DE3641688C2 - - Google Patents

Info

Publication number
DE3641688C2
DE3641688C2 DE3641688A DE3641688A DE3641688C2 DE 3641688 C2 DE3641688 C2 DE 3641688C2 DE 3641688 A DE3641688 A DE 3641688A DE 3641688 A DE3641688 A DE 3641688A DE 3641688 C2 DE3641688 C2 DE 3641688C2
Authority
DE
Germany
Prior art keywords
ball
electrode layer
depth
copper
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE3641688A
Other languages
German (de)
English (en)
Other versions
DE3641688A1 (de
Inventor
Kazumichi Machida
Jitsuho Amagasaki Hyogo Jp Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP60291084A external-priority patent/JPS62150730A/ja
Priority claimed from JP61017348A external-priority patent/JPS62174936A/ja
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of DE3641688A1 publication Critical patent/DE3641688A1/de
Application granted granted Critical
Publication of DE3641688C2 publication Critical patent/DE3641688C2/de
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
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    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2924/20303—Ultrasonic frequency [f] 50 Khz=<f< 75 KHz

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  • Engineering & Computer Science (AREA)
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  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
DE19863641688 1985-12-24 1986-12-06 Verfahren zur qualitaetspruefung einer elektrodenschicht eines halbleiterbauelements Granted DE3641688A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP60291084A JPS62150730A (ja) 1985-12-24 1985-12-24 半導体装置の評価方法
JP61017348A JPS62174936A (ja) 1986-01-28 1986-01-28 半導体装置の評価方法

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DE3641688C2 true DE3641688C2 (zh) 1989-10-12

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030951A1 (de) * 2007-07-04 2009-01-08 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts

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DE102013222439B4 (de) 2013-11-05 2023-10-12 F&S Bondtec Semiconductor GmbH Messung der Nachgiebigkeit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007030951A1 (de) * 2007-07-04 2009-01-08 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts
DE102007030951B4 (de) * 2007-07-04 2011-05-12 Fachhochschule Augsburg Vorrichtung für die Bestimmung von mechanischen Eigenschaften eines zu untersuchenden Objekts

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