DE3275053D1 - Process for realising a cooling device - Google Patents

Process for realising a cooling device

Info

Publication number
DE3275053D1
DE3275053D1 DE8282402215T DE3275053T DE3275053D1 DE 3275053 D1 DE3275053 D1 DE 3275053D1 DE 8282402215 T DE8282402215 T DE 8282402215T DE 3275053 T DE3275053 T DE 3275053T DE 3275053 D1 DE3275053 D1 DE 3275053D1
Authority
DE
Germany
Prior art keywords
mandrels
windings
fixing
realising
frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8282402215T
Other languages
German (de)
English (en)
Inventor
Rene Dassonville
Philippe Bauchet
Eugene Borget
Gildas Laudren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Application granted granted Critical
Publication of DE3275053D1 publication Critical patent/DE3275053D1/de
Expired legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Wire Processing (AREA)
  • Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Thermistors And Varistors (AREA)
  • General Induction Heating (AREA)
DE8282402215T 1981-12-11 1982-12-03 Process for realising a cooling device Expired DE3275053D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8123212A FR2518357A1 (fr) 1981-12-11 1981-12-11 Procede de realisation d'un dispositif de refroidissement a elements filiformes pour composant electronique et dispositif de refroidissement ainsi obtenu

Publications (1)

Publication Number Publication Date
DE3275053D1 true DE3275053D1 (en) 1987-02-12

Family

ID=9264935

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8282402215T Expired DE3275053D1 (en) 1981-12-11 1982-12-03 Process for realising a cooling device

Country Status (4)

Country Link
EP (1) EP0082051B1 (enExample)
AT (1) ATE24818T1 (enExample)
DE (1) DE3275053D1 (enExample)
FR (1) FR2518357A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5212625A (en) * 1988-12-01 1993-05-18 Akzo Nv Semiconductor module having projecting cooling fin groups
US5158136A (en) * 1991-11-12 1992-10-27 At&T Laboratories Pin fin heat sink including flow enhancement
DE19623677C2 (de) * 1996-06-14 1999-09-16 Knuerr Mechanik Ag Geräteschrank für elektrische und elektronische Systeme
DE10140328B4 (de) * 2001-08-16 2006-02-02 Siemens Ag Kühlanordnung zur Kühlung elektronischer Bauelemente
FR2913765B1 (fr) * 2007-03-16 2012-08-10 Pierre Vironneau Nappe de circulation de fluide, procede pour realiser une telle nappe et utilisation de telles nappes pour la realisation d'un echangeur thermique
NL2019792B1 (en) * 2017-10-24 2019-04-29 Micro Turbine Tech B V Heat exchanger comprising a stack of cells and method of manufacturing such a heat exchanger
SE1730353A1 (sv) * 2017-12-28 2019-06-29 Andersson Inge Kylanordning

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB692885A (en) * 1949-12-28 1953-06-17 Brown Fintube Co Improvements in the manufacture of heat exchangers
US2879041A (en) * 1956-10-15 1959-03-24 Rca Corp Heat radiator
DE1132883B (de) * 1957-01-30 1962-07-12 Franciscus Roffelsen Verfahren zum Herstellung von Waermeaustauschelementen
FR1511618A (fr) * 1966-12-19 1968-02-02 Chausson Usines Sa Procédé pour la fabrication de dissipateurs de chaleur du type à fils et dissipateur en résultant

Also Published As

Publication number Publication date
EP0082051B1 (fr) 1987-01-07
ATE24818T1 (de) 1987-01-15
FR2518357B3 (enExample) 1984-12-14
EP0082051A2 (fr) 1983-06-22
EP0082051A3 (en) 1984-01-11
FR2518357A1 (fr) 1983-06-17

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee