR20230143795A (en) * | 2022-04-06 | 2023-10-13 | 덕우세미텍 주식회사 | Apparatus for blocking particle transfer and lithography using charged beam in vacuum system having electrostatic trap |
KR20230174666A (en) * | 2022-06-21 | 2023-12-28 | 덕우세미텍 주식회사 | An electric potenrial barrier module and a lithography apparatus including the same |
KR20230174667A (en) * | 2022-06-21 | 2023-12-28 | 덕우세미텍 주식회사 | An electric potenrial barrier module with heat transfer prevenstion function and a lithography apparatus including the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4392453A (en) * | 1981-08-26 | 1983-07-12 | Varian Associates, Inc. | Molecular beam converters for vacuum coating systems |
US5366559A (en) * | 1993-05-27 | 1994-11-22 | Research Triangle Institute | Method for protecting a substrate surface from contamination using the photophoretic effect |
JPH0729832A (en) * | 1993-07-15 | 1995-01-31 | Sony Corp | Method and system for depositing film |
JPH07291790A (en) * | 1994-04-15 | 1995-11-07 | Nippon Steel Corp | Molecular beam epitaxy apparatus |
JP3503787B2 (en) * | 1996-01-22 | 2004-03-08 | 貢 英 | Thin film formation method |
JP3874397B2 (en) * | 2000-07-11 | 2007-01-31 | 株式会社荏原製作所 | Method and apparatus for forming film on substrate |
US20040055871A1 (en) * | 2002-09-25 | 2004-03-25 | The Regents Of The University Of California | Use of ion beams for protecting substrates from particulate defect contamination in ultra-low-defect coating processes |
-
2003
- 2003-04-28 FR FR0305169A patent/FR2854169B1/en not_active Expired - Fee Related
-
2004
- 2004-04-02 DE DE602004007573T patent/DE602004007573T2/en not_active Expired - Lifetime
- 2004-04-02 EP EP04354017A patent/EP1473381B1/en not_active Expired - Lifetime
- 2004-04-02 AT AT04354017T patent/ATE367457T1/en not_active IP Right Cessation
- 2004-04-05 US US10/816,911 patent/US20050051421A1/en not_active Abandoned
- 2004-04-28 JP JP2004134234A patent/JP4597565B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2854169B1 (en) | 2005-06-10 |
US20050051421A1 (en) | 2005-03-10 |
EP1473381A1 (en) | 2004-11-03 |
JP2004332115A (en) | 2004-11-25 |
EP1473381B1 (en) | 2007-07-18 |
JP4597565B2 (en) | 2010-12-15 |
DE602004007573T2 (en) | 2008-04-17 |
ATE367457T1 (en) | 2007-08-15 |
FR2854169A1 (en) | 2004-10-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |