DE3419688A1 - Venting system for data-technology cabinets which contain electronic components - Google Patents

Venting system for data-technology cabinets which contain electronic components

Info

Publication number
DE3419688A1
DE3419688A1 DE19843419688 DE3419688A DE3419688A1 DE 3419688 A1 DE3419688 A1 DE 3419688A1 DE 19843419688 DE19843419688 DE 19843419688 DE 3419688 A DE3419688 A DE 3419688A DE 3419688 A1 DE3419688 A1 DE 3419688A1
Authority
DE
Germany
Prior art keywords
housing
air
fan
housings
cabinet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19843419688
Other languages
German (de)
Other versions
DE3419688C2 (en
Inventor
Peter Dipl.-Ing. 8900 Augsburg Materlik
Kornelius Dipl.-Ing. 8000 MÜnchen Sotiriu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19843419688 priority Critical patent/DE3419688A1/en
Publication of DE3419688A1 publication Critical patent/DE3419688A1/en
Application granted granted Critical
Publication of DE3419688C2 publication Critical patent/DE3419688C2/de
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20554—Forced ventilation of a gaseous coolant
    • H05K7/20572—Forced ventilation of a gaseous coolant within cabinets for removing heat from sub-racks, e.g. plenum

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The invention relates to a venting system for data-technology cabinets which contain electronic components. Leaks in the housing, in which the printed-circuit boards (which are assembled to form electronic units) are arranged result in a heat exchange which is only inadequate, as a result of heat accumulation. The invention thus provides that in each case a plurality of printed-circuit boards, fitted with components, be assembled like a tower in housings 1, through which air can pass at the top and bottom, staggered one behind the other such that they are separated by air channels. Located close to the housing base in each housing 1 is at least one first, horizontally arranged fan 2, which sucks air out of a cavity 9, via a perforated base plate 4 of the housing 1, said cavity 9 being located under said base plate 4. At least one second, horizontally located fan 3 is arranged above the housing 1, which fan 3 is common to all the housings 1 and sucks in the air located in the air channels 8 and housings 1 and emits it through the perforated covering plate 5 of the cabinet. <IMAGE>

Description

Entlüftungssystem für elektronische Bauteile enthaltendeContaining ventilation systems for electronic components

Schränke der Datentechnik.Data technology cabinets.

Die Erfindung betrifft ein Entlüftungssystem für elektronische Bauteile enthaltende Schränke der Datentechnik.The invention relates to a ventilation system for electronic components containing cabinets for data technology.

Für eine wirkungsvolle Abfuhr der Verlustwärme, welche die Aggregate eines hochbelasteten Elektronikschrankes - wie z. B. einer Großrechnerzentraleinheit - erzeugen, werden große Kühlluftmengen benötigt. Dabei wird üblicherweise mit 1500 - 2000 Luftwechsel pro Stunde, auf das Schrankvolumen bezogen, gearbeitet.For an effective dissipation of the heat loss that the units a highly stressed electronics cabinet - such as B. a mainframe central unit - generate large amounts of cooling air are required. Usually 1500 - 2000 air changes per hour, based on the cabinet volume, worked.

Die elektronischen Aggregate werden dabei meistens mit den notwendigen Kühlvorrichtungen, wie z. B. Lüftern, übereinander und nebeneinander zusammengefaßt. Der Einsatz von starken Lüftern zur Kühlung der Elektronik und die Störempfindlichkeit der Logik gegenüber hohen Frequenzen machen bestimmte Schallisolations- und Hf-Abdichtungsmaßnahmen an den Schrankverkleidungselementen notwendig. Dadurch wird jedoch der ungehinderte Zu-bzw. Abstrom von Kühlluft im Schrank problematisch, Es bildet sich im Schrankinneren durch Rückströmung und Kurzschluß der Kühlluft ein Nikroklima.The electronic aggregates are mostly with the necessary Cooling devices, such as. B. fans, combined one above the other and side by side. The use of powerful fans to cool the electronics and the sensitivity to interference the logic against high frequencies make certain sound insulation and RF sealing measures necessary on the cabinet cladding elements. However, this makes the unimpeded To or. Cooling air outflow in the cabinet is problematic, it forms inside the cabinet a microclimate through backflow and short-circuiting of the cooling air.

Als Folge davon kann das Temperaturniveau im Schrank mehrere Grad Celsius über der allgemeinen Umgebungstemperatur in Schranknähe liegen.As a result, the temperature level in the cabinet can be several degrees Celsius above the general ambient temperature near the cabinet.

Aufgabe der Erfindung ist es, ein Entlüftungssystem für Schränke der Datentechnik zu schaffen, bei dem eine zügige Durchströmung der angesaugten Luft durch die Aggregate gewährleistet ist.The object of the invention is to provide a ventilation system for cabinets To create data technology in which a rapid flow of the sucked in air is guaranteed by the units.

Zur Lösung dieser Aufgabe wird gemäß der Erfindung das Entlüftungssystem derart ausgebildet, daß jeweils mehrere mit Bauteilen bestückte Leiterplatten turmartig in boden- und deckenseitig luftdurchlässigen Gehäusen zu Aggregaten zusammengefaßt, durch Luftkanäle getrennt, hintereinander gestaffelt sind, daß sich in jedem Gehäuse in Gehäusebodennähe mindestens ein erster horizontal angeordneter Lüfter befindet, der über ein perforiertes Bodenblech der Gehäuse Luft aus einem darunter befindlichen Hohlraum ansaugt und daß oberhalb der Gehäuse mindestens ein für alle Gehäuse gemeinsamer zweiter horizontal liegender Lüfter angeordnet ist, der die in den Luftkanälen und Gehäusen befindliche Luft absaugt und durch das perforierte Deckblech des Schrankes abbläst.To solve this problem, according to the invention, the ventilation system designed in such a way that in each case a plurality of printed circuit boards equipped with components is like a tower combined into units in housings that are permeable to air on the floor and ceiling, separated by air ducts, staggered one behind the other that are in each housing at least one first horizontally arranged fan is located near the bottom of the housing, which air from one below via a perforated bottom plate of the housing Sucks cavity and that above the housing at least one common for all housing second horizontally lying fan is arranged, which is in the air ducts and Housings are sucked off air and through the perforated cover plate of the cabinet blows off.

Durch diese Maßnahmen erhält man eine gute Be- und intlüftung der in Schränken für die Datentechnik eingebauten Aggregate, wobei die Geometrie der Anordnung der Aggregate keinen Einfluss auf das Kühlergebnis hat.These measures ensure good ventilation of the Units built into cabinets for data technology, with the geometry of the The arrangement of the units has no influence on the cooling result.

Dadurch wird das Problem des Luft- bzw. Wärmetausches im Innern eines Schrankes in einfacher Weise gelöst.This causes the problem of air or heat exchange inside a Cabinet solved in a simple way.

Am Boden der Gehäuse können Luftfilter für jedes einzelne Gehäuse zur Entstaubun#g vorgesehen sein.At the bottom of the housing there can be air filters for each individual housing be provided for dedusting.

Es ist auch möglich, im Bodenhohlraum des Schrankes ein für alle Gehäuse gemeinsames zusätzliches oder allein vorhandenes Luftfilter anzuordnen.It is also possible to have one for all enclosures in the bottom cavity of the cabinet to arrange joint additional or only existing air filter.

Anhand der Ausführungsbeispiele nach den FIG 1 bis 3 wird die Erfindung näher erläutert.The invention is based on the exemplary embodiments according to FIGS explained in more detail.

Es zeigen: FIG 1 die Seitenansicht eines Schrankes bei entferntem seitlichen Abdeckblech, FIG 2 die Vorderansicht ebenfalls ohne Vorderabdeckung FIG 3 die Draufsicht bei oben aufgedecktem Schrank.They show: FIG. 1 the side view of a cabinet when it is removed lateral cover plate, FIG. 2 shows the front view also without the front cover FIG 3 the top view with the cabinet uncovered at the top.

1 In FIG/ist schematisch die Seitenansicht eines Datenschrankes gezeigt, wobei die Seitenwand entfernt ist. 1 In FIG / the side view of a data cabinet is shown schematically, with the side wall removed.

Man blickt auf die drei nebeneinander angeordneten und durch Luftschächte 8 getrennten Gehäuse 1, in denen die elektrischen Leiterplatten übereinander zu Aggregaten angeordnet sind. Am Boden eines jeden Gehäuses befindet sich mindestens ein erster Lüfter 2, während für alle Gehäuse 1 gemeinsam unterhalb des perforierten Deckbleches 5 des Datenschrankes zweite Lüfter 3 angeordnet sind. Unterhalb der Gehäuse 1 befindet sich ein Hohlraum 9, und in diesem Hohlraum 9 wieder ein perforiertes Bodenblech 4, wobei aus dem Hohlraum durch die ersten Lüfter 2 Kühlluft angesaugt wird.You can see the three side by side and through air shafts 8 separate housing 1 in which the electrical circuit boards are one above the other Aggregates are arranged. At the bottom of each case there is at least a first fan 2, while for all housing 1 common below the perforated Cover plate 5 of the data cabinet second fan 3 are arranged. Below the Housing 1 is a cavity 9, and in this cavity 9 again a perforated one Floor panel 4, with cooling air being sucked in from the cavity by the first fan 2 will.

FIG 2 zeigt die Vorderansicht eines geöffneten Datenschrankes, wobei jedes Gehäuse 1 vier erste Lüfter 2 enthält und in der Draufsicht nach FIG 3 ist ersichtlich, daß die für alle Gehäuse 1 gemeinsamen zweiten Lüfter oberhalb der Gehäuse 1 angeordnet sind, wobei im vorliegenden Falle vier Lüfter 3 vorgesehen sind.FIG 2 shows the front view of an open data cabinet, wherein each housing 1 contains four first fans 2 and is in the plan view according to FIG can be seen that the common for all housing 1 second fan above the Housing 1 are arranged, four fans 3 being provided in the present case are.

Die Funktionsweise des Entlüftungssystems nach der Erfindung ist wie folgt.The operation of the ventilation system according to the invention is like follows.

Der Elektronikschrank enthält drei Aggregategehäuse. Die elektronischen Aggregate erzeugen z. B. eine Verlustleistung von 2000 W pro Gehäuse 1. Die benötigte Kühlluft wird durch ein perforiertes Bodenblech 4 hindurch von den ersten Lüftern 2 angesaugt und verläßt nach Durchströmen der Elektronikaggregate im Gehäuse 1 den Schrank 10 durch ein perforiertes Dachblech 5. Ohne die zusätzlichen Lüfter 3 im Dachbereich würde die Be- und Entlüftung durch die ersten Lüfter 2 zu einem geringen Teil durch natürliche Konvektion oder bei Aufbau auf einen doppelten Boden durch dessen Druckluft erfolgen.The electronics cabinet contains three unit housings. The electronic Aggregates produce z. B. a power loss of 2000 W per housing 1. The required Cooling air is drawn from the first fans through a perforated floor panel 4 2 sucked in and leaves after flowing through the electronic units in the housing 1 the Cabinet 10 through a perforated roof plate 5. Without the additional fans 3 in the In the roof area, the ventilation through the first fan 2 would be low Partly through natural convection or when built on a false floor whose compressed air takes place.

Die wegen hoher Strömungswiderstände notwendigerweise starken ersten ~Lüfter 2 erzeugen im unteren Schrankinnenbereich einen Luftunterdruck. Die bereits erwärmte Luft, welche durch undichte Bereiche in den Elektronikaggregaten entweicht oder durch Rückstau im Dachbereich vorhanden ist, strömt in diesen Unterdruckbereich zurück (gestrichelte Strömungspfeile), Messungen zeigen, daß 25-30 % als bereits erwärmte Falschluft noch einmal von den Lüftern 2 angesaugt wird. Dieser Anwird ungünstiger, teil wird umso / je stärker die Luftdrosselung im Zu-und Abluftbereich der Schrankverkleidung ist. Die erzwungene Belüftung des Schrankinneren durch die zweiten Lüfter 3 unterbindet wirkungsvoll das nochmalige Ansaugen bereits erwärmter Luft durch die ersten Lüfter 2 (durchgezogene Strömungspfeile). Schalldämpfungsmaßnahmen und hochfrequente Abdichtungen am Luftein- und austritt beeinflussen nicht die Wärmeabfuhr aus der Elektronik. Hierbei ist auch möglich, die notwendigen einzelnen Gehäusefilter 6 durch einen gemeinsamen Filter 7 zu ersetzen.The first, necessarily strong because of the high flow resistance ~ Fan 2 generate negative air pressure in the lower interior area of the cabinet. The already heated air that escapes through leaky areas in the electronic units or is present due to backwater in the roof area, flows into this negative pressure area back (dashed flow arrows), measurements show that 25-30% than already heated false air is sucked in again by the fans 2. This app more unfavorable, partly the stronger the air throttling in the supply and exhaust air area the cabinet cladding is. The forced ventilation of the inside of the cabinet through the second fan 3 effectively prevents the repeated suction of already heated Air through the first fan 2 (solid flow arrows). Soundproofing measures and high-frequency seals at the air inlet and outlet do not affect the heat dissipation from electronics. It is also possible to use the individual housing filters required 6 to be replaced by a common filter 7.

3 Patentansprüche 3 FIGUREN - Leerseite -3 claims 3 FIGURES - blank page -

Claims (2)

Patentanspriiche 1. Entlüftungssystem für elektronische Bauteile enthaltende Schränke der Datentechnik, d a d u r c h g e k e n n z e i c h n e t, daß jeweils mehrere mit Bauteilen bestückte Leiterplatten turmartig in boden-und deckenseitig luftdurchlässigen Gehäusen (1) zu Aggregaten zusamnengefaßt, durch Luftkanäle (8) getrennt, hintereinander gestaffelt sind, daß sich in jedem Gehäuse(1) in Gehäusebodennähe mindestens ein erster horizontal angeordneter Lüfter (2) befindet, der über ein perforiertes Bodenblech (4) der Gehäuse (1) Luft aus einem darunter befindlichen Hohlraum (9) ansaugt und daß oberhalb der Gehäuse (1) mindestens ein für alle Gehäuse (1) gemeinsamer zweiter horizontal liegender Lüfter (3) angeordnet ist, der die in den Luftkanälen (8) und Gehäusen (1) befindliche Luft ansaugt und durch das perforierte Deckblech (5) des Schrankes (10) abbläst.Claims 1. Ventilation system for electronic components containing Cabinets of the data technology, d u r c h e k e n n z e i c h n e t, that respectively Several printed circuit boards equipped with components in a tower-like manner on the floor and ceiling air-permeable housings (1) combined into units, through air ducts (8) are separated, staggered one behind the other, that in each housing (1) near the bottom of the housing at least one first horizontally arranged fan (2) is located, which has a perforated bottom plate (4) of the housing (1) air from an underlying Sucks in cavity (9) and that above the housing (1) at least one for all housings (1) common second horizontally lying fan (3) is arranged, which the in the air ducts (8) and housings (1) is sucked in air and through the perforated The cover plate (5) of the cabinet (10) blows off. 2. Entlüftungssystem nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß am Boden eines jeden Gehäuses (i) ein Luftfilter (6) vorgesehen ist.2. Ventilation system according to claim 1, d a d u r c h g e k e n n z e i c h n e t that an air filter (6) is provided at the bottom of each housing (i) is. 3, Entlüftungssystem nach den Ansprüchen 1 oder 2, d a d u r c h g e k e n n z e i c h n e t, daß Im Bodenhohlraum (9) des Schrankes (10) ein für alle Gehäuse (1) gemeinsames Luftfilter (7) angeordnet ist.3, ventilation system according to claims 1 or 2, d a d u r c h g e k e n n n n e i c h n e t that in the floor cavity (9) of the cabinet (10) one for all Housing (1) common air filter (7) is arranged.
DE19843419688 1984-05-25 1984-05-25 Venting system for data-technology cabinets which contain electronic components Granted DE3419688A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843419688 DE3419688A1 (en) 1984-05-25 1984-05-25 Venting system for data-technology cabinets which contain electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843419688 DE3419688A1 (en) 1984-05-25 1984-05-25 Venting system for data-technology cabinets which contain electronic components

Publications (2)

Publication Number Publication Date
DE3419688A1 true DE3419688A1 (en) 1985-11-28
DE3419688C2 DE3419688C2 (en) 1989-02-09

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Application Number Title Priority Date Filing Date
DE19843419688 Granted DE3419688A1 (en) 1984-05-25 1984-05-25 Venting system for data-technology cabinets which contain electronic components

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3624541A1 (en) * 1986-07-19 1988-01-21 Lothar Szielasko Device for heat dissipation from push-in equipment units
US4901200A (en) * 1987-10-14 1990-02-13 Schroff Gmbh Insertable housing
US5136465A (en) * 1990-10-29 1992-08-04 International Business Machines Corp. Personal computer with tandem air flow dual fans and baffle directed air cooling
DE4309308C1 (en) * 1993-03-23 1994-04-14 Siemens Nixdorf Inf Syst Ventilation system for power electronic appts. housing - has 2 overlying ventilation units inserted between upper and lower halves of function module stack.
US5414591A (en) * 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
WO2001078479A2 (en) * 2000-04-05 2001-10-18 Einux, Inc. Cooling system and method for high density electronics enclosure
GB2508372A (en) * 2012-11-29 2014-06-04 Eaton Ind Netherlands Bv Housing for low voltage system with cooling airflow
CN105960139A (en) * 2016-03-23 2016-09-21 杭州迪普科技有限公司 Handle bar and communication device comprising the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3188524A (en) * 1962-09-20 1965-06-08 Lockheed Aircraft Corp High density circuit card packaging
US3317798A (en) * 1966-04-13 1967-05-02 Ibm Cooling electrical apparatus
US3903404A (en) * 1973-10-17 1975-09-02 Amdahl Corp Computer construction and method
US4106076A (en) * 1976-07-12 1978-08-08 Ncr Corporation Electrical component and bus element assembly

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3188524A (en) * 1962-09-20 1965-06-08 Lockheed Aircraft Corp High density circuit card packaging
US3317798A (en) * 1966-04-13 1967-05-02 Ibm Cooling electrical apparatus
US3903404A (en) * 1973-10-17 1975-09-02 Amdahl Corp Computer construction and method
US4106076A (en) * 1976-07-12 1978-08-08 Ncr Corporation Electrical component and bus element assembly

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
DE-B.: D. van LEYEN, "Wärmeübertragung", Siemens AG (1971), S. 187-189 *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3624541A1 (en) * 1986-07-19 1988-01-21 Lothar Szielasko Device for heat dissipation from push-in equipment units
US4901200A (en) * 1987-10-14 1990-02-13 Schroff Gmbh Insertable housing
US5136465A (en) * 1990-10-29 1992-08-04 International Business Machines Corp. Personal computer with tandem air flow dual fans and baffle directed air cooling
US5414591A (en) * 1991-04-15 1995-05-09 Hitachi, Ltd. Magnetic disk storage system
DE4309308C1 (en) * 1993-03-23 1994-04-14 Siemens Nixdorf Inf Syst Ventilation system for power electronic appts. housing - has 2 overlying ventilation units inserted between upper and lower halves of function module stack.
US5800258A (en) * 1993-03-23 1998-09-01 Siemens Nixdorf Informationssysteme Aktiengesellschaft Ventilation system for cabinets with electronic functional units which produce considerable heat
WO2001078479A2 (en) * 2000-04-05 2001-10-18 Einux, Inc. Cooling system and method for high density electronics enclosure
WO2001078479A3 (en) * 2000-04-05 2003-01-16 Einux Inc Cooling system and method for high density electronics enclosure
GB2508372A (en) * 2012-11-29 2014-06-04 Eaton Ind Netherlands Bv Housing for low voltage system with cooling airflow
CN105960139A (en) * 2016-03-23 2016-09-21 杭州迪普科技有限公司 Handle bar and communication device comprising the same

Also Published As

Publication number Publication date
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