DE3435804A1 - Rear-wall wiring for push-in electrical assemblies - Google Patents

Rear-wall wiring for push-in electrical assemblies

Info

Publication number
DE3435804A1
DE3435804A1 DE19843435804 DE3435804A DE3435804A1 DE 3435804 A1 DE3435804 A1 DE 3435804A1 DE 19843435804 DE19843435804 DE 19843435804 DE 3435804 A DE3435804 A DE 3435804A DE 3435804 A1 DE3435804 A1 DE 3435804A1
Authority
DE
Germany
Prior art keywords
backplane
circuit boards
wiring
printed circuit
potential
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843435804
Other languages
German (de)
Inventor
Gundolf Dipl.-Ing. 8000 München Milde
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19843435804 priority Critical patent/DE3435804A1/en
Publication of DE3435804A1 publication Critical patent/DE3435804A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1438—Back panels or connecting means therefor; Terminals; Coding means to avoid wrong insertion
    • H05K7/1452—Mounting of connectors; Switching; Reinforcing of back panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
    • H01R12/523—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures by an interconnection through aligned holes in the boards or multilayer board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R9/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, e.g. terminal strips or terminal blocks; Terminals or binding posts mounted upon a base or in a case; Bases therefor
    • H01R9/15—Connectors for wire wrapping

Abstract

The invention relates to rear-wall wiring for the electrical connection of electrical assemblies which can be pushed into a mounting rack and can be plugged onto rear-wall plugs (1) which are arranged side-by-side in a plane, which rear-wall plugs (1) have connecting pins (2) which, on the side of the rear-wall plugs (1) facing away from the assemblies, are plugged through two printed-circuit boards (3, 4) which are insulated from one another, are located one above the other and are coated on both sides. In order to decouple the two signal layers (5, 6) electrically, in each case only one signal layer (5, 6) is provided on each of the two printed-circuit boards (3, 4) which are coated on both sides, a potential plane (8) being arranged between the signal layers (5, 6). <IMAGE>

Description

Rückwandverdrahtung für einschiebbare elektrischeBackplane wiring for retractable electrical

Baugruppen.Assemblies.

Die Erfindung betrifft eine Rückwandverdrahtung zum elektrischen Verbinden von in einen Baugruppenrahmen elektrischen Baugruppen, die auf in einer Ebene nebeneinander angeordnete Rückwandstecker aufsteckbar sind, welche Anschlußstifte aufweisen, die auf der den Baugruppen abgewandten Seite der Rückwandstecker durch zwei voneinander isolierte und übereinanderliegende doppelseitig kaschierte Leiterplatten hindurchgesteckt sind, wobei die Leiterplatten z.T. Freibohrungen für die Anschlußstifte aufweisen.The invention relates to backplane wiring for electrical connection of electrical assemblies in an assembly frame that are next to each other in one level arranged rear panel plugs can be plugged, which have pins that on the side facing away from the modules, the backplane connector by two of each other insulated and double-sided laminated printed circuit boards, one on top of the other, pushed through The printed circuit boards partly have free bores for the connecting pins.

Bei derartigen Rückwandverdrahtungen ist es bekannt, auf der einen Leiterplatte zwei Signallagen und auf der anderen Leiterplatte zwei Potentialebenen unterzubringen.With such backplane wiring, it is known on the one hand Circuit board two signal layers and two potential levels on the other circuit board accommodate.

Diese Aufteilung der Signallagen und der Potentialebenenen hat den Nachteil, daß die beiden Signallagen miteinander elektrisch verkoppelt sind.This division of the signal layers and the potential levels has the Disadvantage that the two signal layers are electrically coupled to one another.

Aufgabe der Erfindung ist es eine Rückwandverdrahtung der eingangs genannten Art anzugeben, die mindestens zwei Signallagen aufweist und mit einfachen technischen Mitteln herstellbar ist, und bei der die elektrische Verkoppelung zwischen den Signallagen möglichst gering ist.The object of the invention is a backplane wiring of the initially specified type, which has at least two signal layers and with simple technical means can be produced, and in which the electrical coupling between the signal layers is as small as possible.

Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß je Leiterplatte auf der dem Rückwandstecker zugewandten Seite eine Signallage vorgesehen ist, und daß die Potentialebenen auf den dem Rückwandstecker abgewandten Seiten der Leiterplatten angeordnet sind.According to the invention, this object is achieved in that each circuit board a signal layer is provided on the side facing the backplane connector, and that the potential levels on the sides of the circuit boards facing away from the backplane connector are arranged.

Dadurch, daß die Signallagen bei der erfindungsgemäßen Rückwandverdrahtung durch die Potentialebenen voneinander getrennt sind, wird die Verkopplung der beiden Signale Signallagen auf ein Minimum reduziert. Weitere vorteilhafte Ausbildungen der erfindungsgemäßen Rückwandverdrahtung ergeben sich aus den Unteransprüchen sowie aus der nachfolgenden Beschreibung eines Ausführungsbeispiels der Erfindung Im folgenden wird die Erfindung anhand eines in der Figur dargestellten Ausführungsbeispiels näher beschrieben.Because the signal layers in the backplane wiring according to the invention are separated from each other by the potential levels, the coupling of the two becomes Signals Signal layers reduced to a minimum. Further advantageous training the backplane wiring according to the invention emerge from the subclaims and from the following description of an embodiment of the invention in the following the invention is based on an embodiment shown in the figure described in more detail.

Nach der Figur sind nicht dargestellte elektrische Baugruppen auf Rückwandstecker 1 eines Baugruppenrahmens aufsteckbar. Die Rückwandstecker 1 sind auf der den Baugruppen abgewandten Seite mit Anschlußstiften 2 versehen, die der elektrischen Verbindung der Baugruppen untereinander dienen. Die in der Figur dargestellte Rückwandverdrahtung besteht aus zwei doppelseitig kaschierten Leiterplatten 3 und 4, die durch eine Isolierfolie 9 voneinander getrennt sind. Die beiden Signallagen sind mit 5 und 6 gekennzeichnet, sie befinden sich jeweils auf der dem Rückwandstecker 1 zugewandten Seite der Leiterplatten 3 und 4. Die beiden Potentialebenen 7 und 8 befinden sich jeweils auf der dem Rückwandstecker 1 abgewandten Seite der doppelseitig kaschierten Leiterplatten 3 und 4. Die Signallage 6 ist in unsymmetrischer kopplungsarmer Striplinekonfiguration ausgeführt, da sie sich zwischen den beiden Potentialebenen 8 und 7 befindet, wobei der Abstand zu den einzelnen Potentialebenen unterschiedlich ist. Beim Ausführungsbeispiel ist die Potentialebene 7 mit der Versorgungsspannung beaufschlagt. Diese als Schirmebene dienende mit der Versorgungsspannung beaufschlagt Potentialebene 7 ist aufgrund ihrer flächigen Ausführung bzw. infolge der Ab- blockkondensatoren auf den Baugruppen von gleicher Schirm qualität wie die erdpotentialführende Potentialebene 8.According to the figure, electrical assemblies are not shown Backplane connector 1 of a module frame can be plugged on. The backplane connectors 1 are on the side facing away from the modules provided with pins 2, which the Serve electrical connection of the assemblies with each other. The one shown in the figure Backplane wiring consists of two double-sided laminated circuit boards 3 and 4, which are separated from one another by an insulating film 9. The two signal layers are marked with 5 and 6, they are located on the backplane connector 1 facing side of the circuit boards 3 and 4. The two potential levels 7 and 8 are located on the side facing away from the rear panel connector 1 of the double-sided laminated printed circuit boards 3 and 4. The signal layer 6 is in asymmetrical coupling-poor Stripline configuration executed because it is between the two potential levels 8 and 7, the distance to the individual potential levels being different is. In the exemplary embodiment, the potential plane 7 is with the supply voltage applied. The supply voltage is applied to this, which serves as the shielding level Potential level 7 is due to its flat design or as a result of the block capacitors on the assemblies of the same shielding quality as the potential level carrying ground potential 8th.

Die zweite Signalebene 5 ist als Mikrostripkonfiguration ausgeführt, d.h. sie verläuft über einer Schirmebene, in diesem Falle der Potentialebene 7. Aufgrund der Anordnung der Signallagen und Potentialebene bei der erfindungsgemäßen Rückwandverdrahtung sind die beiden Signallagen 5 und 6 elektrisch voneinander entkoppelt.The second signal level 5 is designed as a microstrip configuration, i.e. it runs over a shield plane, in this case the potential plane 7. Due to the arrangement of the signal layers and potential plane in the inventive Backplane wiring, the two signal layers 5 and 6 are electrically decoupled from one another.

Die Leiter der Signallage 5 sind aufgrund der Mikrostripkonfiguration stärker miteinander verkoppelt als die Leiter der Signallage 6. Wenn es erforderlich ist, können jeweils zwei Signalleiter innerhalb einer von zwei Reihen von Anschlußstiften gebildeten Gasse durch einen schirmenden Zwischenleiter entkoppelt werden.The conductors of the signal layer 5 are due to the microstrip configuration more closely coupled than the conductors of signal layer 6. If necessary two signal conductors can be within either of two rows of pins formed alley can be decoupled by a shielding intermediate conductor.

Ein weiterer Vorteil der erfindungsgemäßen Rückwandverdrahtung besteht darin, daß bei einer zusätzlichen mittel Wrapverdrahtung geschaffenen dritten Signallage ausserhalb der Leiterplatten diese Signallage, die durch die Wrapdrähte 10 gebildet wird, durch die erdpotentialführende Ebene 8 von der Signallage 6 elektrisch entkoppelt ist. Die Verdrahtungsrichtung kann in allen drei Signallagen beliebig verlaufen.There is another advantage of the backplane wiring according to the invention in that with an additional middle wrap wiring created third signal layer this signal layer, which is formed by the wrap wires 10, is outside the circuit boards is electrically decoupled from the signal layer 6 by the level 8 carrying ground potential is. The wiring direction can run in any direction in all three signal layers.

3 Patentansprüche 1 Figur3 claims 1 figure

Claims (3)

Patentansprüche 1. Rückwandverdrahtung zum elektrischen Verbinden von in einen Baugruppenrahmen einschiebbaren elektrischen Baugruppen, die auf in einer Ebene nebeneinander angeordnete Rückwandstecker aufsteckbar sind, welche Anschlußstifte aufweisen, die auf der den Baugruppen abgewandten Seite der Rückwandstecker durch zwei voneinander isolierte und übereinanderliegende doppelseitig kaschierte Leiterplatten hindurchgesteckt sind, wobei die Leiterplatten z.T. Freibohrungen für die Anschlußstifte aufweisen, d a d u r c h g e k e n n z e i c h n e t , daß je Leiterplatte (3, 4) auf der dem Rückwandstecker (1) zugewandten Seite eine Signallage (5,6) vorgesehen ist, und daß die Potentialebenen (7,8) auf den dem Rückwandstecker abgewandten Seiten der Leiterplatten (3,4) angeordnet sind.Claims 1. Backplane wiring for electrical connection of electrical modules that can be pushed into a module frame and that are based on in Rear panel plugs arranged next to one another on one level can be plugged on, which connecting pins have on the side facing away from the modules through the backplane connector two double-sided laminated printed circuit boards, one on top of the other, isolated from one another are pushed through, with the circuit boards partly clearing holes for the connecting pins show that each printed circuit board (3, 4) a signal layer (5, 6) is provided on the side facing the backplane connector (1) is, and that the potential levels (7,8) on the sides facing away from the backplane connector the circuit boards (3, 4) are arranged. 2. Rückwandverdrahtung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t , daß die Potentialebene (7) der dem Rückwandstecker benachbarten Leiterplatte (3) mit der Versorgungsspannung beaufschlagt ist.2. Backplane wiring according to claim 1, d a d u r c h g e k e n n z e i c h n e t that the potential plane (7) is adjacent to the backplane connector The supply voltage is applied to the printed circuit board (3). 3. Rückwandverdrahtung nach Anspruch l oder 2, d a -d u r c h g e k e n n z e i c h n e t , daß mittels Wrapverdrahtung (10) eine dritte Signallage außerhalb der Leiterplatten (3,4) gebildet ist.3. backplane wiring according to claim l or 2, d a -d u r c h g e It is not possible to say that a third signal layer is created by means of wrap wiring (10) is formed outside the circuit boards (3, 4).
DE19843435804 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies Withdrawn DE3435804A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843435804 DE3435804A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843435804 DE3435804A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Publications (1)

Publication Number Publication Date
DE3435804A1 true DE3435804A1 (en) 1986-04-10

Family

ID=6246699

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843435804 Withdrawn DE3435804A1 (en) 1984-09-28 1984-09-28 Rear-wall wiring for push-in electrical assemblies

Country Status (1)

Country Link
DE (1) DE3435804A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1273021B (en) * 1963-07-30 1968-07-18 Ibm Arrangement for tight packing of electrical circuits in data processing systems
GB1157432A (en) * 1965-08-18 1969-07-09 Int Computers Ltd Electric Circuit Interconnection Means
DE2362239A1 (en) * 1972-12-28 1974-07-11 Cii Honeywell Bull ELECTRICAL CONNECTION PLATE
US4016463A (en) * 1973-10-17 1977-04-05 Amdahl Corporation High density multilayer printed circuit card assembly and method
DE2840890A1 (en) * 1978-09-20 1980-04-03 Licentia Gmbh Multilayer connection printed circuit board assembly - has perforated metal plates circuit boards separated by insulating layers, with metal plated holes for interconnection

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1273021B (en) * 1963-07-30 1968-07-18 Ibm Arrangement for tight packing of electrical circuits in data processing systems
GB1157432A (en) * 1965-08-18 1969-07-09 Int Computers Ltd Electric Circuit Interconnection Means
DE2362239A1 (en) * 1972-12-28 1974-07-11 Cii Honeywell Bull ELECTRICAL CONNECTION PLATE
US4016463A (en) * 1973-10-17 1977-04-05 Amdahl Corporation High density multilayer printed circuit card assembly and method
DE2840890A1 (en) * 1978-09-20 1980-04-03 Licentia Gmbh Multilayer connection printed circuit board assembly - has perforated metal plates circuit boards separated by insulating layers, with metal plated holes for interconnection

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