DE3840180C1 - Housing with contact-free feed-through of radio-frequency signals - Google Patents

Abstract

The housing (1) for contact-free feed-through of radio-frequency signals comprises a plastic part (2) on which at least one area comprising conducting material is provided on both the inner surface and outer surface (3 and 6). In this way, the radio-frequency feed-through, in particular of antenna signals with a hermetically sealed circuit housing, is enabled in a simple fashion. By applying differently structured layer areas (51, 52; 81, 82) on the inner surface and outer surface (3 and 6) of the plastic part (2), an inductive and/or capacitive, contact-free feed-through can be formed, combinations of inductors (51, 52) and capacitors (73, 74; 81, 82) of this embodiment enabling widely differing circuit arrangements. <IMAGE>

Description

The invention relates to a housing with contactless implementation of high-frequency signals.

When connecting an antenna to a receiver, for example egg ner motor vehicle antenna with a receiver arranged in the motor vehicle, a high-frequency cable is routed galvanically through a housing of the receiver. Such a galvanic implementation, however, results in parts of various types. On the one hand, special requirements and conditions are placed on such implementations in order to achieve the most loss-free signal transmission possible. However, this significantly limits the design options for direct implementation. On the other hand, the signal-to-noise ratio of the overall receiving system is reduced by a galvanic implementation. Furthermore, it is difficult and only possible with great technical effort to create a climate-tight galvanic implementation, which is particularly important when using antennas for motor vehicles, since antenna amplifiers are as close as possible to the antenna, i.e. outside the passenger cell, for example in exterior mirrors , Trunk, engine compartments, etc. are arranged. These circuit arrangements must be protected against climate influences as well as possible, which, as I said, when carrying out high-frequency signals through the housing of such a circuit , if at all, is only possible with great technical effort.

From EP 2 60 221 A2 a contact-free electrical Ver binding between a disk and one in a case located data reader known, in the data reader using a generator generates a high-frequency clock signal and the Data carrier via two capacitive coupling devices with the Generator is connected in a circuit. Because of the considerable game that also for and by inserting and Pulling out the card cannot be avoided is one exact dimensioning of the capacity not possible.

From DE 26 00 403 A are inductive couplings for energy and / or signal transmission known, however, with regard to their contacting parameters are not accurate, impedance miss have adaptation problems and a considerable manufac ture require effort.

From DE-OS 34 06 080 is in connection with a coaxial separation  device known a housing that consists of two sub-housings. To Achieving a capacitive coupling with optimal shielding are the Housing parts designed so that their walls are in an overlap area overlap without the walls being nested despite the nested Touch the arrangement. From this publication it is also known between the overlapping, non-touching wall parts of the part to provide a polyester film as a dielectric. Both as regards Lich the manufacture as well as with regard to the assembly of the individual Ge housing parts requires a lot of effort to ensure that the overlapping housing parts do not touch each other. About that moreover, with such an arrangement, it is not possible to obtain an accurate one Dimensioning of the capacity must be observed because they overlap the areas and the distance between these areas are not so different Let nau choose and over time in particular changes in distance can result.

The invention is therefore based on the object of contacting a housing to create free implementation of high frequency signals that is simple in terms of construction and manufacture, and in which the contact tation parameters can be selected.

This object is achieved by the characterizing features of claim 1 solved.

Due to the measure according to the invention, the high-frequency signals are not more galvanic, but contact-free via appropriate conductive layer on a plastic part into or out of the housing to lead is a closed and therefore absolutely climate-tight housing arrangement for high-frequency circuits possible with little effort. This is particularly useful when the present invention is used together hang with automotive antennas advantageous. For example with active antenna systems The lower the antenna contribution, the lower the noise contribution  is more arranged to the antenna itself. The antenna amplifier is - therefore directly with the antennas, for example in exterior mirrors, in Kof clearing, in engine rooms, at least outside the climatic and around worldly relatively protected passenger compartment. In particular for these cases, the housing is absolutely environmentally and climate-tight tion according to the present invention is particularly advantageous. About that In addition, the signal-to-noise ratio of the entire receiving system can the features of the invention are significantly reduced. It is further possible signal transmission with the present invention make lossless and / or greater design freedom the execution of the circuit arrangements and / or the components and to reach the housing. Because the conditions for a ver lust-free signal transmission limits the constructive possibilities conventional bushings with a galvanic connection. These limitations are eased by the present invention avoided way.

Due to the feature of the invention, a plastic part with white at least to use a housing having a conductive layer region the, it is in view of the arrangement known from DE-OS 34 06 080 no longer required, housing parts with low tolerances and thus to manufacture high manufacturing costs and approximately in in a defined manner while maintaining a minimum distance from one another nest. Rather, the housing can consist of several, close together of the connected parts, but also be made in one piece, so that the production can be carried out easily and inexpensively. In addition, the housing according to the invention can be closed and thus be designed to be absolutely climate-proof without requiring a great deal of effort should be driven. There are no corrosion problems. With regard there is another prior to the above-mentioned arrangement of conventional type part of the housing according to the invention also in that the implementation pa parameters without a higher constructional or production engineering wall much more defined and fixed with less scatter can be.  

According to a preferred embodiment of the invention, the con clock-free execution of the high-frequency signals by means of a capacitance tive coupling. The plastic part of the housing serves as a Dielek trikum for two layer areas made of conductive material, the are essentially opposite to each other. Depending on the thickness of the art fabric wall and the surface of the layer areas of conductive material can capacity values according to the desired requirements can be easily selected or adapted.

An additional or alternative possibility according to another Aus leadership form of the invention is the contact-free implementation the high-frequency signals by means of an inductive coupling men. The inductors can be made of the best conductive material Layer areas are produced that meander on the In NEN and / or outer surface of the plastic part of the housing applied are. There is one between two intended inductors or coils magnetic coupling, so that the high-frequency signals in turn kon can be passed through the housing wall without clocking.

It is also particularly advantageous if according to a further training of the invention on the inner and / or outer surface of the plastic part Layer areas made of conductive material are provided, at least Are part of at least one additional inductance and / or capacitance. In this way it is possible, for example, to easily create a non-contact implementation of several high-frequency signals by the Ge to create houses.

A particularly advantageous embodiment of the invention particularly exists special also in that the conductive materials from layer areas formed additional inductors and / or capacities part of a Circuitry are inside and / or outside the housing. On in this way it is possible, for example, by using such Layer areas of conductive material with which the wall surfaces of the  Plastic part are provided, additional inductors and / or Kapa to form interrelationships, for example Series resonance circuits, resonance band circuits etc. with the inductance ten and / or form capacities for the contact-free implementation of high-frequency signals are provided.

A further development of the invention consists in that the structure and / or dimensioning of the layer areas of conductive material in Ab dependence on the desired capacitance, inductance and / or Kop planning values is selected. In this way, the leading through the Layers formed components in their dimensions and electrical Values can be easily adapted to the requirements.

It is advantageous if the wall thickness of the plastic part is little at least on those with layer areas made of conductive material Places depending on the desired capacitance, inductance and / or coupling values is selected. Based on the fiction According to features, it is easily possible to ge these values desired way to choose or adjust that the wall thickness of the plastic part and / or the surface dimensions of the conductive Layer areas on the plastic wall are selected accordingly. Egg ne adjustment of the electrical values to the respective circuit technology The requirements are easily possible.

The layer areas of conductive material on the inside and / or Au The outer surface of the plastic part can be applied in any way will. An embodiment of the invention is that the Layer areas of conductive material firmly on the inside and / or Au outer surface of the plastic part are applied. It is advantageous there when, according to a further embodiment of the invention, the layer areas of conductive material on the inner and / or outer surface of the Plastic parts are evaporated. This procedure is special simple and inexpensive.

Alternatively, however, there is also the possibility of the layer areas  conductive material on the inner and / or outer surface of the plastic partly applied galvanically.

Another embodiment of the invention is that the Layer areas of conductive material on the inner and / or outer surface che the plastic part applied in the form of a printed circuit are. In terms of production, this has particular advantages if the Form of the layer regions has a complicated structure, such as this for example with meandering structures for the formation of inductors is the case.

It is also particularly advantageous for the structures of the layer regions made of conductive material on the inner and / or outer surface of the art to form part of the fabric by etching. This type of structural training too manure has advantages for complicated shapes.

According to a further embodiment of the invention, the layering is surface made of conductive material on the inner and / or outer surface of the Plastic part designed as independent elements. Especially before An embodiment in which the plastic part is closed is advantageous at least partially of at least one (for example cap-shaped) Outer part is surrounded by conductive material.

The invention is based on the drawings, for example ago explained. Show it:

Figure 1 shows a cross section of an embodiment of a housing according to the invention in a schematic representation.

2 shows a cross section of a further embodiment of the invention, likewise in schematic presentation.

Fig. 3 shows another embodiment in a schematic and equivalent circuit image representation, in which a series resonant circuit is formed;

FIGS. 4a and 4b show a practical embodiment of the BE of conductive material projecting areas of the layer on the outer or inner surface of the housing for the embodiment shown as an equivalent circuit in Fig. 3;

Fig. 5 shows another embodiment of the present invention in a schematic and equivalent circuit diagram for an inductive implementation of high-frequency signals through a plastic housing;

Fig. 6 shows a practical embodiment of the exemplary embodiment shown in Fig. 5 in a schematic representation;

Fig. 7 shows another embodiment of the invention in a schematic and equivalent circuit diagram in connection with egg nem resonant band filter and

Fig. 8 shows a practical embodiment of the embodiment shown in Fig. 7 replacement circuit diagram Lich in a schematic Dar position.

The plastic part 2 of a housing 1 , in which, for example, a high frequency circuit can be accommodated, is metically finished off with a lid 2 'from the outside. The lid 2 'is also made of plastic and is welded to the plastic part 2 ver.

On the inner surface 3 of the plastic part 2 , a layer 4 of lei material, for example by vapor deposition of a metal, is brought up. Corresponding to this conductive layer 4 applied to the inner surface 3 of the plastic part 2 , a conductive layer 5 is provided on the outer surface 6 of the plastic part 2 . This layer 5 of conductive material on the outer surface 6 of the plastic part 2 can, for example, be vapor-deposited or applied in another form. The two conductive layers 4 and 5 form a capacitive connection for high-frequency signals, the intermediate wall of the plastic part 2 constituting a dielectric. In Fig. 1, a line 7 connected to the conductive layer 4 on the inner surface 3 and a line 8 connected to the conductive layer 5 on the outer surface 6 of the plastic part 2 schematically represents Darge, which form the connections for the capacitive connection. The capacitance, which consists of the two conductive layers 4 and 5 and the plastic part 2 serving as a dielectric, can be part of a circuit arrangement as a circuit element.

The advantage of the capacitive implementation according to the invention lies in the fact that this capacitance is very precisely defined and in particular can also be selected by appropriate selection of the surface dimensions and / or the wall thickness of the plastic part 2 , so that the capacitance values required for a circuit arrangement can be set. This is also possible in embodiments in which the lei layer 5 on the outer surface 6 of the plastic part 2 is a cup made of conductive material, which is placed like a cap over the plastic housing. Here, too, the capacitance values can be adapted to desired or required values such that only approximately the area of the conductive layer 4 on the inner surface 3 of the plastic part 2 is appropriately dimensioned.

In Fig. 2 is an exemplary embodiment of the invention is reproduced in a schematic cross-sectional view, in which the parts which correspond to those of FIG. 1 are provided with the same reference numerals. On the inner surface 3 of the plastic part 2 are several ge separate areas 21 , 22 and 23 of the layer of conductive material are seen easily. At corresponding locations on the outer surface 6 of the plastic part 2 , associated, separate areas 24 , 25 , 26 made of conductive material are attached. The respective opposite of the conductive areas are provided with connections 27 to 32 and bil each have a capacitive passage through the housing 1 for Hochfre frequency signals.

According to the invention, it is therefore possible in the simplest way to couple a plurality of high-frequency signals from a hermetically sealed housing. The coupling capacities provided for this purpose, which can be part of a circuit arrangement, can be adapted, for example, to the respective requirements with regard to their capacitance values in that the areas applied are chosen accordingly in terms of their area dimensions. Furthermore, it is possible to select the wall of the plastic part 2 as the dielectric we corresponding in its wall thickness.

An embodiment in which the coupling capacities are part of a circuit arrangement is shown in FIG. 3 in a schematic representation and as an equivalent circuit diagram. Parts that correspond to those of parts of FIGS. 1 and 2 are again provided with the same reference characters in this embodiment.

On the outer and inner surfaces 6 and 3 of the plastic part 2 there are layer regions 33 and 34 or 35 and 36 which, in a corresponding manner, form capacities for the contact-free implementation of high-frequency signals through a hermetically sealed housing 1 . In the interior of the housing 1 , the connection of the layer region 35 is connected to the connection of the layer region 36 via an inductor 37 . In terms of circuitry, a series resonance circuit is implemented in this way. The inductor 37 , for example a coil, can also be attached to the outside of the plastic part 2 .

While the exemplary embodiment in FIG. 3 is essentially shown as a schematic sectional illustration, FIG. 4a shows for this exemplary embodiment a representation with a viewing direction from the outside on the outer surface 6 , and FIG. 4b a representation with a viewing direction from the inside onto the inner surface 3 the housing 1 . In Fig. 4a, the surface areas 33 and 34 with corresponding connections 38 and 39 and in Fig. 4b, the surface areas 35 and 36 with the connections 40 and 41 are given again. The inductance 37 is realized on the inner surface of the plastic part 2 by meandering application of a line.

Apart from the practically negligible space requirement for this circuit arrangement due to the areal training on the Ge housing surfaces 6 and 3 , the fact that the capacitors or capacities already available for contactless implementation of the high-frequency signals is additionally used for a series resonance circuit without additional effort can be, the inductance 37 has only one applied to the housing surface 3 line structure. It is particularly advantageous in terms of production technology that the layer regions 35 and 36 on the one hand and the inductivity 37 on the other hand can be formed economically in a single operation, for example by vapor deposition or electroplating on the housing surface 3 .

In the embodiment shown in Fig. 5, the contact-free implementation of a high-frequency signal is carried out inductively by an inductor 51 and 52 is provided on the inner and outer surfaces 3 and 6 of the plastic part 2 , respectively, by the arrow as a double indicated magnetic coupling 53 a contact-free transmission of the high-frequency signals through the housing 1 takes place.

Fig. 6 shows the practical embodiment of Fig. 5 in a schematic representation and in the direction of view from the outside of the outer surface 6 of the Ge 1 . On the housing surface 6 between two Kontaktierungsflä surfaces 54 and 55, a layer region of conductive material is formed in a meandering shape, so that this results in a coil effect. The alternating magnetic field, which is generated when a high-frequency current flows, penetrates a corresponding meandering line structure, not shown, which is formed on the inner surface 3 of the plastic part 2 to form an inductance.

The structures, dimensions and embodiments of the layer areas for the inductors 51 and 52 applied to the housing surfaces 6 and 3 can be selected depending on the circuitry and structural needs and conditions. The respectively desired coil effect can be achieved by appropriate selection of the conductor structure applied. It is not necessary for the conductor structures on the inner and outer surfaces 3 and 6 of the plastic part 2 to be congruent with one another.

A further exemplary embodiment is explained below with reference to FIGS . 7 and 8, parts corresponding to those of previous figures also being provided with the same reference numerals in FIGS . 7 and 8.

The exemplary embodiment shown schematically in FIGS. 7 and 8 shows a resonance band filter circuit. The inductive signal transmission through the housing 1 takes place analogously to the embodiment shown in FIGS . 5 and 6 via inductors 51 and 52 , which are magnetically coupled, as indicated by the double arrow 53 . The connections or contacting surfaces 54 and 55 of the inductor 51 formed on the outer surface 6 are each connected to a capacitance 73 , which is accordingly parallel to the inductor 51 . The inductor 52 formed on the inner surface 3 of the plastic part 2 is connected with its connections or contacting surfaces 71 and 72 to the respective connection of a further capacitance 74 , so that the inductance 52 and the capacitance 74 lie parallel to one another. The circuit arrangement forms a resonance band filter structure.

FIG. 8 shows a structural exemplary embodiment of the schematic and equivalent circuit diagram-like representation, partially shown in section in FIG. 7, in the direction of view from the outside onto the outer surface 6 of the housing 1 . The inductance or coil 51 is formed in a corresponding manner, as was shown and described with reference to FIG. 6, in a meandering shape between the contacting surfaces 54 and 55 . In contrast to the arrangement shown in FIG. 6, the contact surface 54 is connected to a comb-like structure 81 , which is also formed on the outer surface 6 of the plastic part 2, for example by etching or mask evaporation. A corresponding came mer-like structure 82 , the comb lamellae of which protrude into the spaces between the comb lamellae of the comb structure 81 , is connected to the contacting surface 55 . Comb structures 81 and 82 form capacitance and capacitor 73, respectively.

On the inner surface 3 of the plastic part 2 , the meandering structures for the coil or inductor 52 and the comb structures for the capacitor or the capacitor 74 are formed in a corresponding manner. The respective structures on the inner and outer surfaces 3 and 6 do not have to be congruent with each other.

By appropriate selection of the conductor structure, the wall thickness and / or areas made of conductive material, it is possible to select the capacitance and / or inductance values accordingly and thereby adapt the coupling factor and the filter properties to the respective requirements. With this embodiment of the circuit according to the invention, he aimed resonance band filter circuit enables in a simple manner a galvanic separation of the circuit outside the housing 1 from the circuit inside the same.

The invention has been described with reference to preferred embodiments of the invention. However, numerous modifications and events are possible to the person skilled in the art without thereby departing from the inventive idea. For example, the embodiments shown in the figures and described using the same described embodiments can also be combined in whole or in part. Furthermore, it is possible to implement other circuit arrangements in the manner according to the invention by forming circuit components on the inner and / or outer surfaces 3 and 6 of a plastic part 2 .

Claims (14)

1. Housing with contact-free implementation of high-frequency signals, characterized in that the housing ( 1 ) has a plastic part ( 2 ) that at least part of the inner and outer surface ( 3 and 6 ) of the plastic part ( 2 ) with at least one layer area is made of conductive material and that a layer area is assigned to each signal connection. 2. Housing according to claim 1, characterized gekennzeicnet that the contact-free implementation of the high-frequency signals is carried out by a corresponding design of the layer areas by means of a capacitive coupling ( Fig. 1 to 3). 3. Housing according to claim 1 or 2, characterized in that the contact-free implementation of the high-frequency signals is carried out by appropriate design of the layer areas by means of an inductive coupling ( Fig. 5 to 8). 4. Housing according to one of claims 1 to 3, characterized in that on the inner and / or outer surface ( 3 or 6 ) of the plastic part ( 2 ) additional layer regions of conductive material are provided, which are part of at least one additional inductance ( 37 ) and / or capacitance ( 73 , 74 ) ( Fig. 3, 4a, 4b, 7, 8). 5. Housing according to claim 4, characterized in that the additional inductivities formed from layer areas of conductive materials ( 37 ) or capacitors ( 73 , 74 ) are part of a circuit arrangement inside and / or outside the housing ( 1 ). 6. Housing according to one of claims 1 to 5, characterized in that the structure and / or dimensioning of the layer areas conductive material depending on the desired capacity, Inductance and / or coupling values is selected. 7. Housing according to one of claims 1 to 6, characterized in that the wall thickness of the plastic part ( 2 ) at least at the layer areas provided with lei material is selected as a function of the desired capacitance, inductance and / or magnetic coupling values. 8. Housing according to one of claims 1 to 7, characterized in that the layer regions of conductive material are firmly applied to the inner and / or outer surface ( 3 or 6 ) of the plastic part ( 2 ). 9. Housing according to one of claims 1 to 8, characterized in that the layer areas of conductive material on the inner and / or outer surface ( 3 or 6 ) of the plastic part ( 2 ) are evaporated. 10. Housing according to one of claims 1 to 9, characterized in that the layer regions made of conductive material on the inner and / or outer surface ( 3 or 6 ) of the plastic part ( 2 ) are brought on galvanically. 11. Housing according to one of claims 1 to 10, characterized in that the layer areas of conductive material on the inner and / or outer surface ( 3 and 6 ) of the plastic part ( 2 ) are applied in the form of GE printed circuits. 12. Housing according to one of claims 1 to 11, characterized in that the structures of the layer regions made of conductive material on the inner and / or outer surface ( 3 and 6 ) of the plastic part ( 2 ) are formed by etching. 13. Housing according to one of claims 1 to 7, characterized in that the layer regions made of conductive material on the inner and / or outer surface ( 3 or 6 ) of the plastic part ( 2 ) are formed as selbständigi ge elenent ( Fig. 1) . 14. Housing according to one of claims 1 to 7 and 13, characterized in that the plastic part ( 2 ) at least partially from least at least one outer part ( 5 ; 24 , 25 ; 26 ) is made of conductive material ben ( Fig. 1 and 2).