DE3733860A1 - Thin-film resistor - Google Patents

Thin-film resistor

Info

Publication number
DE3733860A1
DE3733860A1 DE19873733860 DE3733860A DE3733860A1 DE 3733860 A1 DE3733860 A1 DE 3733860A1 DE 19873733860 DE19873733860 DE 19873733860 DE 3733860 A DE3733860 A DE 3733860A DE 3733860 A1 DE3733860 A1 DE 3733860A1
Authority
DE
Germany
Prior art keywords
thin
film resistor
metal plates
resistance
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873733860
Other languages
German (de)
Inventor
Hans Georg Sander
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mannesmann VDO AG
Original Assignee
Mannesmann VDO AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mannesmann VDO AG filed Critical Mannesmann VDO AG
Priority to DE19873733860 priority Critical patent/DE3733860A1/en
Publication of DE3733860A1 publication Critical patent/DE3733860A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
    • G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
    • G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
    • G01F23/246—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Fluid Mechanics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Details Of Resistors (AREA)

Abstract

A thin-film resistor, especially a temperature-dependent thin-film resistor, for liquid-level sensors is specified. The thin-film resistor has a supporting film on which the resistance track, and possibly the conductor tracks (interconnects) are fitted in a flat manner and are provided at the end with connecting surfaces. Metal platelets are fitted as reinforcement to the connecting surfaces in order to connect the electrical power supply leads to the resistance track and the conductor tracks using a crimping technique. These metal platelets can be fitted by means of fitting machines and can be fastened by means of a conductive adhesive.

Description

Die Erfindung betrifft einen Dünnschichtwiderstand, insbesondere einen temperaturabhängigen Dünnschichtwiderstand für Flüssigkeitsniveaufühler nach dem Oberbegriff des Hauptanspruchs.The invention relates to a thin film resistor, in particular one temperature-dependent thin-film resistor for liquid level sensors according to the preamble of the main claim.

Dünnschichtwiderstände bestehen aus einem flächigen Substrat, z.B. einer Folie, auf das nach verschiedenartigen Verfahren die Widerstandbahn als dünne Schicht eines reinen Metalls oder einer Metallegierung aufgebracht wird. Diese Struktur wird durch beidseitiges Aufbringen einer weiteren Folie gegen Umgebungseinflüsse, z.B. gegen chemische Angriffe der zu überwachenden Flüssigkeit oder deren Dämpfe, geschützt.Thin film resistors consist of a flat substrate, e.g. one Foil, on which the resistance path as a thin layer of a pure metal or a metal alloy applied becomes. This structure is achieved by applying another on both sides Foil against environmental influences, e.g. against chemical attacks of the monitoring liquid or its vapors.

Zum Überwachen eines Flüssigkeitsniveaus werden temperaturabhängige Dünnschichtwiderstände durch einen konstanten Strom beaufschlagt. Im ausgetauchten Zustand erwärmen sie sich wegen der relativ schlechten Wärmeleitung von Luft, Gasen oder Dämpfen auf eine Temperatur oberhalb der Umgebungstemperatur, wobei der Widerstandwert in den hochohmigen Bereich gelangt, während beim Eintauchen in die Flüssigkeit durch die größere Wärmeableitung und Abkühlung der Widerstandswert niederohmig wird. Eine solche Widerstands-Temperatur-Charakteristik kennzeichnet Kaltleiter, auch PCT-Widerstände (Widerstände mit positivem Temperatur-Koeffizienten) genannt. Dabei ist es erwünscht, daß die Widerstandsänderung möglichst groß ist, um die Auswertung zu vereinfachen. Temperature levels are used to monitor a liquid level Thin film resistors acted on by a constant current. in the when immersed, they heat up due to the relatively poor Conduction of air, gases or vapors to a temperature above the Ambient temperature, the resistance value in the high-resistance range reaches while immersed in the liquid through the larger Heat dissipation and cooling the resistance value becomes low. A such resistance-temperature characteristics characterize PTC thermistors, too PCT resistors (resistors with positive temperature coefficient) called. It is desirable that the change in resistance be as large as possible is to simplify the evaluation.  

Bei der Verwendung von Reinmetall werden die auf die Folie aufgebrachten Widerstandsschichten sehr dünn. Dies erschwert die Anbringung von ausreichend festen Stromzuführungen.When using pure metal, the applied to the foil Resistance layers very thin. This makes it difficult to attach sufficiently firm power supplies.

Es ist bereits ein Widerstands-Temperatur-Sensor bekannt, bei dem auf einem Keramiksubstrat die Widerstandsbahnen in Dünnfilmtechnik und anschließend Anschlußflecke aus Gold oder einer Nickellegierung im Vakuum aufgebracht werden.A resistance temperature sensor is already known, in which on a Ceramic substrate the resistance tracks in thin film technology and then Gold or nickel alloy pads applied in a vacuum will.

Weiter ist ein flexibler Temperatur-Sensor zur Überwachung der Wicklungstemperatur eines Elektromotors bekannt, bei dem in nicht näher angegebener Weise Anschlußfahnen aus Kupfer mit dem Widerstandsdraht verbunden sind.There is also a flexible temperature sensor for monitoring the Winding temperature of an electric motor is known, in which in no more detail specified way lugs made of copper with the resistance wire are connected.

Der Erfindung liegt daher die Aufgabe zugrunde, einen Dünnschichtwiderstand der im Oberbegriff des Hauptanspruchs angegebenen Art so weiterzubilden, daß die Stromzuführungen in Crimp-Technik an die Widerstandsbahn anschließbar sind.The invention is therefore based on the object of a thin-film resistor of the kind specified in the preamble of the main claim, that the current leads in crimp technology to the resistance track can be connected.

Die Lösung dieser Aufgabe erfolgt mit den im kennzeichnenden Teil des Hauptanspruchs angegebenen Maßnahmen.This problem is solved with the in the characterizing part of the Measures specified in the main claim.

Dabei ist vorteilhaft, daß auf kostensteigernde galvanische Verfahren verzichtet werden kann. Weiter ist vorteilhaft, daß durch die erfindungsgemäße Ausgestaltung des Dünnschichtwiderstandes eine für die Massenfertigung geeignete Anschlußtechnik anwendbar ist.It is advantageous that the cost-increasing galvanic process can be dispensed with. It is also advantageous that through the Design of the thin film resistor according to the invention for Mass production suitable connection technology is applicable.

Weitere vorteilhafte Weiterbildungen und Ausgestaltungen eines Dünnschichtwiderstandes ergeben sich aus den Unteransprüchen.Further advantageous developments and refinements of a Thin film resistance result from the subclaims.

Dabei sind vorteilhaft die Metallplättchen mittels eines leitfähigen Klebers elektrisch leitend auf die Widerstands- und/oder Leiterbahnen aufgebracht. Vorteilhaft bestehen die Metallplättchen aus Kupfer oder einem anderen elektrisch gut leitenden Metall.The metal plates are advantageous by means of a conductive Adhesive electrically conductive on the resistance and / or conductor tracks upset. The metal plates advantageously consist of copper or a other electrically conductive metal.

Weiter ist vorteilhaft, daß die Metallplättchen in gleicher oder ähnlicher Technik verarbeitet werden können wie handelsübliche SMD-Bauteile. Dies schließt auch die automatische Bestückung mit ein. It is also advantageous that the metal plates in the same or similar Technology can be processed like commercial SMD components. This also includes the automatic assembly.  

Schließlich können weiter vorteilhaft die Anschlußleitungen an den durch die Metallplättchen verstärkten Anschlußflächen in Crimp-Technik elektrisch leitend angeschlossen sein.Finally, the connecting lines to the through can be advantageous the metal plates are electrically reinforced with crimp technology be connected.

Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Die einzige Figur zeigt in perspektivischer Darstellung als Ausschnitt das anschlußseitige Ende eines Dünnschichtwiderstandes nach einer Reihe von Fertigungsschritten.An embodiment of the invention is shown in the drawing and explained in more detail in the following description. The only figure shows in perspective as a cutout the connection end a thin film resistor after a series of manufacturing steps.

Auf einer Kunststoffolie 11 aus Polyimid, das unter dem Handelsnamen Kapton hergestellt und vertrieben wird, oder aus Polyester sind nach entsprechender Vorbehandlung durch eines der bekannten Verfahren Widerstandsbahnen 12, 13, 14 als dünne Schichten aufgebracht. Die Bahnen 12, 13 können die beiden Enden eines temperaturabhängigen Widerstandes darstellen, während die Widerstandsbahn 14 zu einem Überwachungssensor gehören kann. Sowohl die Widerstandsbahnen 12, 13 als auch die Widerstandsbahn 14 enden in Abschnitten gleicher Breite am Rand der Trägerfolie 11. Da die dünnen Schichten der Widerstandsbahnen 12, 13, 14 zum unmittelbaren Anschluß der Zuleitungen 15, 16, 17 nicht geeignet sind, sind an den für die Anschlüsse vorgesehenen Enden der Widerstandsbahnen 12, 13, 14 rechteckige Flecke 18, 19, 20 aus Kupfer oder einem anderen Metall aufgebracht. Diese Anschlußflecke 18, 19, 20 entsprechen in ihren wesentlichen Abmessungen sogenannten SMD-Bauteilen, die bereits in großem Umfang bei der Bestückung von elektronischen Schaltkreisen verwendet und durch Bestückungsautomaten verarbeitet werden. Diese SMD-Schaltelemente werden vor dem elektrischen Verbinden mit den Leiterbahnen der Druckleiterplatten durch einen geeigneten Klebstoff an ihrem Platz gehalten.Resistor tracks 12 , 13 , 14 are applied as thin layers on a plastic film 11 made of polyimide, which is manufactured and sold under the trade name Kapton, or of polyester after appropriate pretreatment by one of the known methods. The tracks 12 , 13 can represent the two ends of a temperature-dependent resistor, while the resistor track 14 can belong to a monitoring sensor. Both the resistance tracks 12 , 13 and the resistance track 14 end in sections of the same width at the edge of the carrier film 11 . Since the thin layers of the resistance tracks 12 , 13 , 14 are not suitable for the direct connection of the leads 15 , 16 , 17 , rectangular spots 18 , 19 , 20 made of copper or are at the ends of the resistance tracks 12 , 13 , 14 provided for the connections another metal. The essential dimensions of these connection pads 18 , 19 , 20 correspond to so-called SMD components, which are already used to a large extent in the assembly of electronic circuits and are processed by automatic assembly machines. These SMD switching elements are held in place by a suitable adhesive before being electrically connected to the conductor tracks of the printed circuit boards.

In ähnlicher Weise werden die Anschlußflecke 18, 19, 20 auf den Widerstandsbahnen 12, 13, 14 durch einen Leitkleber fixiert, bevor die stromführenden Anschlüsse 15, 16, 17 durch die Anschlußflecke hindurch in sogenannter Crimp-Technik durch Verklammern befestigt werden. Im Unterschied zu den bei der SMD-Technik verwendeten Klebern ist der für das Fixieren der Anschlußflecke 18, 19, 20 auf den Widerstandsbahnen 12, 13, 14 verwendete Kleber elektrisch leitend.In a similar way, the connection pads 18 , 19 , 20 are fixed on the resistance tracks 12 , 13 , 14 by means of a conductive adhesive, before the current-carrying connections 15 , 16 , 17 are fastened through the connection pads in a so-called crimping technique by means of clamping. In contrast to the adhesives used in SMD technology, the adhesive used for fixing the connection pads 18 , 19 , 20 on the resistance tracks 12 , 13 , 14 is electrically conductive.

Durch die mit Anschlußflecken 18, 19, 20 verstärkten Enden der in Dünnschichttechnik hergestellten Widerstandsbahnen 12, 13, 14 ist der kostensparende Einsatz von Crimp-Geräten in der Massenfertigung von Dünnschichtwiderständen möglich.The ends of the resistor tracks 12 , 13 , 14 , which are reinforced with connection pads 18 , 19 , 20 , enable the cost-saving use of crimping devices in the mass production of thin-film resistors.

Claims (5)

1. Dünnschichtwiderstand, insbesondere temperaturabhängiger Dünnschichtwiderstand für Flüssigkeitsniveaufühler, mit einer Trägerfolie, auf der die Widerstandsbahn und gegebenenfalls die Leiterbahnen flächig aufgebracht und am Ende mit Anschlußflächen versehen sind, dadurch gekennzeichnet, daß auf die Anschlußflächen Metallplättchen als Verstärkung aufgebracht sind.1. Thin-film resistor, in particular temperature-dependent thin-film resistor for liquid level sensors, with a carrier film on which the resistor track and, if appropriate, the conductor tracks are applied flatly and at the end are provided with connection pads, characterized in that metal plates are applied to the connection pads as reinforcement. 2. Dünnschichtwiderstand nach Anspruch 1, dadurch gekennzeichnet, daß die Metallplättchen mittels eines leitfähigen Klebers aufgebracht sind.2. Thin-film resistor according to claim 1, characterized in that the Metal plates are applied by means of a conductive adhesive. 3. Dünnschichtwiderstand nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Metallplättchen aus Kupfer bestehen.3. Thin-film resistor according to claim 1 or 2, characterized in that the metal plates are made of copper. 4. Dünnschichtwiderstand nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Metallplättchen in SMD-Technik verarbeitet, insbesondere automatisch bestückt, werden.4. Thin-film resistor according to one of claims 1 to 3, characterized characterized that the metal plates processed in SMD technology, especially automatically populated. 5. Dünnschichtwiderstand nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Anschlußleitungen an den durch die Metallplättchen verstärkten Anschlußflächen in Crimp-Technik elektrisch leitend angeschlossen sind.5. Thin-film resistor according to one of claims 1 to 4, characterized characterized in that the connecting lines to the through the Metal plates reinforced connection surfaces in crimp technology are electrically connected.
DE19873733860 1987-10-07 1987-10-07 Thin-film resistor Withdrawn DE3733860A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873733860 DE3733860A1 (en) 1987-10-07 1987-10-07 Thin-film resistor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873733860 DE3733860A1 (en) 1987-10-07 1987-10-07 Thin-film resistor

Publications (1)

Publication Number Publication Date
DE3733860A1 true DE3733860A1 (en) 1989-04-27

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Application Number Title Priority Date Filing Date
DE19873733860 Withdrawn DE3733860A1 (en) 1987-10-07 1987-10-07 Thin-film resistor

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DE (1) DE3733860A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2674953A1 (en) * 1991-04-08 1992-10-09 Jaeger Device for liquid level measurement with a resistive probe immersed in the liquid
CN108633176A (en) * 2017-03-24 2018-10-09 致伸科技股份有限公司 Has the wiring thin film structure of extended function

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2674953A1 (en) * 1991-04-08 1992-10-09 Jaeger Device for liquid level measurement with a resistive probe immersed in the liquid
CN108633176A (en) * 2017-03-24 2018-10-09 致伸科技股份有限公司 Has the wiring thin film structure of extended function

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