DE3844685A1 - Printed circuit boards testing appts. - Google Patents

Printed circuit boards testing appts.

Info

Publication number
DE3844685A1
DE3844685A1 DE19883844685 DE3844685A DE3844685A1 DE 3844685 A1 DE3844685 A1 DE 3844685A1 DE 19883844685 DE19883844685 DE 19883844685 DE 3844685 A DE3844685 A DE 3844685A DE 3844685 A1 DE3844685 A1 DE 3844685A1
Authority
DE
Germany
Prior art keywords
nodes
printed circuit
circuit boards
appts
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19883844685
Other languages
German (de)
Other versions
DE3844685C2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/038,909 external-priority patent/US4884024A/en
Application filed filed Critical
Publication of DE3844685A1 publication Critical patent/DE3844685A1/en
Application granted granted Critical
Publication of DE3844685C2 publication Critical patent/DE3844685C2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers

Abstract

Each based under test (BUT) has number of downwardly directed accessible nodes. The appts. includes a support for removably supporting a BUT (12) test circuitry including upwardly directed channel nodes below the support. A connector is provided for electrically connecting the channel nodes to the BUT nodes. The connector comprises a universal board carrying movable probes (30) in a universal grid pattern, a unit to activate selected probes, and a translator board to make electrical connection between upper and lower conductors in different patterns.
DE3844685A 1987-04-16 1988-04-15 Contact probe Expired - Fee Related DE3844685C2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/038,909 US4884024A (en) 1985-11-19 1987-04-16 Test pin assembly for circuit board tester
DE3812654A DE3812654A1 (en) 1987-04-16 1988-04-15 DEVICE FOR TESTING CIRCUIT BOARDS

Publications (2)

Publication Number Publication Date
DE3844685A1 true DE3844685A1 (en) 1990-04-19
DE3844685C2 DE3844685C2 (en) 1995-05-18

Family

ID=25867031

Family Applications (1)

Application Number Title Priority Date Filing Date
DE3844685A Expired - Fee Related DE3844685C2 (en) 1987-04-16 1988-04-15 Contact probe

Country Status (1)

Country Link
DE (1) DE3844685C2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1903088A1 (en) * 1969-01-22 1971-01-21 Siemens Ag Contact device
DE3136896A1 (en) * 1981-09-17 1983-04-14 Ingun Prüfmittelbau GmbH & Co KG Elektronik, 7750 Konstanz Device for testing an electronic circuit board
DE3639366A1 (en) * 1985-11-19 1987-05-21 Teradyne Inc DEVICE FOR TESTING PRINTED CIRCUITS

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1903088A1 (en) * 1969-01-22 1971-01-21 Siemens Ag Contact device
DE3136896A1 (en) * 1981-09-17 1983-04-14 Ingun Prüfmittelbau GmbH & Co KG Elektronik, 7750 Konstanz Device for testing an electronic circuit board
DE3639366A1 (en) * 1985-11-19 1987-05-21 Teradyne Inc DEVICE FOR TESTING PRINTED CIRCUITS

Also Published As

Publication number Publication date
DE3844685C2 (en) 1995-05-18

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