DE3733860A1 - Thin-film resistor - Google Patents
Thin-film resistorInfo
- Publication number
- DE3733860A1 DE3733860A1 DE19873733860 DE3733860A DE3733860A1 DE 3733860 A1 DE3733860 A1 DE 3733860A1 DE 19873733860 DE19873733860 DE 19873733860 DE 3733860 A DE3733860 A DE 3733860A DE 3733860 A1 DE3733860 A1 DE 3733860A1
- Authority
- DE
- Germany
- Prior art keywords
- thin
- film resistor
- metal plates
- resistance
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 7
- 230000001070 adhesive effect Effects 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 230000001419 dependent effect Effects 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims abstract description 3
- 230000002787 reinforcement Effects 0.000 claims abstract 2
- 238000005516 engineering process Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 4
- 238000002788 crimping Methods 0.000 abstract description 3
- 239000011888 foil Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
- G01F23/00—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm
- G01F23/22—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water
- G01F23/24—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid
- G01F23/246—Indicating or measuring liquid level or level of fluent solid material, e.g. indicating in terms of volume or indicating by means of an alarm by measuring physical variables, other than linear dimensions, pressure or weight, dependent on the level to be measured, e.g. by difference of heat transfer of steam or water by measuring variations of resistance of resistors due to contact with conductor fluid thermal devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/1406—Terminals or electrodes formed on resistive elements having positive temperature coefficient
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/021—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient formed as one or more layers or coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Fluid Mechanics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Details Of Resistors (AREA)
Abstract
Description
Die Erfindung betrifft einen Dünnschichtwiderstand, insbesondere einen temperaturabhängigen Dünnschichtwiderstand für Flüssigkeitsniveaufühler nach dem Oberbegriff des Hauptanspruchs.The invention relates to a thin film resistor, in particular one temperature-dependent thin-film resistor for liquid level sensors according to the preamble of the main claim.
Dünnschichtwiderstände bestehen aus einem flächigen Substrat, z.B. einer Folie, auf das nach verschiedenartigen Verfahren die Widerstandbahn als dünne Schicht eines reinen Metalls oder einer Metallegierung aufgebracht wird. Diese Struktur wird durch beidseitiges Aufbringen einer weiteren Folie gegen Umgebungseinflüsse, z.B. gegen chemische Angriffe der zu überwachenden Flüssigkeit oder deren Dämpfe, geschützt.Thin film resistors consist of a flat substrate, e.g. one Foil, on which the resistance path as a thin layer of a pure metal or a metal alloy applied becomes. This structure is achieved by applying another on both sides Foil against environmental influences, e.g. against chemical attacks of the monitoring liquid or its vapors.
Zum Überwachen eines Flüssigkeitsniveaus werden temperaturabhängige Dünnschichtwiderstände durch einen konstanten Strom beaufschlagt. Im ausgetauchten Zustand erwärmen sie sich wegen der relativ schlechten Wärmeleitung von Luft, Gasen oder Dämpfen auf eine Temperatur oberhalb der Umgebungstemperatur, wobei der Widerstandwert in den hochohmigen Bereich gelangt, während beim Eintauchen in die Flüssigkeit durch die größere Wärmeableitung und Abkühlung der Widerstandswert niederohmig wird. Eine solche Widerstands-Temperatur-Charakteristik kennzeichnet Kaltleiter, auch PCT-Widerstände (Widerstände mit positivem Temperatur-Koeffizienten) genannt. Dabei ist es erwünscht, daß die Widerstandsänderung möglichst groß ist, um die Auswertung zu vereinfachen. Temperature levels are used to monitor a liquid level Thin film resistors acted on by a constant current. in the when immersed, they heat up due to the relatively poor Conduction of air, gases or vapors to a temperature above the Ambient temperature, the resistance value in the high-resistance range reaches while immersed in the liquid through the larger Heat dissipation and cooling the resistance value becomes low. A such resistance-temperature characteristics characterize PTC thermistors, too PCT resistors (resistors with positive temperature coefficient) called. It is desirable that the change in resistance be as large as possible is to simplify the evaluation.
Bei der Verwendung von Reinmetall werden die auf die Folie aufgebrachten Widerstandsschichten sehr dünn. Dies erschwert die Anbringung von ausreichend festen Stromzuführungen.When using pure metal, the applied to the foil Resistance layers very thin. This makes it difficult to attach sufficiently firm power supplies.
Es ist bereits ein Widerstands-Temperatur-Sensor bekannt, bei dem auf einem Keramiksubstrat die Widerstandsbahnen in Dünnfilmtechnik und anschließend Anschlußflecke aus Gold oder einer Nickellegierung im Vakuum aufgebracht werden.A resistance temperature sensor is already known, in which on a Ceramic substrate the resistance tracks in thin film technology and then Gold or nickel alloy pads applied in a vacuum will.
Weiter ist ein flexibler Temperatur-Sensor zur Überwachung der Wicklungstemperatur eines Elektromotors bekannt, bei dem in nicht näher angegebener Weise Anschlußfahnen aus Kupfer mit dem Widerstandsdraht verbunden sind.There is also a flexible temperature sensor for monitoring the Winding temperature of an electric motor is known, in which in no more detail specified way lugs made of copper with the resistance wire are connected.
Der Erfindung liegt daher die Aufgabe zugrunde, einen Dünnschichtwiderstand der im Oberbegriff des Hauptanspruchs angegebenen Art so weiterzubilden, daß die Stromzuführungen in Crimp-Technik an die Widerstandsbahn anschließbar sind.The invention is therefore based on the object of a thin-film resistor of the kind specified in the preamble of the main claim, that the current leads in crimp technology to the resistance track can be connected.
Die Lösung dieser Aufgabe erfolgt mit den im kennzeichnenden Teil des Hauptanspruchs angegebenen Maßnahmen.This problem is solved with the in the characterizing part of the Measures specified in the main claim.
Dabei ist vorteilhaft, daß auf kostensteigernde galvanische Verfahren verzichtet werden kann. Weiter ist vorteilhaft, daß durch die erfindungsgemäße Ausgestaltung des Dünnschichtwiderstandes eine für die Massenfertigung geeignete Anschlußtechnik anwendbar ist.It is advantageous that the cost-increasing galvanic process can be dispensed with. It is also advantageous that through the Design of the thin film resistor according to the invention for Mass production suitable connection technology is applicable.
Weitere vorteilhafte Weiterbildungen und Ausgestaltungen eines Dünnschichtwiderstandes ergeben sich aus den Unteransprüchen.Further advantageous developments and refinements of a Thin film resistance result from the subclaims.
Dabei sind vorteilhaft die Metallplättchen mittels eines leitfähigen Klebers elektrisch leitend auf die Widerstands- und/oder Leiterbahnen aufgebracht. Vorteilhaft bestehen die Metallplättchen aus Kupfer oder einem anderen elektrisch gut leitenden Metall.The metal plates are advantageous by means of a conductive Adhesive electrically conductive on the resistance and / or conductor tracks upset. The metal plates advantageously consist of copper or a other electrically conductive metal.
Weiter ist vorteilhaft, daß die Metallplättchen in gleicher oder ähnlicher Technik verarbeitet werden können wie handelsübliche SMD-Bauteile. Dies schließt auch die automatische Bestückung mit ein. It is also advantageous that the metal plates in the same or similar Technology can be processed like commercial SMD components. This also includes the automatic assembly.
Schließlich können weiter vorteilhaft die Anschlußleitungen an den durch die Metallplättchen verstärkten Anschlußflächen in Crimp-Technik elektrisch leitend angeschlossen sein.Finally, the connecting lines to the through can be advantageous the metal plates are electrically reinforced with crimp technology be connected.
Ein Ausführungsbeispiel der Erfindung ist in der Zeichnung dargestellt und in der nachfolgenden Beschreibung näher erläutert. Die einzige Figur zeigt in perspektivischer Darstellung als Ausschnitt das anschlußseitige Ende eines Dünnschichtwiderstandes nach einer Reihe von Fertigungsschritten.An embodiment of the invention is shown in the drawing and explained in more detail in the following description. The only figure shows in perspective as a cutout the connection end a thin film resistor after a series of manufacturing steps.
Auf einer Kunststoffolie 11 aus Polyimid, das unter dem Handelsnamen Kapton hergestellt und vertrieben wird, oder aus Polyester sind nach entsprechender Vorbehandlung durch eines der bekannten Verfahren Widerstandsbahnen 12, 13, 14 als dünne Schichten aufgebracht. Die Bahnen 12, 13 können die beiden Enden eines temperaturabhängigen Widerstandes darstellen, während die Widerstandsbahn 14 zu einem Überwachungssensor gehören kann. Sowohl die Widerstandsbahnen 12, 13 als auch die Widerstandsbahn 14 enden in Abschnitten gleicher Breite am Rand der Trägerfolie 11. Da die dünnen Schichten der Widerstandsbahnen 12, 13, 14 zum unmittelbaren Anschluß der Zuleitungen 15, 16, 17 nicht geeignet sind, sind an den für die Anschlüsse vorgesehenen Enden der Widerstandsbahnen 12, 13, 14 rechteckige Flecke 18, 19, 20 aus Kupfer oder einem anderen Metall aufgebracht. Diese Anschlußflecke 18, 19, 20 entsprechen in ihren wesentlichen Abmessungen sogenannten SMD-Bauteilen, die bereits in großem Umfang bei der Bestückung von elektronischen Schaltkreisen verwendet und durch Bestückungsautomaten verarbeitet werden. Diese SMD-Schaltelemente werden vor dem elektrischen Verbinden mit den Leiterbahnen der Druckleiterplatten durch einen geeigneten Klebstoff an ihrem Platz gehalten.Resistor tracks 12 , 13 , 14 are applied as thin layers on a plastic film 11 made of polyimide, which is manufactured and sold under the trade name Kapton, or of polyester after appropriate pretreatment by one of the known methods. The tracks 12 , 13 can represent the two ends of a temperature-dependent resistor, while the resistor track 14 can belong to a monitoring sensor. Both the resistance tracks 12 , 13 and the resistance track 14 end in sections of the same width at the edge of the carrier film 11 . Since the thin layers of the resistance tracks 12 , 13 , 14 are not suitable for the direct connection of the leads 15 , 16 , 17 , rectangular spots 18 , 19 , 20 made of copper or are at the ends of the resistance tracks 12 , 13 , 14 provided for the connections another metal. The essential dimensions of these connection pads 18 , 19 , 20 correspond to so-called SMD components, which are already used to a large extent in the assembly of electronic circuits and are processed by automatic assembly machines. These SMD switching elements are held in place by a suitable adhesive before being electrically connected to the conductor tracks of the printed circuit boards.
In ähnlicher Weise werden die Anschlußflecke 18, 19, 20 auf den Widerstandsbahnen 12, 13, 14 durch einen Leitkleber fixiert, bevor die stromführenden Anschlüsse 15, 16, 17 durch die Anschlußflecke hindurch in sogenannter Crimp-Technik durch Verklammern befestigt werden. Im Unterschied zu den bei der SMD-Technik verwendeten Klebern ist der für das Fixieren der Anschlußflecke 18, 19, 20 auf den Widerstandsbahnen 12, 13, 14 verwendete Kleber elektrisch leitend.In a similar way, the connection pads 18 , 19 , 20 are fixed on the resistance tracks 12 , 13 , 14 by means of a conductive adhesive, before the current-carrying connections 15 , 16 , 17 are fastened through the connection pads in a so-called crimping technique by means of clamping. In contrast to the adhesives used in SMD technology, the adhesive used for fixing the connection pads 18 , 19 , 20 on the resistance tracks 12 , 13 , 14 is electrically conductive.
Durch die mit Anschlußflecken 18, 19, 20 verstärkten Enden der in Dünnschichttechnik hergestellten Widerstandsbahnen 12, 13, 14 ist der kostensparende Einsatz von Crimp-Geräten in der Massenfertigung von Dünnschichtwiderständen möglich.The ends of the resistor tracks 12 , 13 , 14 , which are reinforced with connection pads 18 , 19 , 20 , enable the cost-saving use of crimping devices in the mass production of thin-film resistors.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873733860 DE3733860A1 (en) | 1987-10-07 | 1987-10-07 | Thin-film resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873733860 DE3733860A1 (en) | 1987-10-07 | 1987-10-07 | Thin-film resistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3733860A1 true DE3733860A1 (en) | 1989-04-27 |
Family
ID=6337785
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19873733860 Withdrawn DE3733860A1 (en) | 1987-10-07 | 1987-10-07 | Thin-film resistor |
Country Status (1)
| Country | Link |
|---|---|
| DE (1) | DE3733860A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2674953A1 (en) * | 1991-04-08 | 1992-10-09 | Jaeger | Device for liquid level measurement with a resistive probe immersed in the liquid |
| CN108633176A (en) * | 2017-03-24 | 2018-10-09 | 致伸科技股份有限公司 | Thin film circuit structure with expansion function |
-
1987
- 1987-10-07 DE DE19873733860 patent/DE3733860A1/en not_active Withdrawn
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2674953A1 (en) * | 1991-04-08 | 1992-10-09 | Jaeger | Device for liquid level measurement with a resistive probe immersed in the liquid |
| CN108633176A (en) * | 2017-03-24 | 2018-10-09 | 致伸科技股份有限公司 | Thin film circuit structure with expansion function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0972288B1 (en) | Method for producing a sensor arrangement for measuring temperature | |
| DE4339551C1 (en) | Resistor, constructed as a surface-mounted device, and method for its production, as well as a printed circuit board having such a resistor | |
| DE19640058C2 (en) | Printed circuit board with strain relief for connection cables, processes for their manufacture and connection and their use | |
| DE102009029476B4 (en) | Electronic device for switching currents and manufacturing method for the same | |
| DE3910861C2 (en) | Organic PTC thermistor | |
| DE19648199A1 (en) | Detecting cooking point of cooking position with conducting track temp. sensor | |
| DE102016014130B3 (en) | Current measuring device | |
| EP0809094A1 (en) | Method for making a sensor device for temperature measurement | |
| EP2435797A2 (en) | Sensor element | |
| DE3939165C1 (en) | Temp. sensor with measurement resistance - has ceramic disk with thin metallic coating as resistance layer, and plastic sheet conductor plate | |
| EP0905493B1 (en) | Electrical sensor, especially temperature sensor, with printed circuit board | |
| DE19633486C1 (en) | Manufacturing method for circuit board with thin conduction paths and good solderable connection-contact regions e.g for measurement resistor or heating element | |
| DE10315519B4 (en) | Temperature sensing element and provided with the same circuit substrate | |
| DE69733806T2 (en) | METHOD FOR ATTACHING AN ELECTRIC CONTACT ON A CERAMIC LAYER AND A RESISTANCE ELEMENT CREATED THEREFOR | |
| DE3733860A1 (en) | Thin-film resistor | |
| EP0185244A1 (en) | Electrical power component | |
| EP0484756A2 (en) | SMD-type resistor arrangement | |
| DE102011121902B9 (en) | Resistance for measuring an electrical current | |
| DE102015214628A1 (en) | Heating device for a household appliance | |
| EP0555668A1 (en) | Printed circuit board for electronical power circuit containing power semiconductors | |
| DE102014107742B4 (en) | Precharge module and precharge circuit | |
| DE102017208147B4 (en) | Electronic component and circuit board with this electronic component | |
| DE102011103828B4 (en) | Mass production of small temperature sensors with flip chips | |
| WO2000047965A1 (en) | Compensating element for a sensor | |
| DE102014220480A1 (en) | Device and method for current measurement in a printed conductor of a printed circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |