DE3707320C2 - - Google Patents
Info
- Publication number
- DE3707320C2 DE3707320C2 DE3707320A DE3707320A DE3707320C2 DE 3707320 C2 DE3707320 C2 DE 3707320C2 DE 3707320 A DE3707320 A DE 3707320A DE 3707320 A DE3707320 A DE 3707320A DE 3707320 C2 DE3707320 C2 DE 3707320C2
- Authority
- DE
- Germany
- Prior art keywords
- chamber
- working medium
- cooling unit
- sensor
- thermostatic chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 claims description 17
- 230000005855 radiation Effects 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000007789 gas Substances 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 3
- 210000002268 wool Anatomy 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 238000013016 damping Methods 0.000 claims description 2
- 229910052734 helium Inorganic materials 0.000 claims description 2
- 239000001307 helium Substances 0.000 claims description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 claims description 2
- 239000000203 mixture Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 229910052756 noble gas Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
- F25D19/006—Thermal coupling structure or interface
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/06—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity
- G01J5/061—Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity by controlling the temperature of the apparatus or parts thereof, e.g. using cooling means or thermostats
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
Description
Die Erfindung betrifft eine Einrichtung zur Kühlung und Einstellung ei ner konstanten Betriebstemperatur mindestens eines Sensors, insbesondere eines Infrarot-Strahlungsdetektors, wobei der mindestens eine Sensor auf einer Wärmeübertragungsplatte angeordnet und thermisch leitend mit einem Kühlaggregat verbunden ist.The invention relates to a device for cooling and setting egg ner constant operating temperature of at least one sensor, in particular an infrared radiation detector, the at least one sensor arranged on a heat transfer plate and thermally conductive with a cooling unit is connected.
In der Luft- und Raumfahrt sowie für militärische Anwendungen sind In frarot-Strahlungsdetektoren gebräuchlich, deren Betriebstemperatur zum Teil erheblich unterhalb von 150 K liegt und die daher ein Kühlag gregat bzw. einen Thermostaten benötigen. Hierzu sind beispielsweise Joule-Thomson Kühler gebräuchlich, die einen sogenannten Kühlfinger auf weisen, auf dessen Spitze der eigentliche Sensor, der aus mehreren Sen sorelementen bestehen kann, gut wärmeleitend angeordnet ist. Eine derar tige Einrichtung ist beispielsweise aus der DE-OS 33 14 576 bekannt. Ein besonderes Problem bei Infrarot-Strahlungsdetektoren stellt die starke Temperatur abhängigkeit dar, so daß die Kühlaggregate im allgemeinen eine aufwendi ge Temperaturregelung beinhalten.In aerospace and for military applications are in infrared radiation detectors in use, their operating temperature in some cases considerably below 150 K and is therefore a cooling day gregat or a thermostat. This includes, for example Joule-Thomson coolers in use, which have a so-called cooling finger point, on the tip of the actual sensor, which consists of several Sen sorelemente can exist, is arranged well thermally conductive. A derar term device is known for example from DE-OS 33 14 576. A A particular problem with infrared radiation detectors is the high temperature dependency, so that the cooling units are generally a complex include temperature control.
Die Aufgabe der vorliegenden Erfindung ist es, eine Einrichtung zur Kühlung und zur Einstellung einer konstanten Betriebstemperatur mindestens eines Sensors, insbesondere eines Infrarot-Strahlungsdetektors zu schaffen, welche eine hohe Temperaturkonstanz aufweist und im einfachsten Fall sogar ohne spe zielle Temperaturregelung für das Kühlaggregat auskommt und welche zu sätzlich eine weitgehend vibrationsfreie Kühlung des Sensors ermöglicht. Diese Aufgabe wird durch eine nach den kennzeichnenden Merkmalen des Pa tentanspruchs 1 ausgebildete Einrichtung gelöst.The object of the present invention is a device for cooling and to set a constant operating temperature of at least one sensor, in particular to provide an infrared radiation detector, which a has high temperature stability and in the simplest case even without spe temperature control for the cooling unit and what to do additionally allows largely vibration-free cooling of the sensor. This task is carried out according to the characteristic features of Pa Tent claims 1 trained device solved.
Die Erfindung macht von der bekannten Eigenschaft von Stoffen oder Stoffgemisch Gebrauch, die im Phasenübergang eine relativ hohe latente Wärme aufweisen und somit in der Lage sind, eine erhebliche Wärmemenge ohne Temperaturerhöhung aufzunehmen. Ein entsprechendes Verfahren zur Temperaturstabilisierung von Instrumenten ist aus der US-PS 38 63 707 bekannt, dessen Arbeitstemperatur jedoch durch die Wahl des Stoffes vorgegeben und dann nicht mehr variabel ist. The invention makes of the known property of fabrics or Substance mixture use that has a relatively high latent in the phase transition Have heat and are therefore able to produce a significant amount of heat without recording temperature increase. A corresponding procedure for Temperature stabilization of instruments is from the US-PS 38 63 707 known, the working temperature, however, by the choice of the substance and is then no longer variable.
Die erfindungsgemäß zwischen dem Kühlaggregat und der den Sensor tragenden Wärmeübertragungsplatte angeordnete Thermostatkammer ermöglicht sowohl eine Feinanpassung der Arbeitstempe ratur der Thermostatkammer als auch eine Schwingungsisolierung des Sen sors vom Kühlaggregat, was zusammen das Auflösungsvermögen des Sensors erheblich erhöht.According to the invention arranged between the cooling unit and the heat transfer plate carrying the sensor Thermostat chamber enables both fine adjustment of the working temperature temperature of the thermostat chamber as well as vibration isolation of the sen sors of the cooling unit, which together is the resolution of the sensor significantly increased.
Bei Kurzzeiteinsätzen des Sensors, z. B. bei Flugkör persensoren, reicht es aus, die Masse des Arbeitsmediums in der Thermostatkammer so groß zu wählen, daß bei Ende der Mission die volle Phasenumkehr von fest auf flüssig noch nicht erfolgt ist. Bei Langzeiteinsätzen kann die Wärmebelastung empirisch ermittelt und parasitären Wärmeströ men eine Zusatzheizung überlagert werden, wobei mit Temperaturensensoren das Über- bzw. Unterschreiten vorbestimmter Temperaturen gemessen und die Zusatzheizung entsprechend geregelt wird.For short-term use of the sensor, e.g. B. in missile persensors, it is sufficient to increase the mass of the working medium in the thermostat chamber choose that at the end of the mission the full phase reversal from fixed to fluid has not yet occurred. With long-term use can the thermal load is determined empirically and parasitic heat flow an additional heater can be superimposed, with temperature sensors the exceeding or falling below predetermined temperatures is measured and the auxiliary heating is regulated accordingly.
Die Erfindung wird im folgenden anhand eines in der Figur teilweise schematisch dargestellten Ausführungsbeispieles be schrieben:The invention is based on one in the Figure be partially schematically illustrated embodiment wrote:
Auf einer aus thermisch gut leitendem Material bestehenden Wärmeübertragungsplatte 1 ist zentral ein Infrarot-Strahlungsde tektor 2 angeordnet und mit der Wärmeübertragungsplatte 1 thermisch gut leitend verbun den. Am Umfang der Wärmeübertragungsplatte 1 ist ein Justierring 3 befestigt, dessen pla ne Stirnfläche gegen Justierelemente 4 anliegt; auf diese Weise ist der Infrarot- Strahlungsdetektor 2 bezüglich einer nicht dargestellten Optik genau justierbar.On an existing thermally conductive material heat transfer plate 1 , an infrared radiation detector 2 is arranged centrally and with the heat transfer plate 1 thermally conductive verbun. On the circumference of the heat transfer plate 1 , an adjusting ring 3 is fixed, the pla ne end face rests against adjusting elements 4 ; In this way, the infrared radiation detector 2 can be precisely adjusted with respect to an optic (not shown).
Die Wärmeübertragungsplatte 1 stellt gleichzeitig eine Wandung einer Thermostatkammer 5 dar, in der sich ein Arbeitsmedium 8 befindet.The heat transfer plate 1 also represents a wall of a thermostat chamber 5 in which a working medium 8 is located.
Das Arbeitsmedium 8 ist dem entsprechenden Typ des Infrarot-Strahlungsdetek tors 2 angepaßt, und zwar derart, daß es einen Phasenübergang von fest auf flüssig bei der Temperatur aufweist, die als Betriebstemperatur für den Infrarot- Strahlungsdetektor 2 vorgesehen ist. So beträgt der Schmelzpunkt von Mo nosilan T S=88,5 K, Krypton T S=117 K und von Xenon T S=162 K.The working medium 8 is adapted to the corresponding type of infrared radiation detector 2 , in such a way that it has a phase transition from solid to liquid at the temperature which is provided as the operating temperature for the infrared radiation detector 2 . The melting point of monosilane T S = 88.5 K, krypton T S = 117 K and xenon T S = 162 K.
Als Arbeitsmedium können selbstverständlich auch Zwei- und Mehrphasenge mische verwendet werden, deren eutektischer Punkt bei der Betriebstempe ratur des Infrarot-Strahlungsdetektors liegt.Of course, two-phase and multi-phase can also be used as the working medium mixes are used, whose eutectic point at the operating temperature temperature of the infrared radiation detector.
Die Unterseite der Thermostatkammer 5 wird durch eine ebenfalls gut wärmeleitende Platte 6 gebildet, die mit der Wärmeübertragungsplatte 1 über einen Faltenbalg 7 verbunden ist. Zur besseren Wärme übertragung von der Wärmeübertragungsplatte 1 auf die Platte 6 ist der Innenraum der Thermostatkammer 5 zusätzlich noch mit Metall- insbes. Kupferwolle ausgefüllt. Die Ther mostatkammer 5 ist über ringförmige Metallitzen 10 thermisch gut lei tend, jedoch schwingungsisoliert, mit einer Adapterplatte 11 verbunden, die auf dem Kühlfinger 12 eines an sich bekannten Kühlaggregats 13 me chanisch und thermisch angekoppelt sitzt. Zur Vermeidung von Wärmever lusten wird die Adapterplatte 11 von einer Keramikplatte 14 gehalten, die ihrerseits mit einem Gehäuse 15 verbunden ist.The underside of the thermostatic chamber 5 is formed by a plate 6 which is also a good heat conductor and which is connected to the heat transfer plate 1 via a bellows 7 . For better heat transfer from the heat transfer plate 1 to the plate 6 , the interior of the thermostatic chamber 5 is additionally filled with metal, in particular copper wool. The Ther mostatkammer 5 is thermally well lei tend via annular metal strands 10, but vibrationally isolated, connected to an adapter plate 11, sitting on the cold finger 12 of a per se known refrigerating unit 13 me mechanically and thermally coupled. To avoid heat losses, the adapter plate 11 is held by a ceramic plate 14 , which in turn is connected to a housing 15 .
Die Thermostatkammer 5 sowie die der Wärmeübertragung und Schwingungs dämpfung dienenden Litzen 10 befinden sich innerhalb einer Hüllkammer 16, deren äußere Wandung 18 als Faltenbalg ausgebildet ist, der einer seits mit dem Gehäuse 15 und andererseits mit dem Justierring 3 gasdicht ver bunden ist. Durch diesen Faltbalg 18 wird die Übertragung von Schwingungen vom Gehäuse 15 bzw. vom Kühlaggregat 13 auf den Infrarot-Strahlungs detektor 2 vermindert. Die Hüllkammer 16 ist mit einem schlecht wärme leitenden Druckgas 17, wie z. B. Heliumgas, gefüllt, dessen Druck über einen Drucksensor 20 gemessen und über eine Regeldruckleitung 19 einge stellt wird. Der in der Hüllkammer 16 herrschende Druck überträgt sich auf den herrschenden Druck, so daß, da die Schmelz- bzw. Erstarrungstemperaturen des Arbeitsmediums 8 druckabhängig sind, in nerhalb der Thermostatkammer 5 die jeweilige Betriebstempera tur variiert werden kann.The thermostatic chamber 5 and the heat transfer and vibration damping strands 10 are located within an enveloping chamber 16 , the outer wall 18 of which is formed as a bellows, which is connected to the housing 15 and on the other hand to the adjusting ring 3 in a gas-tight manner. Through this bellows 18 , the transmission of vibrations from the housing 15 or from the cooling unit 13 to the infrared radiation detector 2 is reduced. The envelope chamber 16 is with a poorly heat-conducting pressure gas 17 , such as. B. helium gas, the pressure of which is measured by a pressure sensor 20 and is set via a regulating pressure line 19 . The pressure prevailing in the enveloping chamber 16 is transferred to the prevailing pressure, so that since the melting or solidification temperatures of the working medium 8 are pressure-dependent, the respective operating temperature can be varied within the thermostatic chamber 5 .
Zur Verminderung des Einflusses von Wärmestrahlung sind in der Hüllkam mer 16 sowie in dem Raum zwischen der Adapterplatte 11 und dem Kühlag gregat 13 bzw. Gehäuse 15 Isolationsschichten 21, 22 und 23 angebracht.To reduce the influence of heat radiation are 16 in the Hüllkam mer and in the space between the adapter plate 11 and the cooling unit 13 or housing 15 insulating layers 21 , 22 and 23 attached.
Claims (9)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873707320 DE3707320A1 (en) | 1987-03-07 | 1987-03-07 | Device for cooling a sensor |
| FR888802757A FR2611973B1 (en) | 1987-03-07 | 1988-03-04 | DEVICE FOR COOLING A DETECTOR, PARTICULARLY AN INFRARED RADIATION DETECTOR USED FOR EXAMPLE ON A FLYING MACHINE |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19873707320 DE3707320A1 (en) | 1987-03-07 | 1987-03-07 | Device for cooling a sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE3707320A1 DE3707320A1 (en) | 1988-09-15 |
| DE3707320C2 true DE3707320C2 (en) | 1990-02-08 |
Family
ID=6322474
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19873707320 Granted DE3707320A1 (en) | 1987-03-07 | 1987-03-07 | Device for cooling a sensor |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE3707320A1 (en) |
| FR (1) | FR2611973B1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4332156A1 (en) * | 1993-09-22 | 1995-03-30 | Inst Luft Kaeltetech Gem Gmbh | Device for self-sufficient cooling of high-temperature superconducting components, preferably sensors |
| DE4442247A1 (en) * | 1994-11-28 | 1996-05-30 | Heidenhain Gmbh Dr Johannes | Positioner for accurate positioning of parts to be machined |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4235757A1 (en) * | 1992-10-23 | 1994-04-28 | Licentia Gmbh | Radiation detector - has detector element on wall of Dewar vessel vacuum chamber with Joule-Thomson cooler |
| DE4325782C2 (en) * | 1993-07-31 | 1997-02-06 | Christof Kaufmann | Measuring circuit with a thermal coupling |
| US5523563A (en) * | 1994-08-12 | 1996-06-04 | E. I. Du Pont De Nemours And Company | Apparatus for controlling the temperature of a near-infrared analyzer |
| US6070414A (en) * | 1998-04-03 | 2000-06-06 | Raytheon Company | Cryogenic cooler with mechanically-flexible thermal interface |
| US6604366B1 (en) * | 2002-09-19 | 2003-08-12 | Raytheon Company | Solid cryogen cooling system for focal plane arrays |
| DE102009048248A1 (en) * | 2009-10-05 | 2011-06-09 | Hartmann, Eva | Cooling device for a usable at elevated ambient temperature sensor |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3315478A (en) * | 1965-06-29 | 1967-04-25 | Hughes Aircraft Co | Cryogenic transfer arrangement |
| CH272971A4 (en) * | 1971-02-25 | 1974-11-15 | ||
| FR2130001A1 (en) * | 1971-03-25 | 1972-11-03 | Comp Generale Electricite | Solidified gas cryostat - with pressure-regulated equilibrium used to cool electronic components |
| US3836779A (en) * | 1971-12-22 | 1974-09-17 | Honeywell Inc | Cooling apparatus for infrared detectors |
| US3885984A (en) * | 1973-12-18 | 1975-05-27 | Gen Electric | Methyl alkyl silicone thermoconducting compositions |
| US4194119A (en) * | 1977-11-30 | 1980-03-18 | Ford Motor Company | Self-adjusting cryogenic thermal interface assembly |
| DD200696A1 (en) * | 1981-10-05 | 1983-06-01 | Horst Neumann | PROCESS FOR COOLING TARGETS IN VACUUM CHAMBERS |
| FR2540278A1 (en) * | 1983-02-02 | 1984-08-03 | Thomson Csf | THERMAL ENERGY STORAGE DEVICE |
| DE3314576A1 (en) * | 1983-04-22 | 1984-10-25 | Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt | Method and device for cooling optoelectronic sensors, in particular IR detectors |
| NL8303603A (en) * | 1983-10-19 | 1985-05-17 | Philips Nv | INFRARED RECEIVER WITH COOLED RADIATION DETECTOR. |
-
1987
- 1987-03-07 DE DE19873707320 patent/DE3707320A1/en active Granted
-
1988
- 1988-03-04 FR FR888802757A patent/FR2611973B1/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4332156A1 (en) * | 1993-09-22 | 1995-03-30 | Inst Luft Kaeltetech Gem Gmbh | Device for self-sufficient cooling of high-temperature superconducting components, preferably sensors |
| DE4442247A1 (en) * | 1994-11-28 | 1996-05-30 | Heidenhain Gmbh Dr Johannes | Positioner for accurate positioning of parts to be machined |
| DE4442247C2 (en) * | 1994-11-28 | 2000-06-29 | Heidenhain Gmbh Dr Johannes | Positioning device with temperature stabilization |
Also Published As
| Publication number | Publication date |
|---|---|
| FR2611973A1 (en) | 1988-09-09 |
| FR2611973B1 (en) | 1990-05-11 |
| DE3707320A1 (en) | 1988-09-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| OP8 | Request for examination as to paragraph 44 patent law | ||
| D2 | Grant after examination | ||
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: DEUTSCHE AEROSPACE AG, 8000 MUENCHEN, DE |
|
| 8327 | Change in the person/name/address of the patent owner |
Owner name: DAIMLER-BENZ AEROSPACE AKTIENGESELLSCHAFT, 80804 M |
|
| 8339 | Ceased/non-payment of the annual fee |