DE3809211A1 - METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES - Google Patents

METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES

Info

Publication number
DE3809211A1
DE3809211A1 DE3809211A DE3809211A DE3809211A1 DE 3809211 A1 DE3809211 A1 DE 3809211A1 DE 3809211 A DE3809211 A DE 3809211A DE 3809211 A DE3809211 A DE 3809211A DE 3809211 A1 DE3809211 A1 DE 3809211A1
Authority
DE
Germany
Prior art keywords
laser radiation
radiation pulses
ablation
ultra
duration
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE3809211A
Other languages
German (de)
Inventor
Stephan Dipl Chem Kueper
Michael Dipl Phys Dr Stuke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Original Assignee
Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Max Planck Gesellschaft zur Foerderung der Wissenschaften eV filed Critical Max Planck Gesellschaft zur Foerderung der Wissenschaften eV
Priority to DE3809211A priority Critical patent/DE3809211A1/en
Priority to PCT/EP1989/000283 priority patent/WO1989008529A1/en
Publication of DE3809211A1 publication Critical patent/DE3809211A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B23K2103/42—Plastics
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

Fluoroplastics, for example PTFE, are ablated using laser pulses with a duration of 300 fs, a wavelength of 248 nm and a fluence between approximately 0.5 and 1 J/cm<2>. Under these conditions, the ablation rate is of the order of 1 micrometre per laser pulse.

Description

Es ist bekannt, daß eine saubere Ablation von Polymethyl­ methacrylat (PMMA) mit ultrakurzen UV-Laserstrahlungsimpulsen (Dauer 300 fs, Wellenlänge 248 nm) bewirkt werden kann (Appl. Phys. B 44, 199-204 (1987)).It is known that clean ablation of polymethyl methacrylate (PMMA) with ultra-short UV laser radiation pulses (Duration 300 fs, wavelength 248 nm) can be effected (Appl. Phys. B 44, 199-204 (1987)).

Es hat sich überraschenderweise gezeigt, daß mit ähnlichen Verfahrensparametern auch eine saubere Ablation von Fluorkunststoffen, wie PTFE, erreicht werden kann, obwohl dieser Polymertyp eine ganz andere chemische Konstitution hat und im Molekül wesentlich stärkere und stabilere Bindungen aufweist als PMMA.It has surprisingly been found that with similar Process parameters also a clean ablation of Fluoroplastics, such as PTFE, can be achieved, though this type of polymer has a completely different chemical constitution has and in the molecule much stronger and more stable bonds exhibits as PMMA.

Bei einer bevorzugten Ausführungsform der Erfindung wurden Excimerlaserimpulse mit einer Dauer von 300 fs und einer Wellenlänge von 248 nm mit einer Fluenz bis herunter zu 500 mJ/cm2 zum Abtragen (Ablatieren, Fotoätzen) einer vorher mit Methanol gereinigten und polierten Oberfläche eines Körpers aus im wesentlichen reinem PTFE verwendet. Die Impulsrate betrug 1 Hz, um thermische Effekte auszuschließen. Höhere Impulsraten (Wiederholungsfrequenzen), z. B. 25 Hz oder bis zu etwa 1 kHz und mehr sind ebenfalls möglich. Bei der Durchführung des oben beschriebenen Verfahrens wurde die Strahlung eines Femtosekunden-KrF-Excimer-Lasers durch eine Metallmaske und durch eine sphärische Quarz-Fokussierungslinse (f=200 mm) auf die Oberfläche des PTFE-Körpers gerichtet. Die Bestrahlung erfolgte in Luft. Die Ablationsrate steigt von einer Schwellenwert-Fluenz von etwa 300 mJ/cm2 bis etwa 1 J/cm2 rasch an und geht dann bei höheren Fluenzwerten in die Sättigung über. Der Fluenzschwellenwert ist dreimal so hoch wie bei PMMA unter den gleichen Bedingungen, was zeigt, daß PTFE eine höhere Photonenbelastung ohne Beeinträchtigung seiner chemischen Struktur aushält.In a preferred embodiment of the invention, excimer laser pulses with a duration of 300 fs and a wavelength of 248 nm with a fluence down to 500 mJ / cm 2 were used to remove (ablate, photoetch) a surface of a body previously cleaned and polished with methanol from im essential pure PTFE used. The pulse rate was 1 Hz to exclude thermal effects. Higher pulse rates (repetition frequencies), e.g. B. 25 Hz or up to about 1 kHz and more are also possible. When performing the method described above, the radiation of a femtosecond KrF excimer laser was directed through a metal mask and through a spherical quartz focusing lens (f = 200 mm) onto the surface of the PTFE body. The radiation was carried out in air. The ablation rate rises rapidly from a threshold fluence of about 300 mJ / cm 2 to about 1 J / cm 2 and then saturates at higher fluence values. The fluence threshold is three times that of PMMA under the same conditions, which shows that PTFE can withstand a higher photon load without affecting its chemical structure.

Die Abtragungstiefe ist eine im wesentlichen lineare Funktion der Anzahl der zur Einwirkung gebrachten Laserstrahlungs­ impulse und beträgt bei ca. 2 J/cm2 etwa 1 µm pro Strahlungspuls.The depth of ablation is an essentially linear function of the number of laser radiation pulses applied and is approximately 1 µm per radiation pulse at approximately 2 J / cm 2 .

Die einzige Figur der Zeichnung zeigt die Abtragungsrate in Mikrometer pro Laserstrahlungsimpuls in Abhängigkeit von der Fluenz in J/cm2.The only figure in the drawing shows the ablation rate in micrometers per laser radiation pulse as a function of the fluence in J / cm 2 .

Unter den angegebenen Bedingungen ergeben sich scharf definierte Vertiefungen mit relativ glattem Boden, der praktisch frei von festen Rückständen an den Rändern ist.Under the specified conditions, sharp results defined depressions with a relatively smooth bottom, the is practically free of solid residues at the edges.

Das oben beschriebene bevorzugte Ausführungsbeispiel läßt sich selbstverständlich abwandlen, ohne den Rahmen der Erfindung zu überschreiten. Im allgemeinen wird man jedoch Laserstrahlungsimpulse mit einer Dauer unter 1 Picosekunde, vorzugsweise unter 500 Femtosekunden verwenden. Für PTFE hat sich Laserstrahlung mit einer Wellenlänge von 248 nm gut bewährt. Annehmbare Ergebnisse werden sich jedoch auch mit UV-Strahlung anderer Wellenlängen, z. B. zwischen 150 und 350 nm, erzielen lassen. Die Fluenz kann bis zu 10 J/cm2, gegebenenfalls auch mehr, betragen.The preferred embodiment described above can of course be modified without exceeding the scope of the invention. In general, however, laser radiation pulses with a duration of less than 1 picosecond, preferably less than 500 femtoseconds, will be used. Laser radiation with a wavelength of 248 nm has proven itself well for PTFE. However, acceptable results will also be seen with UV radiation of other wavelengths, e.g. B. between 150 and 350 nm. The fluence can be up to 10 J / cm 2 , possibly even more.

Das oben beschriebene Verfahren und die oben beschriebene Einrichtung lassen sich auch zur Ablation von festen nichtmetallischen anorganischen Materialien, z. B. Alkalihalogenid-Kristallen, wie KBr, und von Zähnen, insbesondere Zahnschmelz verwenden.The method described above and the one described above Device can also be used for ablation of fixed non-metallic inorganic materials, e.g. B. Alkali halide crystals, such as KBr, and of teeth, especially use tooth enamel.

Claims (8)

1. Verfahren zur Ablation nichtmetallischer Materialien mittels ultrakurzer UV-Laserstrahlungsimpulse, dadurch gekennzeichnet, daß zur Ablation von Fluorkunststoffen, wie PTFE, Laserstrahlungsimpulse mit einer Dauer unter 1 ps und einer Wellenlänge unter 350 nm verwendet werden.1. A method for ablation of non-metallic materials by means of ultra-short UV laser radiation pulses, characterized in that laser radiation pulses with a duration of less than 1 ps and a wavelength of less than 350 nm are used for the ablation of fluoroplastics, such as PTFE. 2. Verfahren gemäß dem Oberbegriff des Anspruchs 1, dadurch gekennzeichnet, daß zur Ablation von anorganischen, nichtmetallischen Materialien, wie Zähnen und Alkali­ halogenid-Kristallen, Laserstrahlungsimpulse mit einer Dauer unter 1 ps und einer Wellenlänge unter 350 nm verwen­ det werden.2. The method according to the preamble of claim 1, characterized characterized in that for the ablation of inorganic, non-metallic materials such as teeth and alkali halide crystals, laser radiation pulses with a Use duration less than 1 ps and a wavelength less than 350 nm be det. 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Dauer unter 500 fs - verwendet werden.3. The method according to claim 1 or 2, characterized in that laser radiation pulses with a duration of less than 500 fs - be used. 4. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Dauer von etwa 300 fs verwendet werden.4. The method according to claim 1 or 2, characterized in that laser radiation pulses with a duration of about 300 fs be used. 5. Verfahren nach Anspruch 1, 2 3, oder 4, dadurch gekenn­ zeichnet, daß Laserstrahlungsimpulse mit einer Wellenlänge von etwa 250 nm verwendet werden.5. The method according to claim 1, 2 3, or 4, characterized records that laser radiation pulses with a wavelength of about 250 nm can be used. 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Fluenz über 300 mJ/cm2 verwendet werden. 6. The method according to any one of claims 1 to 5, characterized in that laser radiation pulses with a fluence above 300 mJ / cm 2 are used. 7. Verfahren nach Anspruch 6, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Fluenz bis etwa 10 J/cm2 verwendet werden.7. The method according to claim 6, characterized in that laser radiation pulses with a fluence up to about 10 J / cm 2 are used. 8. Verfahren nach einem der vorhergehenden Ansprüche, dadurch gekennzeichnet, daß Laserstrahlungsimpulse mit einer Pulsrate bis etwas 1 kHz verwendet werden.8. The method according to any one of the preceding claims, characterized in that laser radiation pulses with a pulse rate up to about 1 kHz can be used.
DE3809211A 1988-03-18 1988-03-18 METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES Withdrawn DE3809211A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE3809211A DE3809211A1 (en) 1988-03-18 1988-03-18 METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES
PCT/EP1989/000283 WO1989008529A1 (en) 1988-03-18 1989-03-17 Process for ablation of polymer plastics using ultra-short laser pulses

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE3809211A DE3809211A1 (en) 1988-03-18 1988-03-18 METHOD FOR ABLATION OF POLYMERIC PLASTICS BY MEANS OF ULTRA-SHORT LASER RADIATION PULSES

Publications (1)

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DE3809211A1 true DE3809211A1 (en) 1989-10-05

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DE (1) DE3809211A1 (en)
WO (1) WO1989008529A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4041884A1 (en) * 1990-12-27 1992-07-02 Abb Patent Gmbh METHOD FOR TREATING SURFACES
DE4219636A1 (en) * 1992-06-16 1993-12-23 Lsg Loet Und Schweisgeraete Gm Activating PTFE surfaces to enable adhesive bonding - by treatment with high energy ion beam
DE19549052C2 (en) * 1994-12-28 2002-09-19 Sumitomo Heavy Industries Microprocessing of polytetrafluoroethylene using synchrotron radiation
DE10029110B4 (en) * 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for material processing and use thereof
EP1707299A1 (en) * 2004-01-23 2006-10-04 Sumitomo Electric Industries, Ltd. Stretched polytetrafluoroethylene porous article having fine pores formed therein and method for production thereof, and method of ablation machining

Families Citing this family (12)

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Publication number Priority date Publication date Assignee Title
US4915981A (en) * 1988-08-12 1990-04-10 Rogers Corporation Method of laser drilling fluoropolymer materials
KR100190423B1 (en) * 1989-06-06 1999-06-01 기타지마 요시도시 Apparatus for repairing defects in emulsion masks by passing laser light through a variable shaped aperture
DE4118457A1 (en) * 1991-06-05 1992-12-10 Max Planck Gesellschaft METHOD FOR STORING INFORMATION IN AN OPTICALLY READABLE DATA STORAGE
DE4202074A1 (en) * 1992-01-25 1993-07-29 Audi Ag Removing lacquer from parts - by bombarding with laser beam
US5257706A (en) * 1992-09-29 1993-11-02 Bausch & Lomb Incorporated Method of cleaning laser ablation debris
US5359173A (en) * 1992-09-29 1994-10-25 Bausch & Lomb Incorporated Scanning technique for laser ablation
US5331131A (en) * 1992-09-29 1994-07-19 Bausch & Lomb Incorporated Scanning technique for laser ablation
US6489589B1 (en) * 1994-02-07 2002-12-03 Board Of Regents, University Of Nebraska-Lincoln Femtosecond laser utilization methods and apparatus and method for producing nanoparticles
IT1273373B (en) * 1994-03-04 1997-07-08 Smaltiriva S P A PROCEDURE FOR THE REMOVAL OF FLUOROCARBONIC RESIN COATINGS
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
DE19745294A1 (en) * 1997-10-14 1999-04-15 Biotronik Mess & Therapieg Process for the production of fine-structured medical technology implants
US9254536B2 (en) 2009-05-15 2016-02-09 Paul Hoff Method and apparatus for controlled laser ablation of material

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3501839A1 (en) * 1985-01-22 1986-07-24 Lambda Physik GmbH, 3400 Göttingen Method and device for stripping insulation off wires

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4041884A1 (en) * 1990-12-27 1992-07-02 Abb Patent Gmbh METHOD FOR TREATING SURFACES
DE4219636A1 (en) * 1992-06-16 1993-12-23 Lsg Loet Und Schweisgeraete Gm Activating PTFE surfaces to enable adhesive bonding - by treatment with high energy ion beam
DE19549052C2 (en) * 1994-12-28 2002-09-19 Sumitomo Heavy Industries Microprocessing of polytetrafluoroethylene using synchrotron radiation
DE10029110B4 (en) * 1999-06-15 2006-05-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Method for material processing and use thereof
EP1707299A1 (en) * 2004-01-23 2006-10-04 Sumitomo Electric Industries, Ltd. Stretched polytetrafluoroethylene porous article having fine pores formed therein and method for production thereof, and method of ablation machining
EP1707299A4 (en) * 2004-01-23 2009-03-18 Sumitomo Electric Industries Stretched polytetrafluoroethylene porous article having fine pores formed therein and method for production thereof, and method of ablation machining

Also Published As

Publication number Publication date
WO1989008529A1 (en) 1989-09-21

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