DE3414485A1 - Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards - Google Patents

Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards

Info

Publication number
DE3414485A1
DE3414485A1 DE19843414485 DE3414485A DE3414485A1 DE 3414485 A1 DE3414485 A1 DE 3414485A1 DE 19843414485 DE19843414485 DE 19843414485 DE 3414485 A DE3414485 A DE 3414485A DE 3414485 A1 DE3414485 A1 DE 3414485A1
Authority
DE
Germany
Prior art keywords
drill
printed
circuit board
electronic components
hollow drill
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19843414485
Other languages
German (de)
Inventor
Peter 4800 Bielefeld Majewski
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE19843414485 priority Critical patent/DE3414485A1/en
Publication of DE3414485A1 publication Critical patent/DE3414485A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • H05K13/0491—Hand tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

According to the methods which were previously known to me for releasing multi-legged, electronic components from printed-circuit boards, this is very expensive, is partially position-dependent or can even be implemented technically only with difficulty. Using the hollow drill invented by me, which encloses the connecting leg and can thus release connections from the printed-circuit board one by one, this problem is solved not only in a manner which is technically correct and is independent of position but which is also still cost-effective in production.

Description

5. Beschreibung5. Description

5.0 Hahlbchrer zum entfernen mehrbeiniger, elektronischer Bauteile die in Leiterplatten eingelötet sind.5.0 Hahlbchrer for removing multi-legged electronic components which are soldered into printed circuit boards.

Die Erfindung letrifft einen Hohlbohrer mit dem man schon lereits eingelötet mehrbeinige elektronische Bauteile problemlos von der Leiterplatte wieder entfernen kann, 5.1 ohne die Leiterplatte oder das Bauteil zu leschädigen. The invention meets a hollow drill with which one is already learning Soldered in multi-legged electronic components easily from the circuit board 5.1 without damaging the circuit board or the component.

Der Hohlbohrer kann in den Bereichen der Elektronikbrange eingesetzt werden, deren Aufgabe es ist, defekte elektr. Bauteile auszuwechseln. Die Handhabung ist ortsunabhangig, ideal fün den Seruicebereich. The hollow drill can be used in the fields of electronics whose task is to repair defective electr. Replace components. The handling is location-independent, ideal for the service area.

5.2 Zur Zeit sind mir drei Verfahren bekannt, die gleichen Zweck erfüllen können. Das eine ist ein Zinnbad indem alle Lötstellen zur gleichen Zeit aur Schmelzung gebracht werden.5.2 I am currently aware of three processes that serve the same purpose can. One is a tin bath in which all solder joints are melted at the same time to be brought.

Das Bauteil kann dann heraus genommen werden. The component can then be removed.

Das zweite Verfahren, daß mir bekannt ist, ist eine 5.3 Komlination von Lötkolben und Vacuumpumpe. Nachdem man mit dem Lötkollen das Lot zur Schmelze gebracht hat, betatigt man die Vacuumpumpe die das flüssige Lötzinn alsaugt. The second method that I know of is a 5.3 comlination of soldering iron and vacuum pump. After you melt the solder with the soldering bob has brought, the vacuum pump is actuated, which sucks the liquid solder.

Das dritte Verfahren ist ein Einsatz für den Lötkolben, der mit der Bauart des zu entfernenden Bauteils überein-5.4 stimmen muß, mit dem dann alle Beinchen zur gleichen Zeit erwärmt werden. The third method is an insert for the soldering iron that comes with the The type of construction of the component to be removed must match-5.4, with which then all the legs be heated at the same time.

Die ersten beiden Verfahren sind technisch sehr aufwendig. The first two methods are technically very complex.

und daher sehr kostenintensiu. Wobei das zuerst beschriebene Gerät noch nicht einmal transportabel ist. and therefore very cost-intensive. Whereby the device described first is not even transportable.

5.5 Das dritte Verfahren ist praktisch sehr schlecht durchzuführen. Abgesehen davon, daß man für jedes Bauteil das passende Werkzeug benötigt, ist es unmöglich alle Beinchen gleichzeitig zu erwarmen, wenn nur eines ein wenig verbogen ist.5.5 The third method is very difficult to carry out in practice. Apart from the fact that you need the right tool for every component, it is impossible to warm all legs at the same time if only one is bent a little is.

5.6 Der Erfindung liegt die Aufgabe zugrunde, daß Problem, eingelötete, mehrbeinige, elektronische Bauteile auszuwechseln ; einfach, preisgünstig und ortsunabhängig zu lösen.5.6 The invention is based on the problem that the problem, soldered, replace multi-legged electronic components; simple, inexpensive and independent of location to solve.

5. Beschreibung 5.7 Diese Aufgabe wird mit dem unter Anspruch 1 beschriebenen Bohrer im Zusammenhang mit einer handelsüblichen Feinbohrmaschine oder einem Lötkolben erfüllt.5. Description 5.7 This task is described under claim 1 with that Drill in connection with a commercially available fine drill or a soldering iron Fulfills.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin, daß das bisherige Problem, auswechseln 5.8 mehrbeiniger elektronischer Bauteile problemlos, unabhängig von der Bauant des Bauteils, ohne großen Aufwand und von allem sehr preisgünstig gelöst ist. The advantages achieved with the invention are in particular: that the previous problem, replace 5.8 multi-legged electronic components problem-free, regardless of the builder of the component, without great effort and from everything is solved very cheaply.

Ein Ausführungsbeispiel der Erfindung ist auf dem Blatt 2 der Zeichnungen dargestellt und wird wie im folgenden naher 5.9 beschrieben. An embodiment of the invention is on sheet 2 of the drawings and is described as 5.9 below.

Vor dem bohren mit dem Hohlbohrer ist es zweckmäßig, von allen Anschlüssen des zu entfernenden Bauteils, mit Hilpe eines Lötkolbens und einer Entlötpumpe, soviel wie möglich von dem vorhandenen Lötzinn abzusaugen. Ist dieses getan, 5.10 so spannt man den Hohlbohrer (3) in eine handelsübliche Feinbohrmaschine (4). Der hohlbohrer wird so angesetzt, daß er ein Anschlußbein des zu entfernenden Bauteils (1) umschließt. Betätigt man nun die Feinbohrmaschine, so wird das Anschlußbeinchen ganz sauber von der leiterplatte (2) 5.11 getrennt. Dieser Vongang muß dann bei jedem Anschlußbeinchen vollzogen werden, bis das Bauteil vollständig von der Leiterplatte gelöst ist. Before drilling with the hollow drill bit, it is advisable to remove all connections of the component to be removed, with the help of a soldering iron and a desoldering pump, suck up as much of the solder as possible. Once this is done, 5.10 the hollow drill (3) is clamped in a commercially available fine boring machine (4). Of the Hollow drill is positioned so that it becomes a connecting leg of the component to be removed (1) encloses. If you now operate the fine boring machine, the terminal pin becomes very cleanly separated from the circuit board (2) 5.11. This Vongang must then with Each lead is completed until the component is completely removed from the circuit board is resolved.

Auf Blatt 1 der Zeichnungen sehen Sie zwei Möglichkeiten des Hohlbohrers mit dem ein handelsülliches IC von der Leiterplatte getrennt werden kann. On sheet 1 of the drawings you can see two options for the hollow drill with which a commercially available IC can be separated from the circuit board.

Claims (4)

Patentansprüche 4.0 1) Hohllohren mit dem ein schon lereits eingelötetes IC oder ein ähnliches mehrleiniges elektronisches Bauteit von dem Lot lefreit wird und somit von der Leiterplatte le geténnt wird, 4.1 dadurch gekennreichnet, daß der äußere Durchmesser des Bohrers den Durchmesser der Bohrung der Leiterplatte entspricht (euentuell ein lißchen weniger) und der innere Durchmesser des Bohrers etwas größer ist, als 4.2 das Anschlußlein des zu entfernende elektronische Bauteil.Claims 4.0 1) Hollow ears with the one already soldered in IC or a similar multi-line electronic component from which solder is freed and thus is toned from the printed circuit board, 4.1 gekennreichnet that the outer diameter of the drill the diameter of the hole in the circuit board corresponds (possibly a little less) and the inner diameter of the drill is slightly larger than 4.2 the connector of the electronic component to be removed. Die Spitze ist als Schneid oder Zerspanungswerkzeug. The tip is used as a cutting or machining tool. Der Bohrer kann in eine handelsübliche Feinbohrmaschine eingespannt werden und im Zusammenhang dieser winksam werden. The drill can be clamped in a commercially available fine boring machine and be waved in connection with this. 4.3 2) Hohlbohrer nach Anspruch 1.4.3 2) Hollow drill according to claim 1. dadurch gekennzeichnet, daß er auf eine Heizung (Lötkollen) aufgesetzt werden kann und so auf thermische Weise das Arschlußlein des elektronischen Bauteils von der Leiterplatte getrennt wird. characterized in that it is placed on a heater (solder balls) can be and so in a thermal way the Arschlusslein the electronic component is separated from the circuit board.
DE19843414485 1984-04-17 1984-04-17 Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards Withdrawn DE3414485A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19843414485 DE3414485A1 (en) 1984-04-17 1984-04-17 Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19843414485 DE3414485A1 (en) 1984-04-17 1984-04-17 Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards

Publications (1)

Publication Number Publication Date
DE3414485A1 true DE3414485A1 (en) 1985-10-24

Family

ID=6233814

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19843414485 Withdrawn DE3414485A1 (en) 1984-04-17 1984-04-17 Hollow drill for removing multi-legged, electronic components which are soldered into printed-circuit boards

Country Status (1)

Country Link
DE (1) DE3414485A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021004751A1 (en) * 2019-07-09 2021-01-14 Endress+Hauser SE+Co. KG Method for removing a component applied to a printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021004751A1 (en) * 2019-07-09 2021-01-14 Endress+Hauser SE+Co. KG Method for removing a component applied to a printed circuit board
CN114080287A (en) * 2019-07-09 2022-02-22 恩德莱斯和豪瑟尔欧洲两合公司 Method for removing a component applied to a circuit board

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