DE4342633A1 - Device for removing unwanted solder from the item to be soldered in a soldering system - Google Patents

Device for removing unwanted solder from the item to be soldered in a soldering system

Info

Publication number
DE4342633A1
DE4342633A1 DE4342633A DE4342633A DE4342633A1 DE 4342633 A1 DE4342633 A1 DE 4342633A1 DE 4342633 A DE4342633 A DE 4342633A DE 4342633 A DE4342633 A DE 4342633A DE 4342633 A1 DE4342633 A1 DE 4342633A1
Authority
DE
Germany
Prior art keywords
solder
soldered
item
liquid
soldering system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE4342633A
Other languages
German (de)
Inventor
Helmut Walter Leicht
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE4342633A priority Critical patent/DE4342633A1/en
Priority to PCT/EP1994/004139 priority patent/WO1995016538A1/en
Publication of DE4342633A1 publication Critical patent/DE4342633A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0736—Methods for applying liquids, e.g. spraying
    • H05K2203/0746—Local treatment using a fluid jet, e.g. for removing or cleaning material; Providing mechanical pressure using a fluid jet
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0776—Uses of liquids not otherwise provided for in H05K2203/0759 - H05K2203/0773

Description

Die Erfindung betrifft ein Verfahren und eine Vorrichtung (Messer) zum Entfernen von überschüssigem Lot vom Lötgut in einer Lötanlage. Die Erfindung kann insbesondere bei einer Wellenlötanlage zum Einsatz kommen.The invention relates to a method and a device (Knife) for removing excess solder from the item to be soldered in a soldering system. The invention can be used in particular Wave soldering system are used.

Beim Wellenlöten kommt es bei der Ausfahrt des Lötguts (z. B. einer Leiterplatte) aus der Lotwelle (Schwall) häufig zur Entstehung von Lotperlen oder Lotbrücken, z. B. an den Pins der Bauelemente.With wave soldering, it comes to the exit of the solder (e.g. a circuit board) from the solder wave (surge) often for Formation of solder pearls or solder bridges, e.g. B. on the pins of the components.

Obwohl seit Jahrzehnten an diesem Problem gearbeitet wird, gibt es noch immer keine befriedigende Lösung für dieses Problem.Although this problem has been worked on for decades, there is still no satisfactory solution to this Problem.

Die im Stand der Technik eingesetzten Wellenlötanlagen ar­ beiten entweder auf konventioneller Basis oder mit Schutz­ gas. Je nach Einsatzfall entstehen mehr oder weniger viele Lotperlen bzw. Lotbrücken. Üblicherweise werden die Lotper­ len im Anschluß an das Löten mit Hilfe einer Reinigungsan­ lage entfernt.The wave soldering systems used in the prior art ar work either on a conventional basis or with protection gas. Depending on the application, more or fewer arise Solder pearls or solder bridges. Usually the Lotper  len after soldering with the help of a cleaning device location away.

Desweiteren sind Luftmesser (z. B. Air-Knive der Firma Excellon bzw. Hollis) bekannt, die im Anschluß an die Welle installiert sind. Mit ihrer Hilfe wird die Leiterplatte ab­ geblasen, was das Auftreten von Lotbrücken verringert.Air knives (e.g. Air Knive from the company Excellon or Hollis) known to follow the shaft are installed. With their help, the circuit board is off blown, which reduces the occurrence of solder bridges.

Der Aufwand zur nachträglichen Reinigung der Baugruppen ist verhältnismäßig hoch. Überdies entfernt eine solche Reini­ gung nur die Lotperlen aber keine Lotbrücken. Der Einsatz der Luftmesser reduziert zwar die Lotbrücken, verhindert aber nicht die Entstehung der Lotperlen.The effort for subsequent cleaning of the assemblies is relatively high. Moreover, such a Reini removes only the solder pearls but no solder bridges. The stake the air knife reduces the solder bridges, prevents but not the formation of the solder pearls.

Demgegenüber liegt der Erfindung die Aufgabe zugrunde, über­ schüssiges Lot vom Lötgut in einer Lötanlage zu entfernen, wobei die Entstehung von Lotperlen und Lotbrücken verhin­ dert, bzw. die Häufigkeit ihres Auftretens stark verringert werden soll.In contrast, the invention is based on the object to remove shot solder from the item to be soldered in a soldering system, preventing the formation of solder pearls and solder bridges changed, or the frequency of their occurrence greatly reduced shall be.

Die Aufgabe wird mit den Merkmalen der Patentansprüche ge­ löst.The task is ge with the features of the claims solves.

Bei der Lösung geht die Erfindung von dem Grundgedanken aus, eine Düse vorzusehen, die mit einer Flüssigkeit das Lötgut spült und dabei überschüssiges Lot und Flußmittelreste ent­ fernt.In the solution, the invention is based on the basic idea to provide a nozzle, which is the solder with a liquid rinses and ent excess solder and flux residues ent distant.

Als Flüssigkeit kann eine chemisch inerte Flüssigkeit, wie sie z. B. beim Dampfphasenlöten zum Einsatz kommt, verwendet werden. Die Flüssigkeit führt zu einer Veränderung der Ober­ flächenspannung des Lotes und bereits dadurch zu einer Ver­ besserung des Lotabrisses. Vor allem aber durch die Spülwir­ kung der Flüssigkeit wird die Entstehung von Lotbrücken be­ reits im Ansatz verhindert. Ebenso wird die Entstehung von Lotperlen verhindert bzw. ihre Häufigkeit stark reduziert. Außerdem kann die Flüssigkeit die Funktion einer Abdeckflüs­ sigkeit für den Schwall übernehmen, um den Sauerstoff von der Lotbadoberfläche fernzuhalten. Dadurch wird eine bedeu­ tende Verbesserung gegenüber entsprechenden Maßnahmen im Stand der Technik erreicht, wo man versucht, durch Erzeugen einer Schutzgasatmosphäre oder eines Plasmas den Sauerstoff von dem Schwall fernzuhalten, um Krätzebildung und die damit verbundenen Kosten zu vermeiden. Auch der Einsatz von ver­ schiedenen Ölen als Abdeckmittel hat sich bisher als nicht erfolgreich erwiesen.A chemically inert liquid, such as they z. B. is used in vapor phase soldering used become. The liquid leads to a change in the upper surface tension of the solder and thereby already to a ver improvement of the solder break. But above all through the dishwashing The liquid becomes the formation of solder bridges already prevented in the approach. Likewise, the emergence of Prevents solder pearls or greatly reduces their frequency. In addition, the liquid can function as a cover  for the surge to take the oxygen from keep away from the solder bath surface. This makes a meaning continuous improvement over corresponding measures in State of the art achieved where one tries by creating a protective gas atmosphere or a plasma the oxygen to keep away from the gush in order to create scabies and so on avoid associated costs. The use of ver Different oils as cover agents have so far not been found successfully proven.

Im folgenden wird die Erfindung anhand der einzigen Fig. 1 näher erläutert, die eine schematische Darstellung der er­ findungsgemäßen Vorrichtung in drei Ausführungsformen in einer Wellenlötanlage zeigt.In the following the invention is explained in more detail with reference to the single Fig. 1, which shows a schematic representation of the inventive device in three embodiments in a wave soldering system.

Ein Lotschwall 3 wird an die Unterseite des sich in Richtung des Pfeiles A bewegenden Lötguts 2 (z. B. eine elektrische Baugruppe) geleitet. In einer ersten Ausführungsform ist eine Düse 1 im Schwall 3 angeordnet, die eine Flüssigkeit zur Leiterplatte 2 fördert. Die aus der Düse 1 ausströmende Flüssigkeit benetzt das Lötgut dort, wo der Lotabriß von dem Lötgut (Leiterplatte) stattfindet.A solder surge 3 is conducted to the underside of the solder 2 (eg an electrical assembly) moving in the direction of arrow A. In a first embodiment, a nozzle 1 is arranged in the surge 3 , which conveys a liquid to the printed circuit board 2 . The liquid flowing out of the nozzle 1 wets the soldered goods where the solder is torn off from the soldered goods (printed circuit board).

In einer weiteren erfindungsgemäßen Ausführungsform kann die Düse 1′ vor dem Schwall 3 angeordnet sein, um das Lötgut be­ reits vor dem Schwall zu benetzen.In a further embodiment according to the invention, the nozzle 1 'can be arranged in front of the surge 3 in order to be able to wet the soldered material before the surge.

In einer weiteren erfindungsgemäßen Ausführungsform wird die Düse 1′′ nach dem Schwall angeordnet; durch die Wahl des Abstandes zwischen Düse 1′′ und Schwall kann eine Anpassung an unterschiedliche Betriebsbedingungen zur Optimierung der Spüleffekte erfolgen.In a further embodiment of the invention, the nozzle 1 '' is arranged after the surge; by choosing the distance between the nozzle 1 '' and surge, an adaptation to different operating conditions to optimize the washing effects can be made.

Die Anordnung der Düsen 1, 1′ und 1′′ kann alternativ oder in beliebiger Kombination vorliegen. The arrangement of the nozzles 1 , 1 'and 1 ''can alternatively or in any combination.

Für die Vorrichtung können konventionelle Pumpen und Düsen­ anordnungen verwendet werden, die die Flüssigkeit fördern bzw. auf das Lötgut sprühen. Dabei können insbesondere die Parameter Flüssigkeitsdurchsatz, Flüssigkeitstemperatur, Pumpendruck, Düsengeometrie und der Düsenwinkel geändert werden, um eine optimale Wirkung zum Entfernen unerwünschter Lotreste zu erzielen.Conventional pumps and nozzles can be used for the device arrangements are used that promote the liquid or spray on the solder. In particular, the Parameters liquid flow rate, liquid temperature, Pump pressure, nozzle geometry and nozzle angle changed to have an optimal effect of removing unwanted To achieve solder residues.

Claims (5)

1. Verfahren zum Entfernen von Lot vom Lötgut (2) in einer Lötanlage mittels einer Spülflüssigkeit, die durch eine Düse (1; 1′; 1′′) auf das Lötgut (2) gerichtet wird.1. A method for removing solder from the item to be soldered ( 2 ) in a soldering system by means of a rinsing liquid which is directed through a nozzle ( 1 ; 1 '; 1 '') onto the item to be soldered ( 2 ). 2. Vorrichtung zum Entfernen von Lot in einer Lötanlage zur Durchführung des Verfahrens nach Anspruch 1, gekenn­ zeichnet durch eine auf das Lötgut (2) gerichtete Flüs­ sigkeitsdüse (1; 1′; 1′′).2. Device for removing solder in a soldering system for performing the method according to claim 1, characterized marked by a liquid nozzle directed towards the item to be soldered ( 2 ) ( 1 ; 1 '; 1 ''). 3. Vorrichtung nach Anspruch 2, dadurch gekennzeichnet, daß eine Düse (1) im Schwall (3) und/oder vor dem Schwall und/oder nach dem Schwall einer Wellenlötanlage angeord­ net ist.3. Apparatus according to claim 2, characterized in that a nozzle ( 1 ) in the surge ( 3 ) and / or before the surge and / or after the surge of a wave soldering system is net angeord. 4. Vorrichtung nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Flüssigkeit chemisch inert ist.4. Device according to one of claims 1 to 3, characterized characterized in that the liquid is chemically inert. 5. Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß eine beim Dampfphasenlöten zu verwendende Flüssigkeit eingesetzt wird.5. The device according to claim 4, characterized in that a liquid to be used in vapor phase soldering is used.
DE4342633A 1993-12-14 1993-12-14 Device for removing unwanted solder from the item to be soldered in a soldering system Ceased DE4342633A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE4342633A DE4342633A1 (en) 1993-12-14 1993-12-14 Device for removing unwanted solder from the item to be soldered in a soldering system
PCT/EP1994/004139 WO1995016538A1 (en) 1993-12-14 1994-12-14 Device for removing excess solder from items being soldered at a soldering station

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4342633A DE4342633A1 (en) 1993-12-14 1993-12-14 Device for removing unwanted solder from the item to be soldered in a soldering system

Publications (1)

Publication Number Publication Date
DE4342633A1 true DE4342633A1 (en) 1995-06-22

Family

ID=6504996

Family Applications (1)

Application Number Title Priority Date Filing Date
DE4342633A Ceased DE4342633A1 (en) 1993-12-14 1993-12-14 Device for removing unwanted solder from the item to be soldered in a soldering system

Country Status (2)

Country Link
DE (1) DE4342633A1 (en)
WO (1) WO1995016538A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19653080A1 (en) * 1996-12-19 1998-06-25 Wack O K Chemie Gmbh Cleaning system for mounted circuit boards

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
DE3518405A1 (en) * 1984-05-25 1985-11-28 The HTC Corp., Concord, Mass. SOLDERING SYSTEM
EP0193321B1 (en) * 1985-02-21 1989-08-30 Hollis Automation Inc. Mass soldering system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500536A (en) * 1966-11-17 1970-03-17 Burroughs Corp Process for finishing solder joints on a circuit board
US4401253A (en) * 1978-04-18 1983-08-30 Cooper Industries, Inc. Mass soldering system
US4394802A (en) * 1981-04-24 1983-07-26 The Htc Corporation Counter-convection vapor control system
JPS5884673A (en) * 1981-11-12 1983-05-20 Tamura Kaken Kk Soldering method
US4566624A (en) * 1983-12-16 1986-01-28 Hollis Automation, Inc. Mass wave soldering system
US4664308A (en) * 1985-10-30 1987-05-12 Hollis Automation, Inc. Mass soldering system providing an oscillating air blast
US4679720A (en) * 1986-10-23 1987-07-14 Hollis Automation, Inc. Mass soldering system providing a sweeping fluid blast

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4410126A (en) * 1978-10-12 1983-10-18 Cooper Industries, Inc. Mass soldering system
DE3518405A1 (en) * 1984-05-25 1985-11-28 The HTC Corp., Concord, Mass. SOLDERING SYSTEM
EP0193321B1 (en) * 1985-02-21 1989-08-30 Hollis Automation Inc. Mass soldering system

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JP 1-34 577 A in Patent Abstracts of Japan, Sect. M, Vol. 13 (22. May 1989), Nr. 217, (M-828) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19653080A1 (en) * 1996-12-19 1998-06-25 Wack O K Chemie Gmbh Cleaning system for mounted circuit boards

Also Published As

Publication number Publication date
WO1995016538A1 (en) 1995-06-22

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