DE4032948C1 - Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel - Google Patents

Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel

Info

Publication number
DE4032948C1
DE4032948C1 DE19904032948 DE4032948A DE4032948C1 DE 4032948 C1 DE4032948 C1 DE 4032948C1 DE 19904032948 DE19904032948 DE 19904032948 DE 4032948 A DE4032948 A DE 4032948A DE 4032948 C1 DE4032948 C1 DE 4032948C1
Authority
DE
Germany
Prior art keywords
grinding wheel
shaft
circuit strips
packages
perpendicularly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19904032948
Other languages
German (de)
Inventor
Max 8591 Pechbrunn De Mueller
Hans Dipl.-Ing. 8591 Ploessberg De Schoenberger
Erwin 8590 Marktredwitz De Skierlo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ceramtec GmbH
Original Assignee
Ceramtec GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ceramtec GmbH filed Critical Ceramtec GmbH
Priority to DE19904032948 priority Critical patent/DE4032948C1/en
Application granted granted Critical
Publication of DE4032948C1 publication Critical patent/DE4032948C1/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)

Abstract

The machine (1) has been designed for removing shortcircuit strips (15), in particular from pin grid arrays (7). The bed or the base of the machine is equipped with a grinding unit (2) and a grinding wheel (3) and there is also fixture (6) for the workpiece (7) which can slide parallel and perpendicular to the shaft (13) of the grinding wheel. ADVANTAGE - Removal of strips without residue or remainders.

Description

Gegenstand der Erfindung ist eine Maschine zum Entfernen von Kurzschlußstreifen an Gehäusen für hochintegrierte Halbleiterbausteine, sogenannten Pin Grid Arrays.The invention relates to a machine for removal of short-circuit strips on housings for highly integrated Semiconductor components, so-called pin grid arrays.

Hochintegrierte Halbleiterbausteine mit zahlreichen Anschlußstellen und ihrer komplizierten Montagetechnik werden in speziellen Gehäusen, den sogenannten Pin Grid Arrays (PGA's) angeordnet. Die PGA's weisen eine dem Halbleiterchip entsprechende Anzahl von Leiterbahnen und ebenso viele Kontaktstifte auf. Diese Leiterbahnen und Kontaktstifte werden unter anderem galvanisch metallisiert. Zu diesem Zweck werden an den Schmalseiten des PGA's Metallisierungsstreifen (Kurzschlußstreifen) angebracht, die über Hilfsleiterbahnen mit den Kontaktstiften elektrisch leitend verbunden sind. Nach dem Brennen und Metallisieren der PGA's müssen diese Kurzschlußstreifen wieder rückstandsfrei entfernt werden und die Leiterbahnen durch einen Isolationswiderstand R < 10¹¹ Ohm bei 100 V und 50% relativer Luftfeuchtigkeit voneinander getrennt sein, was bisher so erfolgte, daß die PGA's von Hand gegen eine rotierende Stirnschleifscheibe gepreßt wurden.Highly integrated semiconductor devices with numerous Junction points and their complicated assembly technology are in special housings, the so-called pin grid Arrays (PGA's) arranged. The PGA's have one Semiconductor chip corresponding number of conductor tracks and as many contact pins. These traces and Contact pins are galvanized, among other things. For this purpose, on the narrow sides of the PGA Metallization strips (short-circuit strips) attached, the via auxiliary conductor tracks with the contact pins are electrically connected. After burning and Metallize the PGA's must have these short circuit strips are removed again without leaving any residue and the conductor tracks by an insulation resistance R <10 11 ohms 100 V and 50% relative humidity from each other be separated, which has been done so far that the PGA's by hand against one rotating face grinding wheel were pressed.

Der Erfindung liegt demgegenüber die Aufgabe zugrunde, eine Maschine zu schaffen, mit deren Hilfe Kurzschlußstreifen an derartigen Gehäusen (PGA's) rückstandsfrei entfernt werden können.The invention is based on the object of a machine to create with their help Short-circuit strips on such housings (PGA's) can be removed without residue can.

Die Aufgabe ist durch eine Maschine gelöst, bei der auf einem Maschinenbett eine Schleifeinrichtung mit rotierenden Schleifscheibe und eine Aufspanneinrichtung für das Gehäuse angeordnet ist, die parallel und senkrecht zur Welle der Schleifscheibe verschiebbar ist. The task is solved by a machine on which a machine bed a grinding device with rotating Grinding wheel and a clamping device for the housing is arranged parallel and perpendicular to the shaft the grinding wheel is displaceable.  

Mit der erfindungsgemäßen Maschine ist ein sauberes und zuverlässiges Abtragen der Kurzschlußstreifen unter Einhaltung enger Maßtoleranzen und des geforderten Isolationswiderstandes zwischen den Leiterbahnen möglich.With the machine according to the invention is a clean and reliable removal of the short-circuit strips under Compliance with narrow dimensional tolerances and the required Insulation resistance between the conductor tracks possible.

Im folgenden wird die Erfindung anhand von lediglich ein Ausführungsbeispiel darstellender Zeichnungen näher erläutert. Es zeigtIn the following, the invention is based on only one Exemplary embodiment of the drawings explained in more detail. It shows

Fig. 1 die Maschine perspektivisch und Fig. 1 the machine in perspective and

Fig. 2 die Bearbeitung einer Werkstückseite (vergrößerter Ausschnitt von Fig. 1). Fig. 2 the processing of a workpiece side (enlarged section of Fig. 1).

Die Maschine zum Entfernen von Kurzschlußstreifen an PGA's weist ein Maschinenbett 1 auf, das eine Schleifeinrichtung 2 mit rotierender Schleifscheibe 3 trägt. Auf dem Maschinenbett 1 ist ein Vorschub- und Zustellschlitten 4 bzw. 5 angeordnet. Letzterer trägt eine Aufspanneinrichtung 6 für das Werkstück 7. Neben dem Werkstückspannantrieb 8 besitzt die Aufspanneinrichtung 6 einen Drehantrieb 9, mit dem das Werkstück 7 in Schritten von 90° gedreht werden kann. 10 deutet den Zustellantrieb an. Gemäß Fig. 2 ist das Werkstück 7, ein PGA, zwischen zwei Haltebacken 11 und 12 eingeklemmt, die in der Aufspanneinrichtung 6 drehbar angeordnet sind. Mit dem Vorschubschlitten (4) kann das Werkstück 7 parallel und mit dem Zustellschlitten 5 senkrecht zur Welle 13 der Schleifscheibe 3 verschoben werden. Mit dem Umfang 14 der Schleifscheibe 3 wird gemäß Fig. 2 das Werkstück 7 besäumt, d. h. der Metallstreifen (Kurzschlußstreifen) 15 auf den Schmalseiten des Werkstücks 7 entfernt.The machine for removing short-circuit strips on PGAs has a machine bed 1 which carries a grinding device 2 with a rotating grinding wheel 3 . A feed and feed carriage 4 or 5 is arranged on the machine bed 1 . The latter carries a clamping device 6 for the workpiece 7 . In addition to the workpiece clamping drive 8 , the clamping device 6 has a rotary drive 9 with which the workpiece 7 can be rotated in steps of 90 °. 10 indicates the feed drive. Referring to FIG. 2, the workpiece 7, a PGA, clamped between two holding jaws 11 and 12 which are rotatably disposed in the jig. 6 The workpiece 7 can be moved in parallel with the feed slide ( 4 ) and perpendicular to the shaft 13 of the grinding wheel 3 with the feed slide 5 . With the periphery 14 of the grinding wheel 3 2, the workpiece 7 is shown in FIG. Trimmed, the metal strip (shorting strip) 15 that is located on the narrow sides of the workpiece 7.

Claims (1)

Maschine zum Entfernen von Kurzschlußstreifen an Gehäusen für hochintegrierte Halbleiterbausteine, dadurch gekennzeichnet, daß auf einem Maschinenbett (1) eine Schleifeinrichtung (2) mit rotierender Schleifscheibe (3) und eine Aufspanneinrichtung (6) für das Gehäuse (7) angeordnet ist, die parallel und senkrecht zur Welle (13) der Schleifscheibe (3) verschiebbar ist.Machine for removing short-circuit strips on housings for highly integrated semiconductor components, characterized in that a grinding device ( 2 ) with a rotating grinding wheel ( 3 ) and a clamping device ( 6 ) for the housing ( 7 ) are arranged on a machine bed ( 1 ), which are parallel and is displaceable perpendicular to the shaft ( 13 ) of the grinding wheel ( 3 ).
DE19904032948 1990-10-17 1990-10-17 Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel Expired - Fee Related DE4032948C1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19904032948 DE4032948C1 (en) 1990-10-17 1990-10-17 Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19904032948 DE4032948C1 (en) 1990-10-17 1990-10-17 Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel

Publications (1)

Publication Number Publication Date
DE4032948C1 true DE4032948C1 (en) 1991-08-22

Family

ID=6416473

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19904032948 Expired - Fee Related DE4032948C1 (en) 1990-10-17 1990-10-17 Short circuit strips on IC packages, removing machine - has workpiece holder which slides parallelly and perpendicularly to shaft of grinding wheel

Country Status (1)

Country Link
DE (1) DE4032948C1 (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1155997B (en) * 1955-09-14 1963-10-17 Alfred Kolb Dipl Ing Device for the improved formation of the tool in projection machine tools
EP0185560A2 (en) * 1984-10-09 1986-06-25 Cosimo Mogavero Apparatus for milling and polishing the edge of a work piece made of a hard material

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1155997B (en) * 1955-09-14 1963-10-17 Alfred Kolb Dipl Ing Device for the improved formation of the tool in projection machine tools
EP0185560A2 (en) * 1984-10-09 1986-06-25 Cosimo Mogavero Apparatus for milling and polishing the edge of a work piece made of a hard material

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Legal Events

Date Code Title Description
8100 Publication of the examined application without publication of unexamined application
D1 Grant (no unexamined application published) patent law 81
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee