DE59801648D1 - DEVICE AND METHOD FOR COOLING A PLANAR INDUCTIVITY - Google Patents
DEVICE AND METHOD FOR COOLING A PLANAR INDUCTIVITYInfo
- Publication number
- DE59801648D1 DE59801648D1 DE59801648T DE59801648T DE59801648D1 DE 59801648 D1 DE59801648 D1 DE 59801648D1 DE 59801648 T DE59801648 T DE 59801648T DE 59801648 T DE59801648 T DE 59801648T DE 59801648 D1 DE59801648 D1 DE 59801648D1
- Authority
- DE
- Germany
- Prior art keywords
- inductivity
- planar
- cooling
- planar inductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/08—Cooling; Ventilating
- H01F27/22—Cooling by heat conduction through solid or powdered fillings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/08—Magnetic details
- H05K2201/083—Magnetic materials
- H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09054—Raised area or protrusion of metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09745—Recess in conductor, e.g. in pad or in metallic substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1056—Metal over component, i.e. metal plate over component mounted on or embedded in PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dc-Dc Converters (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19722204 | 1997-05-27 | ||
DE19740283 | 1997-09-13 | ||
DE19808592A DE19808592C2 (en) | 1997-05-27 | 1998-02-28 | Device for cooling a planar inductance |
PCT/EP1998/003104 WO1998054735A1 (en) | 1997-05-27 | 1998-05-27 | Device and method for cooling a planar inductor |
Publications (1)
Publication Number | Publication Date |
---|---|
DE59801648D1 true DE59801648D1 (en) | 2001-11-08 |
Family
ID=26036898
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19808592A Expired - Fee Related DE19808592C2 (en) | 1997-05-27 | 1998-02-28 | Device for cooling a planar inductance |
DE59801648T Expired - Fee Related DE59801648D1 (en) | 1997-05-27 | 1998-05-27 | DEVICE AND METHOD FOR COOLING A PLANAR INDUCTIVITY |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19808592A Expired - Fee Related DE19808592C2 (en) | 1997-05-27 | 1998-02-28 | Device for cooling a planar inductance |
Country Status (1)
Country | Link |
---|---|
DE (2) | DE19808592C2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1999062105A2 (en) * | 1998-05-28 | 1999-12-02 | Rompower Inc. | A package for power converters with improved transformer operations |
DE102005008521A1 (en) | 2005-02-24 | 2006-08-31 | OCé PRINTING SYSTEMS GMBH | Arrangement and method for cooling a power semiconductor |
JP5552661B2 (en) | 2011-10-18 | 2014-07-16 | 株式会社豊田自動織機 | Induction equipment |
DE102012106135A1 (en) * | 2012-07-09 | 2014-05-22 | Cryoelectra Gmbh | Baluns for use in amplifier unit of high frequency amplifier of e.g. base station of radio system, have layered structure provided with underside that is connected to temperature heat sink element directly or indirectly over metallic layer |
DE102013226066A1 (en) * | 2013-12-16 | 2015-06-18 | Siemens Aktiengesellschaft | Planar transformer and electrical component |
DE102015011666A1 (en) | 2015-09-11 | 2017-03-16 | Leopold Kostal Gmbh & Co. Kg | planar inductor |
DE102016211085A1 (en) * | 2016-06-22 | 2017-12-28 | Zf Friedrichshafen Ag | Transformer device and method for producing the same |
DE102021206934A1 (en) | 2021-07-01 | 2021-11-11 | Vitesco Technologies GmbH | Power semiconductor component |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3721759A1 (en) * | 1987-07-01 | 1989-01-12 | Ceag Licht & Strom | Transformer fitted on a printed circuit board |
-
1998
- 1998-02-28 DE DE19808592A patent/DE19808592C2/en not_active Expired - Fee Related
- 1998-05-27 DE DE59801648T patent/DE59801648D1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
DE19808592A1 (en) | 1998-12-03 |
DE19808592C2 (en) | 2002-08-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |