DE4306268A1 - Housing for sensors - Google Patents

Housing for sensors

Info

Publication number
DE4306268A1
DE4306268A1 DE4306268A DE4306268A DE4306268A1 DE 4306268 A1 DE4306268 A1 DE 4306268A1 DE 4306268 A DE4306268 A DE 4306268A DE 4306268 A DE4306268 A DE 4306268A DE 4306268 A1 DE4306268 A1 DE 4306268A1
Authority
DE
Germany
Prior art keywords
housing
sensors
housing according
gas
recesses
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE4306268A
Other languages
German (de)
Inventor
Olaf Dr Ing Kiesewetter
Albert Dipl Ing Reinholz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UST Umweltsensortechnik GmbH
Original Assignee
UST Umweltsensortechnik GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UST Umweltsensortechnik GmbH filed Critical UST Umweltsensortechnik GmbH
Priority to DE4306268A priority Critical patent/DE4306268A1/en
Publication of DE4306268A1 publication Critical patent/DE4306268A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N33/00—Investigating or analysing materials by specific methods not covered by groups G01N1/00 - G01N31/00
    • G01N33/0004—Gaseous mixtures, e.g. polluted air
    • G01N33/0009—General constructional details of gas analysers, e.g. portable test equipment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Medicinal Chemistry (AREA)
  • Food Science & Technology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)

Abstract

The object underlying the invention is to specify a housing for gas sensors, with which housing it is possible, in a cost-effective manner, to attach various types of sensors, either unsupported or on chip carriers, in a common housing in such a way that both the gas permeability and the required mechanical stability are ensured. The object is achieved according to the invention by a housing which comprises a bottom part and a top part, in which housing there is arranged on the bottom part a comb-shaped carrier strip having the electrical connecting lugs, in which at least two sensors are connected in an electrically conductive manner to the electrical connecting lugs, in which the bottom part is surrounded by the top part and in which both parts have an opening in the interior. The invention relates to a housing for sensors, preferably for gas sensors, in which the sensors are arranged such that they are mechanically protected and connected to electrical contact lugs. <IMAGE>

Description

Die Erfindung betrifft ein Gehäuse für Sensoren, vorzugsweise für Gassensoren, in dem die Sensoren mechanisch geschützt und mit elektrischen Kontakt­ fahnen verbunden angeordnet sind.The invention relates to a housing for sensors, preferably for gas sensors in which the sensors mechanically protected and with electrical contact flags are connected.

Im Stand der Technik ist es bekannt, als Gehäuse für Gassensoren handelsübliche Transistor- oder Schaltkreisgehäuse zu verwenden. Da die meisten Gassensoren bei Temperaturen von mehr als 100°c be­ trieben werden, ist es erforderlich, diese Sensoren auf isolierenden Trägern oder freitragend an den elektrischen Anschlußdrähten zu befestigen. Die derzeitig verfügbaren Gehäuse sind für die gleich­ zeitige Anordnung von freitragenden und von auf Trägern angeordneten Sensoren nur bedingt geeignet, insbesondere weil herkömmliche Kontaktierungsver­ fahren nur schwer anwendbar sind. Als herkömmliche Kontaktierungsverfahren sind je nach Sensortyp Ul­ traschall-, Thermokompressions- oder Widerstands­ punktschweißverfahren üblich.It is known in the art as a housing for gas sensors commercially available transistor or Circuit case to use. Since most Gas sensors at temperatures above 100 ° c driven, it is necessary to use these sensors on insulating supports or self-supporting on the to attach electrical connecting wires. The currently available housings are the same for the early arrangement of unsupported and on Sensors arranged in supports are only suitable to a limited extent, especially because conventional contacting ver driving are difficult to use. Than conventional Depending on the sensor type, contacting methods are Ul ultrasonic, thermal compression or resistance spot welding process common.

Bei den im Stand der Technik bekannten Gehäusen ist neben diesen Nachteilen besonders ungünstig, daß die Anordnung mehrerer unterschiedliche Sensortypen in einem Gehäuse nicht möglich ist bzw. nur mit ei­ nem sehr hohen Arbeitsaufwand realisiert werden kann. Dies ist dadurch bedingt, daß zur Herstellung der Sensoren verschiedene Grundtechnologien einge­ setzt werden, die wiederum unterschiedliche Kontak­ tierungsverfahren zur Verbindung der Sensoren mit den elektrischen Anschlußfahnen sowie verschiedene Befestigungsanordnungen erfordern. Die Befestigung kann dabei freitragend oder auf einem Chip mit zu­ gehöriger Halterung erfolgen. Eine weitere Ursache für den hohen Fertigungsaufwand ist, daß die Senso­ ren mit unterschiedlichen Betriebstemperaturen be­ trieben werden müssen und hierzu ebenfalls unter­ schiedliche Befestigungsmöglichkeiten vorgesehen werden müssen.In the housing known in the prior art in addition to these disadvantages, particularly unfavorable that the arrangement of several different sensor types  is not possible in a housing or only with an egg very high workload can. This is due to the fact that for production different basic technologies of the sensors that are in turn different contacts tation procedure for connecting the sensors with the electrical connection lugs as well as various Require mounting arrangements. The attachment can be self-supporting or on a chip proper bracket. Another cause for the high manufacturing costs is that the Senso with different operating temperatures must be driven and also under different mounting options provided Need to become.

Der Erfindung liegt die Aufgabe zugrunde, ein Ge­ häuse für Gassensoren anzugeben, mit dem es möglich ist, kostengünstig verschiedene Sensortypen wahl­ weise freitragend oder auf Chipträgern in einen ge­ meinsamen Gehäuse so zu befestigen, daß sowohl die Gasdurchlässigkeit als auch die erforderliche me­ chanische Stabilität gewährleistet sind.The invention has for its object a Ge Specify housing for gas sensors with which it is possible is, inexpensive to choose different sensor types cantilevered or on chip carriers in a ge fasten common housing so that both the Gas permeability as well as the required me mechanical stability is guaranteed.

Erfindungsgemäß gelingt die Lösung der Aufgabe da­ durch, daß das Gehäuse aus einem Unterteil und ei­ nem Oberteil besteht, daß auf dem Unterteil ein kammförmiger Trägerstreifen angeordnet ist, an dem sich die elektrischen Anschlußfahnen befinden, daß mindestens zwei Sensoren elektrisch leitend mit den elektrischen Anschlußfahnen verbunden sind, daß das Unterteil vom Oberteil umschlossen wird und daß beide Teile im Inneren einen gemeinsamen Durchbruch aufweisen.According to the invention, the problem is solved there through that the housing from a lower part and egg nem upper part is that on the lower part comb-shaped carrier strip is arranged on the there are the electrical connection lugs that at least two sensors electrically conductive with the electrical connection lugs are connected that the Lower part is enclosed by the upper part and that  both parts have a common breakthrough inside exhibit.

Ferner ist es möglich, daß im Unterteil oder im Oberteil Ausnehmungen in radialer Richtung angeord­ net sind, die den Trägerstreifen formschlüssig auf­ nehmen.It is also possible that in the lower part or in Upper part recesses arranged in the radial direction net, which form-fit the carrier strip to take.

Eine vorteilhafte Ausführungsform sieht vor, daß das Unterteil zusätzliche Ausnehmungen aufweist, in denen Chipträger angeordnet sind.An advantageous embodiment provides that the lower part has additional recesses, in which chip carriers are arranged.

Weiterhin ist es möglich, daß Oberteil und Unter­ teil miteinander verklebt sind. Eine weitere vor­ teilhafte Ausführungsform sieht vor, daß im unteren Teil des Gehäuses Ausnehmungen angeordnet sind, in denen eine Grundplatte eingerastet ist.It is also possible that the top and bottom are partially glued together. Another before partial embodiment provides that in the lower Part of the housing recesses are arranged in which has a base plate engaged.

Eine zweckmäßige Ausgestaltung der erfindungsgemä­ ßen Anordnung sieht vor, daß am Oberteil eine gas­ durchlässige Membran angeordnet ist.An expedient embodiment of the invention This arrangement provides for a gas on the upper part permeable membrane is arranged.

Die Erfindung soll im folgenden anhand eines Aus­ führungsbeispieles näher erläutert werden. In der zugehörigen Zeichnung zeigen:The invention is based on an off management example are explained in more detail. In the associated drawing show:

Fig. 1 eine schematische Darstellung der er­ findungsgemäßen Sensoranordnung im Schnitt. Fig. 1 is a schematic representation of the inventive sensor arrangement in section.

Fig. 2 die zugehörige Seitenansicht Fig. 2 shows the associated side view

Fig. 3 die zugehörige Draufsicht. Fig. 3 shows the associated top view.

Fig. 1 zeigt die Anordnung zweier unterschiedli­ cher Sensoren in einem gemeinsamen Gehäuse. Das Gehäuse besteht aus dem Unterteil A, das beispiels­ weise vier Ausnehmungen A1 bis A4 enthält, wovon in Fig. 2 die Ausnehmung A2 dargestellt ist. In die Ausnehmungen A2 und A4 ist ein Chipträger CT eingefügt. Auf diesem Chipträger CT befindet sich der Gassensor G1. Der Gassensor G1 ist mittels Bonddrähte DB mit dem kammförmigen Träger K, der die elektrischen Anschlüsse enthält, verbunden. Das Gehäuseoberteil B umschließt die einzelnen Teile der erfindungsgemäßen Anordnung, so daß nach dessen Montage eine Lagesicherung aller Teile gewährlei­ stet ist. Teil A und Teil B können auf unterschied­ liche Weise miteinander befestigt werden, bei­ spielsweise durch Kleben oder elastisches Ein­ schnappen. Der freitragend im Gehäuse befestigte Sensor G2 kann vor oder nach dem Aufstülpen des Trägerstreifens mit herkömmlichen Schweißverfahren mit diesen verbunden werden. Beim Einsatz von Gas­ sensorchips, an denen keine Anschlußdrähte vorhan­ den sind, werden Bonddrähte angeordnet, die mittels herkömmlichen Ultraschall- oder Thermokompressions­ bonder mit dem Sensorchip C bzw. mit dem Träger­ streifen verbunden sind. Sensoren, die eine frei­ tragende Befestigung nicht gestatten, werden auf einem gesonderten Chipträger CT befestigt, der in das Gehäuseunterteil A eingebracht wird. Nach dem Verbinden von Gehäuseunterteil A und Gehäuseober­ teil B entsteht ein mechanisch stabiles Sensorge­ häuse, in dem die Sensoren gegen mechanische Bela­ stungen geschützt angeordnet sind. Fig. 1 shows the arrangement of two different? Cher sensors in a common housing. The housing consists of the lower part A, the example contains four recesses A1 to A4, of which the recess A2 is shown in Fig. 2. A chip carrier CT is inserted into the recesses A2 and A4. The gas sensor G1 is located on this chip carrier CT. The gas sensor G1 is connected to the comb-shaped carrier K, which contains the electrical connections, by means of bonding wires DB. The upper housing part B encloses the individual parts of the arrangement according to the invention, so that after its assembly a positional securing of all parts is guaranteed. Part A and part B can be fastened together in different ways, for example by snapping or gluing. The sensor G2, which is self-supporting in the housing, can be connected to it by conventional welding methods before or after the carrier strip is put on. When using gas sensor chips, on which there are no connecting wires, bond wires are arranged which are connected to the sensor chip C or to the carrier by means of conventional ultrasound or thermocompression strips. Sensors that do not allow a self-supporting attachment are attached to a separate chip carrier CT, which is inserted into the lower housing part A. After connecting the lower housing part A and upper housing part B, a mechanically stable sensor housing is created in which the sensors are arranged to protect them against mechanical loads.

Besonders vorteilhaft bei dem erfindungsgemäßen Ge­ häuse ist, daß mit dem Gehäuse unterschiedliche Sensortypen, beispielsweise Sensoren in Dickschicht- und Sensoren in Dünnschichtbauweise, Sensoren mit und ohne Anschlußdrähte, die freitra­ gend oder auf Chipträgern angeordnet sind, befe­ stigt werden können. Als Befestigungsverfahren sind übliche Befestigungsverfahren wie das Ultraschall-, das Thermokompressions- oder das Widerstandspunkt schweißverfahren einsetzbar. Damit gelingt es, in einem Gehäuse Sensoren unterschiedlicher Art mecha­ nisch stabil und kostengünstig anzuordnen.Particularly advantageous in the Ge according to the invention housing is that with the housing different Sensor types, for example sensors in  Thick-film and sensors in thin-film construction, Sensors with and without connecting wires that freitra be arranged or on chip carriers, befe can be adjusted. As fastening methods are usual fastening methods such as ultrasound, the thermocompression or resistance point welding process can be used. So it succeeds in one housing sensors of different types mecha nisch stable and inexpensive to arrange.

Claims (6)

1. Gehäuse für Sensoren, vorzugsweise für Gassenso­ ren, in dem die Sensoren mechanisch geschützt und mit elektrischen Kontaktfahnen verbunden angeordnet sind, dadurch gekennzeichnet, daß
  • - das Gehäuse aus einem Unterteil und einem Ober­ teil besteht,
  • - daß auf dem Unterteil ein kammförmiger Träger­ streifen angeordnet ist, an dem sich die elektri­ schen Anschlußfahnen befinden
  • - daß mindestens zwei Sensoren elektrisch leitend mit den elektrischen Anschlußfahnen verbunden sind,
  • - daß das Unterteil vom Oberteil umschlossen wird und
  • - daß beide Teile im Inneren einen Durchbruch auf­ weisen.
1. Housing for sensors, preferably for Gassenso ren, in which the sensors are mechanically protected and arranged with electrical contact tabs, characterized in that
  • - The housing consists of a lower part and an upper part,
  • - That a comb-shaped carrier strip is arranged on the lower part, on which the electrical connecting lugs are located
  • that at least two sensors are electrically conductively connected to the electrical connection lugs,
  • - That the lower part is enclosed by the upper part and
  • - That both parts have a breakthrough inside.
2. Gehäuse nach Anspruch 1, dadurch gekennzeichnet, daß im Unterteil oder im Oberteil Ausnehmungen in radialer Richtung angeordnet sind, die den Träger­ streifen formschlüssig aufnehmen.2. Housing according to claim 1, characterized in that in the lower part or in the upper part recesses in radial direction are arranged, the carrier Take up the stripes in a form-fitting manner. 3. Gehäuse nach Anspruch 1 oder 2, dadurch gekenn­ zeichnet, daß das Unterteil zusätzliche Ausnehmun­ gen aufweist, in denen Chipträger angeordnet sind. 3. Housing according to claim 1 or 2, characterized records that the lower part additional recesses gene in which chip carriers are arranged.   4. Gehäuse nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß das Oberteil und Unterteil miteinander verklebt sind.4. Housing according to one of claims 1 to 3, characterized in that the upper part and lower part glued together are. 5. Gehäuse nach einem der Ansprüche 1 bis 3, da­ durch gekennzeichnet, daß im unteren Teil des Gehäuses Ausnehmungen angeordnet sind, in denen eine Grundplatte eingerastet ist.5. Housing according to one of claims 1 to 3, there characterized in that in the lower part of the Housing recesses are arranged in which a base plate is engaged. 6. Gehäuse nach einem der Ansprüche 1 bis 5, da­ durch gekennzeichnet, daß am Oberteil eine gas­ durchlässige Membran angeordnet ist.6. Housing according to one of claims 1 to 5, there characterized in that a gas on the upper part permeable membrane is arranged.
DE4306268A 1993-03-01 1993-03-01 Housing for sensors Withdrawn DE4306268A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE4306268A DE4306268A1 (en) 1993-03-01 1993-03-01 Housing for sensors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4306268A DE4306268A1 (en) 1993-03-01 1993-03-01 Housing for sensors

Publications (1)

Publication Number Publication Date
DE4306268A1 true DE4306268A1 (en) 1994-09-08

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Family Applications (1)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026064A1 (en) * 1997-11-14 1999-05-27 Motorola, Inc. Exhaust gas sensor with flow control without a diffusion barrier
DE10016869A1 (en) * 2000-04-05 2001-10-18 Deutsch Zentr Luft & Raumfahrt Microfunction unit
DE10121776A1 (en) * 2001-05-04 2002-11-28 Sick Ag sensor
DE102008034033A1 (en) 2008-07-22 2010-04-22 Ust Umweltsensortechnik Gmbh Carrier element for carrying e.g. metal oxide semiconductor gas sensor, utilized for detecting e.g. thermal conductivity, has receiving surface present on individual body parts that are connected thermal bridges
DE102010012042A1 (en) * 2010-03-19 2011-09-22 Epcos Ag Component with a chip in a cavity and a voltage-reduced attachment
DE102011012682A1 (en) * 2011-03-01 2012-09-06 Hella Kgaa Hueck & Co. Gas sensor, especially for automotive applications

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928697C1 (en) * 1989-08-30 1990-11-08 Auergesellschaft Gmbh, 1000 Berlin, De
DE3937522A1 (en) * 1989-11-10 1991-05-16 Texas Instruments Deutschland SEMICONDUCTOR PRESSURE SENSOR CONNECTED TO A CARRIER ELEMENT
DE4203832A1 (en) * 1991-02-12 1992-08-13 Mitsubishi Electric Corp Semiconductor pressure sensor in plastic moulded package - can be made with a lower strain level due to thermal expansion coefficient mismatch by careful optimisation of some dimensions

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928697C1 (en) * 1989-08-30 1990-11-08 Auergesellschaft Gmbh, 1000 Berlin, De
DE3937522A1 (en) * 1989-11-10 1991-05-16 Texas Instruments Deutschland SEMICONDUCTOR PRESSURE SENSOR CONNECTED TO A CARRIER ELEMENT
DE4203832A1 (en) * 1991-02-12 1992-08-13 Mitsubishi Electric Corp Semiconductor pressure sensor in plastic moulded package - can be made with a lower strain level due to thermal expansion coefficient mismatch by careful optimisation of some dimensions

Non-Patent Citations (9)

* Cited by examiner, † Cited by third party
Title
2-280346 A, E-1030, Feb.6,1991,Vol.15,No. 50 *
BÜTTGENBACH, Stephanus: Mikromechanik, B.G. Teubner Stuttgart 1991, S.162-186 *
EHRMANN,O *
HORNER,G.: Chemosensors with Pattern Recognition.In: Siemenns Forsch.- u.Entwickl.-Ber.Bd.15, 1986,Nr.3, S.95-100 *
MÜLLER,R. *
N.N.: Der Schnüffel-Chip. In: Elektronik 1/5.1.1990, S.14 *
N.N.: Sensorsysteme in der Medizintechnik, In: Mikroelektronik, Bd.5,H.3,1991, XLVI-XLVII *
Patents Abstracts of Japan: 1-228156 A, E- 857, Dec.8,1989,Vol.13,No.551 *
u.a.: TAB-Kontaktierung für Sensoren. In: tm Sonderheft Sensoren '90, S.16-18 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1999026064A1 (en) * 1997-11-14 1999-05-27 Motorola, Inc. Exhaust gas sensor with flow control without a diffusion barrier
DE10016869A1 (en) * 2000-04-05 2001-10-18 Deutsch Zentr Luft & Raumfahrt Microfunction unit
US7166806B2 (en) 2000-04-05 2007-01-23 Milasys Gbr Micro-functional unit
DE10121776A1 (en) * 2001-05-04 2002-11-28 Sick Ag sensor
DE10121776B4 (en) * 2001-05-04 2006-10-19 Sick Ag sensor
DE102008034033A1 (en) 2008-07-22 2010-04-22 Ust Umweltsensortechnik Gmbh Carrier element for carrying e.g. metal oxide semiconductor gas sensor, utilized for detecting e.g. thermal conductivity, has receiving surface present on individual body parts that are connected thermal bridges
DE102010012042A1 (en) * 2010-03-19 2011-09-22 Epcos Ag Component with a chip in a cavity and a voltage-reduced attachment
US8531018B2 (en) 2010-03-19 2013-09-10 Epcos Ag Component comprising a chip in a cavity and a stress-reduced attachment
DE102011012682A1 (en) * 2011-03-01 2012-09-06 Hella Kgaa Hueck & Co. Gas sensor, especially for automotive applications
US9255919B2 (en) 2011-03-01 2016-02-09 Hella Kgaa Hueck & Co. Gas sensor, in particular for automobile applications

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