DE3629474A1 - Method of providing raised structures and delay-line support for a travelling-wave tube fabricated by said method - Google Patents

Method of providing raised structures and delay-line support for a travelling-wave tube fabricated by said method

Info

Publication number
DE3629474A1
DE3629474A1 DE19863629474 DE3629474A DE3629474A1 DE 3629474 A1 DE3629474 A1 DE 3629474A1 DE 19863629474 DE19863629474 DE 19863629474 DE 3629474 A DE3629474 A DE 3629474A DE 3629474 A1 DE3629474 A1 DE 3629474A1
Authority
DE
Germany
Prior art keywords
substrate
layer
delay
energy beam
sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863629474
Other languages
German (de)
Inventor
Hans Bendig
Helmut Rupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales Electron Devices GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19863629474 priority Critical patent/DE3629474A1/en
Publication of DE3629474A1 publication Critical patent/DE3629474A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/20—Bonding
    • B23K26/32—Bonding taking account of the properties of the material involved
    • B23K26/324—Bonding taking account of the properties of the material involved involving non-metallic parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/34—Laser welding for purposes other than joining
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/08—Non-ferrous metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/52—Ceramics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0514—Photodevelopable thick film, e.g. conductive or insulating paste
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/092—Particle beam, e.g. using an electron beam or an ion beam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

Abstract

It is proposed to provide metal structures on an insulator, in particular resonators on a delay-line support, by covering the insulator with a uniform layer of a sinterable material, then sintering subregions with a laser beam or the like and then removing the parts of the layer which have not been sintered on.

Description

Verfahren zum Aufbringen erhabener Strukturen und danach hergestellter Verzögerungsleitungsträger einer Lauffeld­ röhre.Process for applying raised structures and after manufactured delay line carrier of a running field tube.

Die vorliegende Erfindung betrifft ein Verfahren nach dem Oberbegriff des Patentanspruchs 1 sowie eine nach diesem Verfahren hergestellte Hochfrequenzeinrichtung.The present invention relates to a method according to the Preamble of claim 1 and one according to this Processed high-frequency device.

Es sind bereits eine Vielzahl von Verfahren zum Aufbringen von Strukturen auf Oberflächen bekannt, wie z. B.:
Aufbringen mittels Siebdruck;
Bedampfen durch aufgelegte Masken;
ganzflächiges Beschichten, dann Abdecken mit Photoresist, dann Belichten, dann Entwickeln und dann Abätzen der nicht benötigten Schichtteile;
Abdecken mit Photoresist, dann Belichten, dann Entwickeln, dann ganzflächiges Bedampfen und dann Ablösen der nicht benötigten Schichtteile;
oder ganzflächiges Aufbringen und dann teilweises Entfer­ nen mittels Laserstrahlung oder dergleichen.A variety of methods for applying structures to surfaces are already known, e.g. B .:
Applied by screen printing;
Steaming through applied masks;
coating over the entire surface, then covering with photoresist, then exposing, then developing and then etching away the parts of the layer which are not required;
Covering with photoresist, then exposing, then developing, then full-surface vapor deposition and then peeling off the layer parts that are not required;
or all-over application and then partial removal by means of laser radiation or the like.

Diesen bekannten Verfahren haftet ein oder mehrere Nach­ teile, wie begrenztes Auflösungsvermögen, begrenzte Schichtdicke, Probleme bei Substraten mit nichtebenen Oberflächen oder vielfältige Arbeitsgänge, an.One or more of these known methods are liable parts, such as limited resolution, limited Layer thickness, problems with substrates with non-planes Surfaces or diverse work processes.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, ein Verfahren zur Herstellung äußerst feiner, präzis begrenz­ ter, möglichst gut elektrisch leitfähiger, vergleichsweise dicker Strukturen anzugeben, das auch bei isolierenden Substraten mit nichtebenen, wie z. B. gewölbten, Oberflä­ chen anwendbar ist.The present invention is based on the object Process for the production of extremely fine, precisely limited ter, as good an electrical conductor as possible, comparatively to specify thicker structures, even with insulating ones Non-planar substrates, such as. B. curved, surface Chen is applicable.

Diese Aufgabe wird durch die im Kennzeichen des Patentan­ spruchs 1 angegebenen Merkmale gelöst.This task is carried out by the in the patent solved 1 specified features.

Das beschriebene Verfahren gestattet das Aufbringen äußerst fein und genau strukturierter, elektrisch leiten­ der Schichtkonfigurationen auf unebenen, insbesondere isolierenden Substraten mit verhältnismäßig wenigen Ar­ beitsgängen. Eine bevorzugte Anwendung ist das Aufbringen von Hochfrequenzresonatoren auf die Oberfläche von kerami­ schen Wendelhalterungsstäben von Wanderfeldröhren zur Dämpfung unerwünschter hochfrequenter Schwingungen.The method described allows the application extremely fine and precisely structured, electrically conductive the layer configurations on uneven, in particular insulating substrates with relatively few ares corridors. A preferred application is application of high-frequency resonators on the surface of kerami helical support rods from traveling wave tubes for Damping unwanted high-frequency vibrations.

Anhand des in den Fig. 1 bis 3 dargestellten Ausführungs­ beispiels wird die Erfindung nachfolgend näher erklärt.Based on the embodiment shown in FIGS. 1 to 3, the invention is explained in more detail below.

Die Figuren zeigen Querschnitte eines Ausschnitts eines keramischen Substrates 1, auf dessen Oberfläche ein erha­ benes, genau strukturiertes Element 3 erfindungsgemäß aufgebracht wird.The figures show cross sections of a section of a ceramic substrate 1 , on the surface of which an elevated, precisely structured element 3 is applied according to the invention.

Auf das Substrat 1 wird großflächig eine wieder ablösbare Beschichtung 2 aus einem sinterfähigen Material in der gewünschten Stärke aufgebracht. Diese Beschichtung besteht bevorzugt aus einer angetrockneten Suspension sinterfähi­ ger Metallteilchen, wie einem Gemisch aus Molybdän- und Manganpulver.A removable coating 2 made of a sinterable material of the desired thickness is applied over a large area to the substrate 1 . This coating preferably consists of a dried suspension of sinterable metal particles, such as a mixture of molybdenum and manganese powder.

Mittels eines präzis geführten, hochenergetischen Fein­ punktstrahls 4, insbesondere eines Laserstrahls, wird nun den gewünschten Flächenbereichen 3 soviel Energie zuge­ führt, daß diese Bereiche 3 an der Oberfläche des Substra­ tes festsintern. Danach werden mittels eines Lösungsmit­ tels die nicht bestrahlten und somit nicht gesinterten Schichtteile 2 entfernt. Danach wird zweckmäßig eine wei­ tere Sinterung der zurückgebliebenen Bereiche 3 in einem Ofen vorgenommen.By means of a precisely guided, high energy fine spot beam 4, in particular a laser beam, is now the desired surface areas 3 as much energy supplied leads that these regions 3 tes to the surface of Substra fixed internally. Thereafter, the non-irradiated and thus non-sintered layer parts 2 are removed by means of a solvent. Then a further sintering of the remaining areas 3 is expediently carried out in an oven.

Gemäß einem weiteren Ausführungsbeispiel wird die Bestrah­ lung mittels eines Elektronen- oder Ionenstrahls hoher Energie vorgenommen. Anstelle einer Metallpulverbeschich­ tung kann ggf. eine Beschichtung mit einem thermoplasti­ schen Polymer vorgenommen werden.According to a further exemplary embodiment, the irradiation with a high electron or ion beam Energy made. Instead of a metal powder coating a coating with a thermoplastic be made polymer.

Claims (13)

1. Verfahren zum Aufbringen erhabener Strukturen auf ein Substrat, bei dem das Strukturmaterial auf die Substrat­ oberfläche aufgebracht und durch Wärmezuführung fest mit dieser verbunden wird, dadurch gekennzeichnet, daß auf das Substrat eine gleichförmige Schicht eines sinterfähigen Materials aufgebracht wird, dann mittels eines gezielt geführten, gebündelten, energiereichen Strahles Teilberei­ che der Schicht so erhitzt werden, daß sie an der Sub­ stratoberfläche ansintern und daß dann die nicht angesin­ terten Schichtbereiche entfernt werden.1. A method for applying raised structures to a substrate, in which the structural material is applied to the surface of the substrate and is firmly connected to it by the supply of heat, characterized in that a uniform layer of a sinterable material is applied to the substrate, then by means of a guided one , bundled, high-energy beam partial areas of the layer are heated so that they sinter to the substrate surface and that the non-sintered layer areas are then removed. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als energiereicher Strahl ein Laserstrahl verwendet wird. 2. The method according to claim 1, characterized in that a laser beam is used as the high-energy beam.   3. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß als energiereicher Strahl ein Elektronen- oder Ionenstrahl verwendet wird.3. The method according to claim 1, characterized in that as an energy beam, an electron or ion beam is used. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß die Struktur auf eine unebene Sub­ stratoberfläche aufgebracht wird.4. The method according to any one of claims 1 to 3, characterized characterized that the structure on an uneven sub strat surface is applied. 5. Verfahren nach einem der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß eine elektrisch leitfähige Struktur auf ein isolierendes Substrat, insbesondere ein kerami­ sches Substrat, aufgebracht wird.5. The method according to any one of claims 1 to 4, characterized characterized in that an electrically conductive structure on an insulating substrate, especially a kerami cal substrate. 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß als sinterfähiges Material eine sin­ terfähige Suspension, wie eine Molybdän-Mangan-Suspension, schichtförmig aufgebracht wird.6. The method according to any one of claims 1 to 5, characterized characterized in that a sin as a sinterable material suitable suspension, such as a molybdenum-manganese suspension, is applied in layers. 7. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß als sinterfähiges Material ein thermo­ plastisches Polymer aufgebracht wird.7. The method according to any one of claims 1 to 5, characterized characterized in that as a sinterable material a thermo plastic polymer is applied. 8. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß als sinterfähiges Material eine Me­ tallschicht mittels CVD oder PVD aufgebracht wird.8. The method according to any one of claims 1 to 5, characterized characterized in that a Me tallschicht is applied by means of CVD or PVD. 9. Verfahren nach einem der Ansprüche 1 bis 8, dadurch gekennzeichnet, daß die nicht angesinterten Schichtberei­ che mit einem selektiv wirkenden Lösungsmittel entfernt werden. 9. The method according to any one of claims 1 to 8, characterized characterized that the non-sintered layering removed with a selective solvent will.   10. Verfahren nach einem der Ansprüche 1 bis 9, dadurch gekennzeichnet, daß die angesinterten Schichtbereiche nach Entfernen der nichtbestrahlten Schichtbereiche einer Tem­ peraturbehandlung zur weiteren Verfestigung und Veranke­ rung auf der Substratoberfläche unterworfen werden.10. The method according to any one of claims 1 to 9, characterized characterized in that the sintered layer areas after Removing the non-irradiated layer areas of a tem temperature treatment for further consolidation and anchoring tion on the substrate surface. 11. Verfahren nach Anspruch 10, dadurch gekennzeichnet, daß die weitere Verfestigung, insbesondere Sinterung, in einem Ofen vorgenommen wird.11. The method according to claim 10, characterized in that the further solidification, especially sintering, in an oven is made. 12. Verfahren nach einem der Ansprüche 1 bis 11, gekenn­ zeichnet durch die Anwendung zum Aufbringen von elektrisch leitenden, als Resonatoren wirkenden Strukturen auf einem Isolatorsubstrat einer Hochfrequenzeinrichtung.12. The method according to any one of claims 1 to 11, characterized characterized by the application for the application of electrical conductive structures acting as resonators on one Isolator substrate of a radio frequency device. 13. Nach einem Verfahren nach Anspruch 11 hergestellte Hochfrequenzeinrichtung, gekennzeichnet durch die Ausbil­ dung als Wanderfeldröhre mit wenigstens einem als Verzöge­ rungsleitungsträger ausgebildeten stabförmigen Isolator­ substrat insbesondere kreisförmigen Querschnitts.13. Produced by a method according to claim 11 High-frequency device, characterized by the training as a traveling wave tube with at least one as a delay approximately line-shaped rod-shaped insulator substrate in particular circular cross-section.
DE19863629474 1986-08-29 1986-08-29 Method of providing raised structures and delay-line support for a travelling-wave tube fabricated by said method Withdrawn DE3629474A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863629474 DE3629474A1 (en) 1986-08-29 1986-08-29 Method of providing raised structures and delay-line support for a travelling-wave tube fabricated by said method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863629474 DE3629474A1 (en) 1986-08-29 1986-08-29 Method of providing raised structures and delay-line support for a travelling-wave tube fabricated by said method

Publications (1)

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DE3629474A1 true DE3629474A1 (en) 1988-03-03

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Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3936479A1 (en) * 1989-11-02 1991-05-08 Guenter Link Metallic and ceramic substrate coating method - using powder material applied to surface in liq. medium and melted by laser beam
EP0476320A1 (en) * 1990-09-18 1992-03-25 Robert Bosch Gmbh Process for manufacturing conductive structures in thick film technique
DE19517625A1 (en) * 1995-05-13 1996-11-14 Budenheim Rud A Oetker Chemie Laser printing esp. on glass or plastic substrate
DE19701483A1 (en) * 1997-01-17 1998-07-23 Zahnradfabrik Friedrichshafen Raised structure production on sintered component(s)
DE19810809C1 (en) * 1998-03-12 1999-12-16 Fraunhofer Ges Forschung Flexible conducting film production
DE19948957A1 (en) * 1999-10-11 2001-04-12 Alstom Lhb Gmbh Process for increasing the rigidity of flat components as well as flat component and its use
DE10047083A1 (en) * 2000-09-22 2002-04-18 Volkswagen Ag Plastic panel for use e.g. in televisions and CD players and as components in cars, aero planes and ships has metallic coating with symbols applied to it
EP1253812A2 (en) * 2000-10-10 2002-10-30 Armin Prof. Dr. Lenhart Process and arrangement for manufacturing electrical conductors on an insulating substrate
DE10155713A1 (en) * 2001-11-09 2003-05-22 Siemens Ag Production of conducting structure on a flexible support comprises applying microspheres of a conducting material to the support and bonding the microspheres to the support
EP1427266A1 (en) * 2001-09-11 2004-06-09 Daiken Chemical Co., Ltd Method for forming image on object surface including circuit substrate
DE102008024885A1 (en) * 2008-05-23 2009-12-17 Rohde & Schwarz Messgerätebau GmbH Printed circuit board manufacturing method, involves applying additional layer on base layer, and merging connection layer with base layer and with metallic powder layer to form double layer
WO2015082179A1 (en) * 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Method for forming an electrically conductive structure on a plastic substrate
CN110087400A (en) * 2018-01-26 2019-08-02 谢孟修 Ceramic circuit board and its preparation method

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Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3936479A1 (en) * 1989-11-02 1991-05-08 Guenter Link Metallic and ceramic substrate coating method - using powder material applied to surface in liq. medium and melted by laser beam
EP0476320A1 (en) * 1990-09-18 1992-03-25 Robert Bosch Gmbh Process for manufacturing conductive structures in thick film technique
DE19517625A1 (en) * 1995-05-13 1996-11-14 Budenheim Rud A Oetker Chemie Laser printing esp. on glass or plastic substrate
DE19701483A1 (en) * 1997-01-17 1998-07-23 Zahnradfabrik Friedrichshafen Raised structure production on sintered component(s)
DE19810809C1 (en) * 1998-03-12 1999-12-16 Fraunhofer Ges Forschung Flexible conducting film production
DE19948957A1 (en) * 1999-10-11 2001-04-12 Alstom Lhb Gmbh Process for increasing the rigidity of flat components as well as flat component and its use
DE10047083A1 (en) * 2000-09-22 2002-04-18 Volkswagen Ag Plastic panel for use e.g. in televisions and CD players and as components in cars, aero planes and ships has metallic coating with symbols applied to it
EP1253812A2 (en) * 2000-10-10 2002-10-30 Armin Prof. Dr. Lenhart Process and arrangement for manufacturing electrical conductors on an insulating substrate
EP1253812A3 (en) * 2000-10-10 2004-03-31 Armin Prof. Dr. Lenhart Process and arrangement for manufacturing electrical conductors on an insulating substrate
EP1427266A4 (en) * 2001-09-11 2006-10-04 Daiken Chemical Co Ltd Method for forming image on object surface including circuit substrate
EP1427266A1 (en) * 2001-09-11 2004-06-09 Daiken Chemical Co., Ltd Method for forming image on object surface including circuit substrate
DE10155713A1 (en) * 2001-11-09 2003-05-22 Siemens Ag Production of conducting structure on a flexible support comprises applying microspheres of a conducting material to the support and bonding the microspheres to the support
DE102008024885A1 (en) * 2008-05-23 2009-12-17 Rohde & Schwarz Messgerätebau GmbH Printed circuit board manufacturing method, involves applying additional layer on base layer, and merging connection layer with base layer and with metallic powder layer to form double layer
WO2015082179A1 (en) * 2013-12-04 2015-06-11 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e. V. Method for forming an electrically conductive structure on a plastic substrate
CN106165551A (en) * 2013-12-04 2016-11-23 弗劳恩霍夫应用研究促进协会 For the method forming conductive structure in plastic
CN110087400A (en) * 2018-01-26 2019-08-02 谢孟修 Ceramic circuit board and its preparation method
CN110087400B (en) * 2018-01-26 2021-04-16 谢孟修 Ceramic circuit board and method for manufacturing the same

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