DE3233620A1 - Printed-circuit board arrangement having a printed-circuit board and a metal wall which is fixed thereto by means of solder points - Google Patents

Printed-circuit board arrangement having a printed-circuit board and a metal wall which is fixed thereto by means of solder points

Info

Publication number
DE3233620A1
DE3233620A1 DE19823233620 DE3233620A DE3233620A1 DE 3233620 A1 DE3233620 A1 DE 3233620A1 DE 19823233620 DE19823233620 DE 19823233620 DE 3233620 A DE3233620 A DE 3233620A DE 3233620 A1 DE3233620 A1 DE 3233620A1
Authority
DE
Germany
Prior art keywords
circuit board
metal wall
printed
soldering
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19823233620
Other languages
German (de)
Other versions
DE3233620C2 (en
Inventor
Horst 7541 Neuenbürg Klußmann
Otto 7541 Straubenhardt Laupp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19823233620 priority Critical patent/DE3233620C2/en
Publication of DE3233620A1 publication Critical patent/DE3233620A1/en
Application granted granted Critical
Publication of DE3233620C2 publication Critical patent/DE3233620C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H05K9/0028—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet with retainers or specific soldering features
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0032—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids
    • H05K9/0035—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields having multiple parts, e.g. frames mating with lids with retainers mounted beforehand on the PCB, e.g. clips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10757—Bent leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10848—Thinned leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

In a printed-circuit board arrangement in which a metal wall which can be soldered is fixed to solder connecting pieces on a printed-circuit board, the metal wall contains fixing tongues at the point of the solder points to the printed-circuit board, which fixing tongues are constructed in a meandering shape in the centre part between the solder point on the tongue head and the connecting point to the metal wall. In consequence, the shear forces which are exerted on the solder points to the metal wall in the event of shrinkage of the printed-circuit board after a dip-soldering process, are reduced to such an extent that no tears in the solder point occur even in the event of large shrinkage paths. <IMAGE>

Description

Leiterplattenanordnung PCB arrangement

mit einer Leiterplatte und einer daran mittels Lötstellen befestigter Metallwand Die Erfindung betrifft eine Leiterplattenanordnung der im Oberbegriff des Anspruches 1 angegebenen Art. with a printed circuit board and one attached to it by means of soldering points Metal wall The invention relates to a circuit board arrangement as described in the preamble of claim 1 specified Art.

Es ist bekannt, an elektrisch isolierten Platten mit aufgedruckten Leiterbahnen mittels Lötzinn lötbare Metallwände an einzelnen auf die Leiterplatte aufgedruckten Lötanschlüssen zu befestigen Beispielsweise werden auf diese Weise Gehäusewände eines Abschirmgehäuses an der Leiterplatte der abzuschirmenden Schaltung befestigt.It is known to have printed on electrically insulated plates Conductor tracks individually on the circuit board that can be soldered by means of tin solder To attach printed solder connections, for example, in this way Housing walls of a shielding housing on the circuit board of the circuit to be shielded attached.

Die Verbindung der lötbaren Metallwand mit der Leiterplatte erfolgt entweder in einer Tauchlötvorrichtung, in der selbsttätig Lötzinn über die zu verbindenden Lötstellen geführt wird, oder durch einen von Hand betriebenen Lötvorgang, der sehr arbeitsaufwendig ist.The solderable metal wall is connected to the circuit board either in a dip soldering device, in which automatically solder over the to be connected Soldering is performed, or by a hand-operated soldering process that is very is labor intensive.

Bei einem Handlötvorgang wird die hohe Löttemperatur, beispielsweise 2400, nur örtlich auf die Metallwand und die angrenzende Leiterplatte übertragen. Beim Tauchlötvorgang dagegen kommt die gesamte Leiterplatte mit dem Lötzinn in Verbindung, so daß die gesamte Leiterplatte auf die Temperatur des Lötzinns gebracht wird. Die Lei- terplatte dehnt sich unter der Wärmeeinwirkung der hohen Löttemperatur erheblich aus. Die Ausdehnung der Leiterplatte ist erheblich größer als die der Metallwand, beispielsweise bei hundert Millimeter Leiterplattenlänge etwa 0,6 bis 0,8mm mehr als die Metallwand auf die gleiche Länge. Beim Erkalten der Leiterplatte schrumpft diese um den gleichen Betrag, so daß beim Schrunipfungsvorgang der Leiterplatte insbesondere auf die beim Tauchlötgang zuletzt hergestellten Lötverbindungen zwischen der Leiterplatte und der Metallwand nicht unerhebliche Scherbewegungen beim Abkühlen der Lötstelle, d.h. bei deren uebergang vom flüssigen in den festen Zustand entstehen. Die beim Schrumpfungsvorgang auftretende Scherkraft kann so groß sein, daß bereits während des Schrumpfungsvorganges in einzelnen Lötstellen Risse entstehen oder diese Lötstellen ganz abreißen, oder daß im laufe der Zeit durch zusätzliche Einflüsse der Umwelt und der Alterung des Lötzinngefüges nachträglich Risse in der Lötstelle entstehen, die die Lötverbindung schwächen oder unterbinden.In a manual soldering process, the high soldering temperature, for example 2400, only transferred locally to the metal wall and the adjacent circuit board. In the dip soldering process, on the other hand, the entire circuit board comes into contact with the tin solder, so that the entire circuit board is brought to the temperature of the solder. the Lead The plate expands when exposed to heat from the high soldering temperature considerably. The expansion of the circuit board is considerably larger than that of the Metal wall, for example at a hundred millimeters circuit board length about 0.6 to 0.8mm more than the metal wall on the same length. When the circuit board cools down this shrinks by the same amount, so that during the shrinkage process of the circuit board in particular on the last soldered connections between the circuit board and the metal wall not inconsiderable shear movements when cooling the solder joint, i.e. when it changes from the liquid to the solid state. The shear force occurring during the shrinkage process can be so great that already During the shrinking process, cracks or cracks develop in individual soldered joints Tear off solder joints completely, or that in the course of time due to additional influences the environment and the aging of the solder structure, subsequent cracks in the solder joint that weaken or prevent the soldered connection.

Der Erfindung liegt die Aufgabe zugrunde, bei einer Leiterplattenanordnung der im Oberbegriff des Anspruches 1 angegebenen Art die Stelle der Lötverbindung der Metallwand mit der Leiterplatte so auszubilden, daß die Scherkraft auf die Lötstelle nach einem Tauchlötvorgang so gering ist, daß keine Rissbildung in der Lötstelle zu befürchten ist. Diese Aufgabe wird nach der Erfindung durch die im kennzeichnenden Teil des Anspruches 1 angegebenen technischen Merkmale gelöst.The invention is based on the object of a circuit board arrangement of the type specified in the preamble of claim 1, the point of the soldered connection to form the metal wall with the circuit board in such a way that the shear force acts on the solder joint after a dip soldering process is so small that no cracks form in the solder joint is to be feared. This object is achieved according to the invention by the in the characterizing Part of claim 1 specified technical features solved.

Die Erfindung weist den Vorteil auf, daß an der Stelle der Lötstelle in der Metallwand lediglich ein zusätzli- cher Stanzvorgang erforderlich ist, der jedoch gegenüber anderen Maßnahmen, wie nachträgliches Anlöten der Metallwand an die Leiterplatte oder nachträgliches Nachlöten gefährdeter Lötstellen zwischen der Leiterplatte und der Metallwand wesentlich weniger Aufwand für die Herstellung der Leiterplattenanordnung erfordert.The invention has the advantage that at the point of the soldering point in the metal wall only an additional cher punching process required is, however, compared to other measures, such as subsequent soldering of the metal wall to the circuit board or subsequent re-soldering of endangered soldering points between the circuit board and the metal wall significantly less effort for the production the circuit board assembly requires.

Der Unteranspruch der Erfindung kennzeichnet eine vorteilhafte Maßnahme zur Herstellung einer mäanderförmigen Ausgestaltung des Mittelteils der Befestigungszungen.The sub-claim of the invention characterizes an advantageous measure for producing a meandering configuration of the central part of the fastening tongues.

Die Erfindung wird nachfolgend anhand eines in der Zeichnung dargestellten vorteilhaften Ausführungsbeispieles näher erläutert. Die drei Figuren der Zeichnung zeigen eine lötbare Metallwand 1, die über Lötstellen 2 und 3 mit einer Leiterplatte 4 einer die Leiterplatte 4 und die Metallwand 1 enthaltenden Leiterplattenanordnung befestigt ist. In der Zeichnung stellen die Figur 1 die Leiterplattenanordnung schematisch im noch ungelöteten Zustand dar, Figur 2 im Zustand unmittelbar nach einer Tauchlötung, in dem das Lötzinn an den Lötstellen noch flüssig ist, und in Figur 3 in einem abgekühlten Zustand nach der Tauchlötung. An der Stelle der Lötstellen 2,die durch die auf die Leiterplatte 4 aufgedruckten, sich an ihrem Rand befindenden Lötanschlußstücke 5 gekennzeichnet sind, sind in die Metallwand 1 Fenster 6 mit in den Fenstern befindlichen Befestigungszungen 7 eingestanzt.The invention is illustrated below with reference to one in the drawing advantageous embodiment explained in more detail. The three figures of the drawing show a solderable metal wall 1, which is connected to a circuit board via solder points 2 and 3 4 a circuit board arrangement containing the circuit board 4 and the metal wall 1 is attached. In the drawing, FIG. 1 shows the circuit board arrangement schematically in the still unsoldered state, FIG. 2 in the state immediately after dip soldering, in which the solder is still liquid at the soldering points, and in Figure 3 in a cooled Condition after dip soldering. At the point of the soldering points 2, which through the on the Printed circuit board 4, located at its edge solder connection pieces 5 are marked are in the metal wall 1 window 6 with located in the windows Fastening tongues 7 stamped.

Der Mittelteil 8 der Befestigungszunge enthält an der Verbindungsstelle 9 mit der Metallwand und unterhalb der Lötstelle 2 jeweils eine rechteckförmige Einschnürung 10, so daß an deren Stelle das Mittelteil der Befestigungszunge nur noch von einem dünnen Steg gebildet ist und der Mittelteil der Befestigungszungen etwa eine mäanderförmige Ausgestaltung aufweist.The middle part 8 of the fastening tongue contains at the connection point 9 with the metal wall and below the soldering point 2 each a rectangular Constriction 10, so that in its place only the central part of the fastening tongue is still formed by a thin web and the central part of the fastening tongues approximately has a meandering configuration.

Bis zur Beendigung des Tauchlötvorganges ist die Metallwand 1 gegenüber der Leiterplatte 4 beispielsweise so festgehalten, daß sich die Leiterplatte bei Dehnungs-und Schrumpfungsprozessen an der Lötstelle 3, die durch das auf die Leiterplatte aufgedruckte Lötanschlußstück 11 gekennzeichnet ist, nicht gegen die Metallwand bewegt.Until the end of the dip soldering process, the metal wall 1 is opposite the circuit board 4 for example held in such a way that the circuit board is at Expansion and shrinkage processes at the solder joint 3 caused by the on the circuit board printed solder joint 11 is marked, not against the metal wall emotional.

Die Lötanschlußstücke 5, die im kalten Zustand der Leittrplatve beispielsweise an der rechten Kante des Kopfes der Befestigungszunge anliegen (Figur 1), liegen infolge der größeren Wärmeausdehnung der Leiterplatte 4 im Zeitpunkt unmittelbar nach dem Tauchlötvorgangzin dem das an die Lötstellen 2 und 3 gebrachteLötzinn 12 und 13 noch flüssig ist, nunmehr an oder nahe der linken Kante des Kopfes der Befestigungszungen (Figur 2). Mit Beginn des Zustandes, in dem das Lötzinn 12 und 13 vom flüssigen in den festen Zustand übergeht, wird der Kopf der Befestigungszungen 7 mit den Lötanschlußstücken 5 der Leiterplatte 4 starr verbunden.Beim weiteren Schrumpfungsvorgang der Leiterplatte 4 darf die Rückstellkraft, die die Befestigungszungen zwischen der Lötstelle 2 und der Verbindungsstelle 9 mit der Metallwand 1 ausüben, nicht so groß werden, daß sie das starr werdende Gefüge des Lötzinnes 12 an der Lötstelle 2 stört. Die erstarrte Lötstelle zieht die an ihr mit ihrem Zungenkopf starr befestigten Befestigungszungen bis zur Abkühlung in eine in Figur 3 dargestellte versetzte Lage. In Folge der rechteckförmigen Einschnürungen 10 im Mittel-und Unterteil 8 der Befestigungszungen treten im Verhältnis zu einem starren Material geringe Scherkräfte an den Lötstellen 2 auf.The soldering connection pieces 5, for example, in the cold state of the Leittrplatve rest against the right edge of the head of the fastening tongue (Figure 1) due to the greater thermal expansion of the circuit board 4 at the time immediately after the dip soldering process, the solder 12 applied to soldering points 2 and 3 and 13 is still liquid, now at or near the left edge of the head of the fastening tabs (Figure 2). With the beginning of the state in which the solder 12 and 13 from the liquid goes into the solid state, the head of the fastening tabs 7 with the soldering fittings 5 of the circuit board 4 rigidly connected. During the further shrinkage process of the circuit board 4, the restoring force that the fastening tabs between the solder joint 2 and exercise the junction 9 with the metal wall 1, do not become so large that it disrupts the structure of the solder 12 at the solder point 2, which is becoming rigid. She froze The soldering point pulls the fastening tongues that are rigidly attached to her with her tongue head until it has cooled down in an offset position shown in FIG. In consequence of the rectangular Constrictions 10 in the middle and lower part 8 of the fastening tongues occur in proportion low shear forces at the soldering points 2 to form a rigid material.

Bei geringen Schrumpfungsbewegungen der LeiterpLatte 4 gegenüber der Metallwand 1 genügt in vielen Fällen eine einzige rechteckförmige Einschnürung10 in der Befesti- gungszunge, so daß an der Stelle der Einschnürung ein einziger dünner Steg 14 im Mittelteil der Befestigungszunge entsteht, an dem die Befestigungszunge beim Schrumpfvorgang der Leiterplatte 4 gedehnt wird. Bezugszeichen (BZ) - Verzeichnis für e Bezeichnung0* ..SZ . ~ .. Bezeichnung 0*0 ~ # ~.###hnung 1 £k X zu 32 2 4 33 3 34 4 #~#qA 35 5 36 6 >X 37 7 38 8 39 9 L/e##b# W0>b( » 9 40 10 7z4 £&###t\6U<#1##"# 41 11 4<G@94» 42 43 3 1 rc 44 i#I5/ 45 , 8 45 151 46 16 47 17 48 18 49 19 50 20 51 21 52 22 53 23 54 24 55 25 56 26 57 27 28 59 29 60 30 61 LeerseiteWith slight shrinkage movements of the printed circuit board 4 relative to the metal wall 1, a single rectangular constriction 10 in the fastening tongue is sufficient in many cases, so that at the point of the constriction a single thin web 14 is created in the middle part of the fastening tongue, on which the fastening tongue during the shrinking process of the circuit board 4 is stretched. Reference symbol (BZ) - directory for e Designation0 * ..SZ. ~ .. Description 0 * 0 ~ # ~. ### hnung 1 £ k X to 32 2 4 33 3 34 4 # ~ # qA 35 5 36 6> X 37 7 38 8 39 9 L / e ## b # W0> b (»9 40 10 7z4 £ &### t \ 6U <# 1 ## "# 41 11 4 <G @ 94 »42 43 3 1 rc 44 i # I5 / 45 , 8 45 151 46 16 47 17 48 18 49 19 50 20 51 21 52 22 53 23 54 24 55 25 56 26 57 27 28 59 29 60 30 61 Blank page

Claims (2)

Patentansprüche Leiterplattenanordnung mit einer Leiterplatte und mit einer durch Lötstellen an der Leiterplatte befestigten lötbaren Metallwand, da du r c h gek e n n z e i c h n e t, daß die Metallwand (1) zumindest an der Stelle eines Teils der vorgesehenen Lötstellen (2) Befestigungszungen (7) enthält, an deren Ende sich die Lötstelle mit dem zu verbindenden Lötanschlußstück (5) auf der Leiterplatte (4) befindet, und daß der Teil (8) der Befestigungszunge, der sich zwischen der Lötstelle und der Verbindungsstelle (9) mit der Metallwand befindet, mittels einer mäamderförmigen Ausbildung oder eines dünnen Steges (14) so bemessen ist, daß die Rückstellkraft der Befestigungszunge an der Lötstelle bei einer beginnenden Auslenkung der Befestigungszunge kleiner ist als die zulässige, auf eine vom flüssigen in den festen Zustand übergehende Lötstelle einwirkende Scherkraft. Circuit board assembly with a circuit board and with a solderable metal wall attached to the circuit board by soldering points, as you can tell that the metal wall (1) at least at the point Part of the intended soldering points (2) contains fastening tongues (7), on whose The soldering point ends with the soldering connection piece (5) to be connected on the circuit board (4) is, and that the part (8) of the fastening tongue, which is between the Soldering point and the connection point (9) with the metal wall, by means of a mäamder-like training or a thin web (14) is dimensioned so that the Resetting force of the fastening tongue at the soldering point when a deflection begins the fastening tongue is smaller than the permissible, on one of the liquid in the solid state transient solder joint acting shear force. 2. Leiterplattenanordnung nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß der zwischen der Lötstelle (2) und der Verbindungsstelle (9) mit der Metallwand (1) befindliche Teil (8) der Befestigungszunge (7) wenigstens zwei rechteckförmige Einschnürungen (10) aufweist.2. Printed circuit board assembly according to claim 1, d a d u r c h g e k e n n z e i c h n e t that the between the soldering point (2) and the connection point (9) with the metal wall (1) located part (8) of the fastening tongue (7) at least has two rectangular constrictions (10).
DE19823233620 1982-09-10 1982-09-10 Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points Expired DE3233620C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823233620 DE3233620C2 (en) 1982-09-10 1982-09-10 Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823233620 DE3233620C2 (en) 1982-09-10 1982-09-10 Circuit board arrangement with a circuit board and a metal wall attached to it by means of soldering points

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DE3233620A1 true DE3233620A1 (en) 1984-03-15
DE3233620C2 DE3233620C2 (en) 1984-07-26

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1121006A2 (en) * 2000-01-24 2001-08-01 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover
DE19711325C2 (en) * 1996-03-18 2003-04-17 Alps Electric Co Ltd Fastening construction for printed circuit boards

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19730712C1 (en) * 1997-07-17 1998-11-12 Siemens Ag Housing part of valve control device with contact pin e.g. for braking system control
DE19730972C1 (en) * 1997-07-18 1998-10-22 Siemens Ag Housing part for electronic valve control device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076165A (en) * 1976-06-03 1978-02-28 Motorola, Inc. Mounting arrangement for chassis and printed circuit board with method of assembly
DE7815776U1 (en) * 1978-05-26 1978-09-14 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Device for fastening two printed circuit boards

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4076165A (en) * 1976-06-03 1978-02-28 Motorola, Inc. Mounting arrangement for chassis and printed circuit board with method of assembly
DE7815776U1 (en) * 1978-05-26 1978-09-14 Grundig E.M.V. Elektro-Mechanische Versuchsanstalt Max Grundig, 8510 Fuerth Device for fastening two printed circuit boards

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19711325C2 (en) * 1996-03-18 2003-04-17 Alps Electric Co Ltd Fastening construction for printed circuit boards
EP1121006A2 (en) * 2000-01-24 2001-08-01 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover
EP1121006A3 (en) * 2000-01-24 2003-05-21 Alps Electric Co., Ltd. Transmitter-receiver unit that ensures mounting of cover

Also Published As

Publication number Publication date
DE3233620C2 (en) 1984-07-26

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