DE60128118D1 - POLYPHENOL RESIN, METHOD FOR THE PRODUCTION THEREOF, EPOXY RESIN COMPOSITION AND ITS USE - Google Patents

POLYPHENOL RESIN, METHOD FOR THE PRODUCTION THEREOF, EPOXY RESIN COMPOSITION AND ITS USE

Info

Publication number
DE60128118D1
DE60128118D1 DE60128118T DE60128118T DE60128118D1 DE 60128118 D1 DE60128118 D1 DE 60128118D1 DE 60128118 T DE60128118 T DE 60128118T DE 60128118 T DE60128118 T DE 60128118T DE 60128118 D1 DE60128118 D1 DE 60128118D1
Authority
DE
Germany
Prior art keywords
production
polyphenol
resin composition
epoxy resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE60128118T
Other languages
German (de)
Other versions
DE60128118T2 (en
Inventor
Yasumasa Akatsuka
Toyofumi Asano
Masahiro Imaizumi
Katsuhiko Oshimi
Syouichi Tomida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Kayaku Co Ltd
Original Assignee
Nippon Kayaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Kayaku Co Ltd filed Critical Nippon Kayaku Co Ltd
Application granted granted Critical
Publication of DE60128118D1 publication Critical patent/DE60128118D1/en
Publication of DE60128118T2 publication Critical patent/DE60128118T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00—Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/04—Condensation polymers of aldehydes or ketones with phenols only of aldehydes
    • C08G8/08—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ
    • C08G8/10—Condensation polymers of aldehydes or ketones with phenols only of aldehydes of formaldehyde, e.g. of formaldehyde formed in situ with phenol
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
DE2001628118 2000-10-05 2001-10-03 POLYPHENOL RESIN, METHOD FOR THE PRODUCTION THEREOF, EPOXY RESIN COMPOSITION AND ITS USE Expired - Fee Related DE60128118T2 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2000305854 2000-10-05
JP2000305854 2000-10-05
JP2000377920 2000-12-12
JP2000377920 2000-12-12
PCT/JP2001/008693 WO2002028940A1 (en) 2000-10-05 2001-10-03 Polyphenol resin, process for its production, epoxy resin composition and its use

Publications (2)

Publication Number Publication Date
DE60128118D1 true DE60128118D1 (en) 2007-06-06
DE60128118T2 DE60128118T2 (en) 2007-08-30

Family

ID=26601592

Family Applications (1)

Application Number Title Priority Date Filing Date
DE2001628118 Expired - Fee Related DE60128118T2 (en) 2000-10-05 2001-10-03 POLYPHENOL RESIN, METHOD FOR THE PRODUCTION THEREOF, EPOXY RESIN COMPOSITION AND ITS USE

Country Status (6)

Country Link
US (2) US6723801B2 (en)
EP (1) EP1323761B1 (en)
KR (1) KR100750998B1 (en)
DE (1) DE60128118T2 (en)
TW (2) TWI287554B (en)
WO (1) WO2002028940A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI287554B (en) * 2000-10-05 2007-10-01 Nippon Kayaku Kk Sheet made of epoxy resin composition and cured product thereof
JP4240448B2 (en) * 2002-08-22 2009-03-18 三井金属鉱業株式会社 Method for producing multilayer printed wiring board using copper foil with resin layer
TW200415197A (en) * 2002-10-03 2004-08-16 Nippon Kayaku Kk Epoxy resin composition for optical semiconductor package
CA2544368C (en) * 2003-11-04 2014-04-01 Chiron Corporation Methods of therapy for b cell-related cancers
US20080200636A1 (en) * 2005-02-25 2008-08-21 Masataka Nakanishi Epoxy Resin, Hardenable Resin Composition Containing the Same and Use Thereof
US7968672B2 (en) * 2005-11-30 2011-06-28 Nippon Kayaku Kabushiki Kaisha Phenolic resin, process for production thereof, epoxy resin, and use thereof
MY148755A (en) * 2007-03-23 2013-05-31 Sumitomo Bakelite Co Semiconductor-encapsulating resin composition and semiconductor device
TW200842135A (en) * 2007-04-23 2008-11-01 Chang Chun Plastics Co Ltd Flame retardant resin composition
CA2721073A1 (en) * 2008-04-10 2009-10-15 Karl Christopher Hansen Simple-to-use optical wireless remote control
KR100995683B1 (en) 2008-06-30 2010-11-22 주식회사 코오롱 Epoxy resin, preparing method of the same and its usage
JP5716033B2 (en) * 2009-11-06 2015-05-13 スリーエム イノベイティブ プロパティズ カンパニー Dielectric material having non-halogenated curing agent
CN101722694A (en) * 2009-11-17 2010-06-09 丹阳市永和电器科技有限公司 High-Tg high-thermal conductivity aluminium-based copper-clad laminate
EP2516345B1 (en) * 2009-12-21 2020-08-12 Soiltec GmbH Composite pavement structure
CN103717635B (en) * 2011-07-19 2016-01-20 松下知识产权经营株式会社 Resin combination, resinous varnish, prepreg, metal-coated laminated board and printed-wiring board (PWB)
KR102497115B1 (en) * 2020-11-06 2023-02-07 송원산업 주식회사 Phenolin novolac resin and process for production thereof

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3042655A (en) * 1960-01-22 1962-07-03 American Viscose Corp Novolak and method of manufacture thereof
US4492730A (en) * 1982-03-26 1985-01-08 Showa Denko Kabushiki Kaisha Substrate of printed circuit
JP2866747B2 (en) * 1990-12-21 1999-03-08 三井化学株式会社 Method for producing phenolic polymer
EP0506080B1 (en) * 1991-03-29 1997-02-12 Dainippon Ink And Chemicals, Inc. Epoxy resin hardener and epoxy resin composition
JP3479812B2 (en) * 1994-01-25 2003-12-15 信越化学工業株式会社 Epoxy resin composition and semiconductor device
TW350857B (en) * 1994-09-20 1999-01-21 Ube Industries Phenol novolak condensate and the uses thereof
JP3122834B2 (en) * 1994-09-20 2001-01-09 明和化成株式会社 New phenol novolak condensate
JP3190044B2 (en) * 1995-04-04 2001-07-16 日立化成工業株式会社 Adhesive, adhesive film and metal foil with adhesive
JPH09143345A (en) * 1995-11-27 1997-06-03 Sumitomo Bakelite Co Ltd Epoxy resin composition
JP3622937B2 (en) * 1995-12-28 2005-02-23 住友ベークライト株式会社 Resin composition for semiconductor encapsulation
JPH10251362A (en) * 1997-03-11 1998-09-22 Nippon Kayaku Co Ltd Novolak type resin, epoxy resin, epoxy resin composition and cured product thereof
JP3604866B2 (en) * 1997-05-13 2004-12-22 明和化成株式会社 Method for producing phenol-novolak condensate
JPH11147998A (en) * 1997-11-19 1999-06-02 Sumitomo Bakelite Co Ltd Epoxy resin composition and semiconductor device
JP3414340B2 (en) * 1998-12-15 2003-06-09 日本電気株式会社 Flame retardant resin material and flame retardant resin composition
JP2001055431A (en) * 1999-08-19 2001-02-27 Shin Etsu Chem Co Ltd Epoxy resin composition for sealing semiconductor and semiconductor device
JP3460820B2 (en) * 1999-12-08 2003-10-27 日本電気株式会社 Flame retardant epoxy resin composition
TWI287554B (en) * 2000-10-05 2007-10-01 Nippon Kayaku Kk Sheet made of epoxy resin composition and cured product thereof

Also Published As

Publication number Publication date
DE60128118T2 (en) 2007-08-30
TWI287554B (en) 2007-10-01
WO2002028940A1 (en) 2002-04-11
EP1323761B1 (en) 2007-04-25
US20040166326A1 (en) 2004-08-26
US20030009001A1 (en) 2003-01-09
TWI287553B (en) 2007-10-01
KR100750998B1 (en) 2007-08-22
KR20020063199A (en) 2002-08-01
EP1323761A4 (en) 2005-02-09
EP1323761A1 (en) 2003-07-02
US6723801B2 (en) 2004-04-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee