DE3713298A1 - Plastic packaging for semiconductor components with spacing projections - Google Patents

Plastic packaging for semiconductor components with spacing projections

Info

Publication number
DE3713298A1
DE3713298A1 DE19873713298 DE3713298A DE3713298A1 DE 3713298 A1 DE3713298 A1 DE 3713298A1 DE 19873713298 DE19873713298 DE 19873713298 DE 3713298 A DE3713298 A DE 3713298A DE 3713298 A1 DE3713298 A1 DE 3713298A1
Authority
DE
Germany
Prior art keywords
housing
plastic housing
elevations
semiconductor components
plastic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19873713298
Other languages
German (de)
Inventor
Helmut Schultz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefunken Electronic GmbH
Original Assignee
Telefunken Electronic GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefunken Electronic GmbH filed Critical Telefunken Electronic GmbH
Priority to DE19873713298 priority Critical patent/DE3713298A1/en
Publication of DE3713298A1 publication Critical patent/DE3713298A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10439—Position of a single component
    • H05K2201/10454—Vertically mounted
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10568—Integral adaptations of a component or an auxiliary PCB for mounting, e.g. integral spacer element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10651—Component having two leads, e.g. resistor, capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10696—Single-in-line [SIL] package
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

In order to achieve a defined spacing between the semiconductor chip area and the semiconductor components mounted on the latter, protrusions built into the housing are arranged, according to the invention, on the lower packaging area of the semiconductor component.

Description

Die Erfindung betrifft Kunststoffgehäuse für Halbleiter­ bauelemente zur Bestückung von Schaltplatinen.The invention relates to plastic housings for semiconductors components for assembling circuit boards.

Kunststoffgehäuse von integrierten Halbleiterbauelemen­ ten sowie von diskreten Einzelbauelementen werden auf Platinen oder Schaltkarten derartig aufgesetzt und mit diesen verlötet, daß zwischen der unteren Gehäusefläche und der Platinen- bzw. Schaltkartenoberfläche ein Ab­ stand von mindestens 0,5 mm entsteht, dadurch realisiert, daß an den Gehäuseanschlüssen der Halbleiterelemente Aufsetzkanten angebracht werden.Plastic housing of integrated semiconductor components as well as discrete individual components Boards or circuit cards placed in this way and with this soldered that between the lower case surface and the board or circuit board surface an Ab stand of at least 0.5 mm, realized, that at the housing connections of the semiconductor elements Touch-down edges are attached.

Mit diesem Verfahren ist es nicht möglich, einen defi­ nierten Abstand zu realisieren, da dieser von der Größe der zur Durchführung der Gehäuseanschlüsse vorgesehenen Bohrlöcher in der Platine abhängt. Außerdem besteht die Gefahr, daß bei breiten Aufsetzkanten Kurzschlüsse zwi­ schen den Gehäuseanschlüssen des Halbleiterbauelementes beim automatischen Verlöten und Verzinnen entstehen. Darüber hinaus ist dieses Verfahren dann von Nachteil, wenn z. B. bei dual-in-line Gehäusen die Gehäuseanschlüs­ se aufgespreizt sind und dadurch unzulässige Drücke auf das Gehäuse zu Schäden - insbesondere beim automatischen Bestücken - führen können.
With this method, it is not possible to realize a defined distance, since this depends on the size of the holes provided in the board for making the housing connections. In addition, there is a risk that with wide contact edges, short circuits between the housing connections of the semiconductor component occur during automatic soldering and tinning. In addition, this method is disadvantageous if, for. B. in dual-in-line housings, the housing connections are spread out and thus impermissible pressures on the housing can lead to damage - especially during automatic assembly.

Der Erfindung liegt die Aufgabe zugrunde, ein Kunststoff­ gehäuse für ein Halbleiterbauelement anzugeben, bei dem ein definierter Abstand zur Schaltplatine gewährleistet ist, so daß die o. g. Nachteile vermieden werden.The invention has for its object a plastic Specify housing for a semiconductor device in which a defined distance to the circuit board is guaranteed is, so that the o. g. Disadvantages are avoided.

Diese Aufgabe wird bei einem Kunststoffgehäuse für Halb­ leiterbauelemente der eingangs beschriebenen Art erfin­ dungsgemäß dadurch gelöst, daß auf der der Montagefläche der Schaltplatine zugewandten unteren Kunststoffgehäuse­ fläche zur Realisierung eines definierten Abstandes zwi­ schen dieser unteren Kunststoffgehäusefläche und der Montagefläche mindestens eine, in das Gehäuse integrier­ te Erhebung angeordnet ist.This task is done with a plastic case for half conductor components of the type described in the beginning appropriately solved in that on the mounting surface the lower plastic housing facing the circuit board area to realize a defined distance between this lower plastic housing surface and the Mounting surface at least one, integrated into the housing te survey is arranged.

Durch dieses Verfahren wird immer der gleiche Abstand, entsprechend der Höhe der Erhebungen bzw. der Abstands­ nocken, zwischen dem Gehäuse und der Platine exakt ein­ gehalten, wobei auch, insbesondere bei dual-in-line Ge­ häusen, eine schiefe Einbaulage vermieden wird. Zudem erlaubt das Verfahren eine schmalere Ausführung der An­ schlußbeine, wobei dies zu zusätzlicher Sicherheit bei Feuchtebeanspruchungen und damit zur Vermeidung von Kurz­ schlüssen führt. In vorteilhafter Weise werden die Ab­ standsnocken gleichzeitig mit dem Gehäuse gemoldet oder gespritzt, so daß keine zusätzlichen Produktionskosten entstehen.With this procedure the distance is always the same, according to the height of the surveys or the distance cam exactly between the housing and the circuit board kept, whereby also, especially with dual-in-line Ge houses, an inclined installation position is avoided. In addition the procedure allows a narrower execution of the type collarbones, which adds to safety Moisture stresses and thus to avoid short leads to conclusions. Advantageously, the Ab standing cams molded at the same time as the housing or sprayed, so no additional production costs arise.

Weitere vorteilhafte Ausgestaltungen der Erfindung er­ geben sich aus den Unteransprüchen.He further advantageous embodiments of the invention give themselves from the subclaims.

Ausführungsbeispiele der Erfindung sollen anhand der folgenden Zeichnungen näher beschrieben werden, wobei für gleichartige Teile in den verschiedenen Figuren glei­ che Bezugszeichen gewählt wurden. Embodiments of the invention are based on the following drawings are described in more detail, wherein same for similar parts in the different figures che reference numerals were chosen.  

Fig. 1 zeigt in perspektivischer Draufsicht ein auf einer Platine montiertes sechspoliges dual-in-line Ge­ häuse in erfindungsgemäßer Ausführung. Fig. 1 shows a perspective top view of a six-pole dual-in-line Ge housing mounted on a circuit board in the inventive design.

Fig. 2 zeigt im Schnitt das dual-in-line Gehäuse in erfindungsgemäßer Ausführung nach Fig. 1. FIG. 2 shows in section the dual-in-line housing in the embodiment according to the invention according to FIG. 1.

Fig. 3 zeigt in perspektivischer Ansicht die Unterseite des dual-in-line Gehäuses in erfindungsgemäßer Ausfüh­ rung nach Fig. 1 und 2. Fig. 3 shows in perspective view the bottom of the dual-in-line housing in accordance with the invention exporting tion according to Fig. 1 and 2.

Fig. 4 zeigt in perspektivischer Ansicht die Unterseite eines Gehäuses, dessen Erhebungen und die Gehäusean­ schlüsse an einer gemeinsamen Kunststoffgehäusefläche angeordnet sind, in erfindungsgemäßer Ausführung. Fig. 4 shows a perspective view of the underside of a housing, the elevations and the housing connections are arranged on a common plastic housing surface, in the inventive design.

Fig. 5 zeigt in perspektivischer Draufsicht ein auf einer Platine montiertes Gehäuse in erfindungsgemäßer Ausführung gemäß Fig. 4. FIG. 5 shows a perspective top view of a housing mounted on a circuit board in the embodiment according to FIG. 4.

Fig. 6 zeigt in perspektivischer Ansicht die Unterseite eines zylinderförmigen Gehäuses mit mesaförmiger bzw. dachförmiger Erhebung. Fig. 6, the bottom shows a perspective view of a cylindrical housing with mesa-shaped or roof-shaped elevation.

Fig. 7 zeigt in eine Seitenansicht das auf einer Plati­ ne montierte Gehäuse in erfindungsgemäßer Ausführung nach Fig. 6. Fig. 7 shows a side view of the mounted on a Plati ne housing in the inventive embodiment of FIG. 6th

Das in den Fig. 1-3 gezeigte sechspolige dual-in-line Kunststoffgehäuse 1 ist mit seinen Gehäuseanschlüssen 2 in die Bohrungen 6 eines Ausschnittes einer Platine 5 mit Lötzinn 7 gemäß Fig. 1 eingelötet. Zwei der erfin­ dungsgemäßen Abstandsnocken 3 sind in dieser Figur sicht­ bar, wobei die Erhebungen und die Gehäuseanschlüsse an verschiedenen Gehäuseflächen angeordnet sind. Außerdem sind die sonst üblichen Aufsetzkanten an den Gehäusean­ schlüssen 2 nicht mehr vorhanden. In der Schnittdarstel­ lung nach Fig. 2 ist die abstandshaltende Funktion der auf der Unterseite 4 angeordneten halbkugelförmigen Er­ hebungen 3 deutlich zu sehen. Weiterhin ist vorteilhaft zu erkennen, daß beim Bestücken kein Druck mehr auf die sich zwischen dem Gehäuse 1 und den Gehäuseanschlüssen 2 befindende Übergangsstelle 9 ausgeübt wird, sondern die­ ser vom Gehäuse selbst aufgefangen wird. In der Fig. 3 sind die vier in den Ecken der Unterseite 4 des Kunst­ stoffgehäuses 1 angeordneten Abstandsnocken 3 sichtbar, wodurch die Parallelität der Unterseite 4 des Kunststoff­ gehäuses 1 zur Oberfläche 8 der Platine 5 im eingebauten Zustand gewährleistet ist. Diese Parallelität kann auch durch drei Erhebungen, die eine Standfläche bilden, er­ reicht werden, wobei beispielsweise zwei Erhebungen in benachbarten Ecken der unteren Gehäuseflächen liegen und die dritte Erhebung in der Mitte des diesen Ecken gegen­ überliegenden Randes angeordnet ist. Die Erhebungen 3 sind in das Gehäuse 1 integriert und können gleichzeitig mit dem Gehäuse 1 gemoldet oder gespritzt werden.The six-pole dual-in-line plastic housing 1 shown in FIGS. 1-3 is soldered with its housing connections 2 into the bores 6 of a section of a circuit board 5 with solder 7 according to FIG. 1. Two of the spacer cams 3 according to the invention are visible in this figure, the elevations and the housing connections being arranged on different housing surfaces. In addition, the usual contact edges on the housing connections 2 are no longer available. In the Schnittdarstel development according to FIG. 2, the distance-maintaining function of the semi-spherical arranged on the underside 4 He surveys 3 clearly visible. Furthermore, it can advantageously be seen that when fitting no more pressure is exerted on the transition point 9 located between the housing 1 and the housing connections 2 , but that the water is caught by the housing itself. Is shown in FIG. 3, four in the corners of the bottom 4 of the plastics housing 1 arranged spacer elements 3 are visible, whereby the parallelism of the bottom 4 of the plastics housing 1 ensures to the surface 8 of the board 5 in the installed state. This parallelism can also be achieved by three elevations which form a standing surface, two elevations, for example, being located in adjacent corners of the lower housing surfaces and the third elevation being arranged in the middle of the edge opposite these corners. The elevations 3 are integrated in the housing 1 and can be molded or molded simultaneously with the housing 1 .

Eine weitere vorteilhafte Anwendung der Erfindung zeigen die Fig. 4 und 5. An der Unterseite 4 eines quader­ förmigen und schlanken Gehäuses 1 befinden sich zwei mesaförmige, dach- oder keilförmige Erhebungen 3, wobei auch die Gehäuseanschlüsse 2 auf der Unterseite 4 in einer Reihe angeordnet sind. Je eine Erhebung 3 befindet sich am schmalen Rand der Unterseite 4 des Gehäuses 1. Bei keilförmigen Erhebungen kann zur Erhöhung der Stand­ festigkeit die Längsausdehnung der Keile senkrecht zur Ebene, in der die Gehäuseanschlüsse 2 liegen, angeordnet werden. A further advantageous application of the invention is shown in FIGS . 4 and 5. On the underside 4 of a cuboid and slim housing 1 there are two mesa-shaped, roof-shaped or wedge-shaped elevations 3 , the housing connections 2 also being arranged in a row on the underside 4 are. One elevation 3 each is located on the narrow edge of the underside 4 of the housing 1 . In the case of wedge-shaped elevations, the longitudinal extent of the wedges can be arranged perpendicular to the plane in which the housing connections 2 lie, in order to increase the stability.

Die Fig. 6 bis 8 zeigen eine weitere Ausgestaltung und Anwendung der Erfindung. Im Mittelpunkt einer kreis­ förmigen Unterseite 4 eines zylindrischen Gehäuses 1 ist eine mesaförmige oder keilförmige Erhebung 3 ange­ ordnet. Insbesondere zeigt die Fig. 8 den Vorteil der erfindungsgemäßen Anordnung der mesaförmigen Erhebung, die darin besteht, daß das Gehäuse 1 so auf der Platine 5 montiert werden kann, daß die Unterseite 4 parallel zur Oberfläche 8 liegt, wodurch das Gehäuse 1 genau senk­ recht auf der Platine 5 steht. FIGS. 6 to 8 show a further embodiment and application of the invention. At the center of a circular underside 4 of a cylindrical housing 1 is a mesa-shaped or wedge-shaped elevation 3 is arranged. In particular, Fig. 8 shows the advantage of the arrangement of the mesa-shaped elevation according to the invention, which consists in the fact that the housing 1 can be mounted on the circuit board 5 so that the underside 4 is parallel to the surface 8 , whereby the housing 1 is exactly perpendicular the board 5 is.

Claims (7)

1. Kunststoffgehäuse für Halbleiterbauelemente zur Bestückung von Schaltplatinen, dadurch gekennzeichnet, daß auf der der Montage­ fläche (8) der Schaltplatine (5) zugewandten unteren Kunststoff­ gehäusefläche (4) zur Realisierung eines definierten Abstandes zwischen dieser unteren Kunststoffgehäusefläche (4) und der Montage­ fläche (8) mindestens eine, in das Gehäuse (1) integrierte Erhebung (3), angeordnet ist.1. Plastic housing for semiconductor components for the assembly of circuit boards, characterized in that on the mounting surface ( 8 ) of the circuit board ( 5 ) facing lower plastic housing surface ( 4 ) for realizing a defined distance between this lower plastic housing surface ( 4 ) and the mounting surface ( 8 ) at least one elevation ( 3 ) integrated into the housing ( 1 ) is arranged. 2. Kunststoffgehäuse für Halbleiterbauelemente nach Anspruch 1, dadurch gekennzeichnet, daß an der unteren Gehäusefläche (4) zur Bildung einer Standfläche drei Erhebungen (3) mit einer Höhe von mindestens 0,5 mm angeordnet sind.2. Plastic housing for semiconductor components according to claim 1, characterized in that three elevations ( 3 ) with a height of at least 0.5 mm are arranged on the lower housing surface ( 4 ) to form a footprint. 3. Quaderförmige Kunststoffgehäuse für Halbleiterbauelemente zur Be­ stückung von Schaltplatinen, dadurch gekennzeichnet, daß in jeder Ecke der der Montagefläche (8) der Schaltplatine (5) zugewandten unteren rechteckförmigen Kunststoffgehäusefläche (4) zur Realisierung eines definierten Abstandes zwischen dieser unteren Kunststoffge­ häusefläche (4) und der Montagefläche (8) eine halbkugel- oder mesa­ förmige Erhebung (3) mit einer Höhe von mindestens 0,5 mm angeordnet ist. 3. Rectangular plastic housing for semiconductor devices to Be stückung of circuit boards, characterized in that in each corner of the mounting surface (8) of the circuit board (5) facing the lower rectangular plastic casing surface (4) häusefläche for realizing a defined distance between these lower Kunststoffge (4) and the mounting surface ( 8 ) has a hemispherical or mesa-shaped elevation ( 3 ) with a height of at least 0.5 mm. 4. Verwendung eines Kunststoffgehäuses nach einem der vorangehenden Ansprüche für dual-in-line, single-in-line oder out-line Gehäuse, bei denen die Erhebungen (3) und die Gehäuseanschlüsse (2) an unter­ schiedlichen Gehäuseflächen angeordnet sind.4. Use of a plastic housing according to one of the preceding claims for dual-in-line, single-in-line or out-line housing, in which the elevations ( 3 ) and the housing connections ( 2 ) are arranged on under different housing surfaces. 5. Verwendung eines Kunststoffgehäuses nach einem der Ansprüche 1 bis 3 für Gehäuse, bei denen die Erhebungen (3) und die Gehäusean­ schlüsse (2) an einer gemeinsamen Kunststoffgehäusefläche (4) ange­ ordnet sind.5. Use of a plastic housing according to one of claims 1 to 3 for housings in which the elevations ( 3 ) and the housing connections ( 2 ) are arranged on a common plastic housing surface ( 4 ). 6. Kunststoffgehäuse für Halbleiterbauelemente nach einem der vor­ angehenden Ansprüche, dadurch gekennzeichnet, daß das Gehäuse (1) und die dach-, keil-, mesa- oder halbkugelförmigen Erhebungen (3) aus dem gleichen Material bestehen.6. Plastic housing for semiconductor components according to one of the preceding claims, characterized in that the housing ( 1 ) and the roof, wedge, mesa or hemispherical elevations ( 3 ) consist of the same material. 7. Kunststoffgehäuse für Halbleiterbauelemente nach einem der vor­ angehenden Ansprüche, dadurch gekennzeichnet, daß das Gehäuse (1) und die dach-, keil-, mesa- oder halbkugelförmigen Erhebungen (3) in einem Spritz- oder Moldvorgang hergestellt werden.7. Plastic housing for semiconductor components according to one of the preceding claims, characterized in that the housing ( 1 ) and the roof, wedge, mesa or hemispherical elevations ( 3 ) are produced in an injection molding or molding process.
DE19873713298 1987-04-18 1987-04-18 Plastic packaging for semiconductor components with spacing projections Withdrawn DE3713298A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19873713298 DE3713298A1 (en) 1987-04-18 1987-04-18 Plastic packaging for semiconductor components with spacing projections

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19873713298 DE3713298A1 (en) 1987-04-18 1987-04-18 Plastic packaging for semiconductor components with spacing projections

Publications (1)

Publication Number Publication Date
DE3713298A1 true DE3713298A1 (en) 1988-11-03

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DE19873713298 Withdrawn DE3713298A1 (en) 1987-04-18 1987-04-18 Plastic packaging for semiconductor components with spacing projections

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019509A1 (en) * 1990-06-19 1992-01-09 Murata Manufacturing Co Mounting housing holding electronic components - has projections from base serving to resist shock when container is placed on PCB

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US3621112A (en) * 1970-10-28 1971-11-16 Gen Electric Housing for electrical components
DE2025134A1 (en) * 1970-05-22 1971-12-02 Sel Housing for small relays
DE7220448U (en) * 1972-08-24 Resista Gmbh Electrical component for installation on a printed circuit board
DE7303375U (en) * 1973-08-23 Siemens Ag Moisture-proof cover for electronic components or component combinations
DE2713972A1 (en) * 1977-03-30 1978-10-05 Draloric Electronic ELECTRICAL COMPONENT WITH STOPS TO LIMIT THE DEPTH OF ITS PLUG-IN CONNECTIONS
FR2518808A1 (en) * 1981-12-18 1983-06-24 Radiotechnique Compelec Packaging of microelectronic circuits provided with connector tags - located in expendable mould base while mould is filled with packaging material
EP0157008A2 (en) * 1984-04-06 1985-10-09 Hitachi, Ltd. Electronic device having a package

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Publication number Priority date Publication date Assignee Title
DE7220448U (en) * 1972-08-24 Resista Gmbh Electrical component for installation on a printed circuit board
DE7303375U (en) * 1973-08-23 Siemens Ag Moisture-proof cover for electronic components or component combinations
DE6753173U (en) * 1968-09-18 1969-04-10 Siemens Ag SEMICONDUCTOR COMPONENT WITH A DIODE
DE2025134A1 (en) * 1970-05-22 1971-12-02 Sel Housing for small relays
US3621112A (en) * 1970-10-28 1971-11-16 Gen Electric Housing for electrical components
DE2713972A1 (en) * 1977-03-30 1978-10-05 Draloric Electronic ELECTRICAL COMPONENT WITH STOPS TO LIMIT THE DEPTH OF ITS PLUG-IN CONNECTIONS
FR2518808A1 (en) * 1981-12-18 1983-06-24 Radiotechnique Compelec Packaging of microelectronic circuits provided with connector tags - located in expendable mould base while mould is filled with packaging material
EP0157008A2 (en) * 1984-04-06 1985-10-09 Hitachi, Ltd. Electronic device having a package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4019509A1 (en) * 1990-06-19 1992-01-09 Murata Manufacturing Co Mounting housing holding electronic components - has projections from base serving to resist shock when container is placed on PCB

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