DE50107205D1 - POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS - Google Patents

POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS

Info

Publication number
DE50107205D1
DE50107205D1 DE50107205T DE50107205T DE50107205D1 DE 50107205 D1 DE50107205 D1 DE 50107205D1 DE 50107205 T DE50107205 T DE 50107205T DE 50107205 T DE50107205 T DE 50107205T DE 50107205 D1 DE50107205 D1 DE 50107205D1
Authority
DE
Germany
Prior art keywords
polishing agent
planar layers
producing planar
producing
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE50107205T
Other languages
German (de)
Inventor
Kristina Vogt
Dietrich Pantke
Lothar Puppe
Stephan Kirchmeyer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bayer AG
Original Assignee
Bayer AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bayer AG filed Critical Bayer AG
Priority to DE50107205T priority Critical patent/DE50107205D1/en
Priority claimed from PCT/EP2001/003113 external-priority patent/WO2001074958A2/en
Application granted granted Critical
Publication of DE50107205D1 publication Critical patent/DE50107205D1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09G—POLISHING COMPOSITIONS; SKI WAXES
    • C09G1/00—Polishing compositions
    • C09G1/02—Polishing compositions containing abrasives or grinding agents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/64—Nanometer sized, i.e. from 1-100 nanometer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3105—After-treatment
    • H01L21/31051—Planarisation of the insulating layers
    • H01L21/31053—Planarisation of the insulating layers involving a dielectric removal step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
DE50107205T 2000-03-31 2001-03-19 POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS Expired - Fee Related DE50107205D1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE50107205T DE50107205D1 (en) 2000-03-31 2001-03-19 POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DE10016020 2000-03-31
DE10063870A DE10063870A1 (en) 2000-03-31 2000-12-21 Polishing agent and method for producing planar layers
DE50107205T DE50107205D1 (en) 2000-03-31 2001-03-19 POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS
PCT/EP2001/003113 WO2001074958A2 (en) 2000-03-31 2001-03-19 Polishing agent and method for producing planar layers

Publications (1)

Publication Number Publication Date
DE50107205D1 true DE50107205D1 (en) 2005-09-29

Family

ID=7637106

Family Applications (2)

Application Number Title Priority Date Filing Date
DE10063870A Withdrawn DE10063870A1 (en) 2000-03-31 2000-12-21 Polishing agent and method for producing planar layers
DE50107205T Expired - Fee Related DE50107205D1 (en) 2000-03-31 2001-03-19 POLISHING AGENT AND METHOD FOR PRODUCING PLANAR LAYERS

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE10063870A Withdrawn DE10063870A1 (en) 2000-03-31 2000-12-21 Polishing agent and method for producing planar layers

Country Status (4)

Country Link
KR (1) KR100679198B1 (en)
DE (2) DE10063870A1 (en)
IL (1) IL151794A (en)
MY (1) MY126662A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE112010002227B4 (en) 2009-06-05 2018-11-29 Sumco Corp. Method for polishing a silicon wafer

Also Published As

Publication number Publication date
MY126662A (en) 2006-10-31
IL151794A (en) 2009-09-22
DE10063870A1 (en) 2001-10-11
KR100679198B1 (en) 2007-02-07
KR20020086942A (en) 2002-11-20

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee