DE3883584T2 - Method and device for forming pins from extrudable material in a substrate. - Google Patents

Method and device for forming pins from extrudable material in a substrate.

Info

Publication number
DE3883584T2
DE3883584T2 DE88105085T DE3883584T DE3883584T2 DE 3883584 T2 DE3883584 T2 DE 3883584T2 DE 88105085 T DE88105085 T DE 88105085T DE 3883584 T DE3883584 T DE 3883584T DE 3883584 T2 DE3883584 T2 DE 3883584T2
Authority
DE
Germany
Prior art keywords
substrate
extrudable material
forming pins
pins
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE88105085T
Other languages
German (de)
Other versions
DE3883584D1 (en
Inventor
Donald Fey
Mark Vincent Pierson
John Thomas Legg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Application granted granted Critical
Publication of DE3883584D1 publication Critical patent/DE3883584D1/en
Publication of DE3883584T2 publication Critical patent/DE3883584T2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y10T29/49153—Assembling terminal to base by deforming or shaping with shaping or forcing terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/532—Conductor
    • Y10T29/53209—Terminal or connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Extrusion Of Metal (AREA)
  • Forging (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
DE88105085T 1987-04-23 1988-03-29 Method and device for forming pins from extrudable material in a substrate. Expired - Fee Related DE3883584T2 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US07/041,399 US4813130A (en) 1987-04-23 1987-04-23 Automatic extrusion pinning method and apparatus

Publications (2)

Publication Number Publication Date
DE3883584D1 DE3883584D1 (en) 1993-10-07
DE3883584T2 true DE3883584T2 (en) 1994-04-21

Family

ID=21916317

Family Applications (1)

Application Number Title Priority Date Filing Date
DE88105085T Expired - Fee Related DE3883584T2 (en) 1987-04-23 1988-03-29 Method and device for forming pins from extrudable material in a substrate.

Country Status (4)

Country Link
US (1) US4813130A (en)
EP (1) EP0287859B1 (en)
JP (1) JPS63268511A (en)
DE (1) DE3883584T2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3822535C1 (en) * 1988-07-04 1990-01-11 Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung Ev, 8000 Muenchen, De
US4946708A (en) * 1988-11-18 1990-08-07 International Business Machines Corporation Pin transfer adhesive application for surface mount component processes
US5376414A (en) * 1993-06-01 1994-12-27 Sophia Systems Co., Ltd. Expansion compensated precision extrusion method
US5548486A (en) * 1994-01-21 1996-08-20 International Business Machines Corporation Pinned module
US5878483A (en) * 1995-06-01 1999-03-09 International Business Machines Corporation Hammer for forming bulges in an array of compliant pin blanks
TW341171U (en) * 1998-01-16 1998-09-21 Li-Li Chen A platform radial dissipation forming mold

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3302272A (en) * 1963-12-26 1967-02-07 Air Reduction Forming a resistor with thin, compressed, contact portions
US3484935A (en) * 1965-07-28 1969-12-23 Western Electric Co Method of producing electrical circuit assemblies having through connectors
US3354260A (en) * 1966-07-18 1967-11-21 Western Electric Co Through-connectors for circuit boards and method of applying same
US3601523A (en) * 1970-06-19 1971-08-24 Buckbee Mears Co Through hole connectors
US3971610A (en) * 1974-05-10 1976-07-27 Technical Wire Products, Inc. Conductive elastomeric contacts and connectors
US4050756A (en) * 1975-12-22 1977-09-27 International Telephone And Telegraph Corporation Conductive elastomer connector and method of making same
EP0051378A2 (en) * 1980-11-03 1982-05-12 AMP INCORPORATED (a New Jersey corporation) Circuit board having cast circuitry and method of manufacture
KR850700098A (en) * 1983-09-21 1985-10-21 로이 에이취.맷신길 Printed Circuit Board Manufacturing Method
US4550493A (en) * 1984-02-08 1985-11-05 International Business Machines Corporation Apparatus for connecting contact pins to a substrate

Also Published As

Publication number Publication date
US4813130A (en) 1989-03-21
JPS63268511A (en) 1988-11-07
EP0287859A3 (en) 1990-08-08
EP0287859A2 (en) 1988-10-26
JPH0333045B2 (en) 1991-05-15
EP0287859B1 (en) 1993-09-01
DE3883584D1 (en) 1993-10-07

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee