DE3215149A1 - Doping solution for semiconductors - Google Patents
Doping solution for semiconductorsInfo
- Publication number
- DE3215149A1 DE3215149A1 DE19823215149 DE3215149A DE3215149A1 DE 3215149 A1 DE3215149 A1 DE 3215149A1 DE 19823215149 DE19823215149 DE 19823215149 DE 3215149 A DE3215149 A DE 3215149A DE 3215149 A1 DE3215149 A1 DE 3215149A1
- Authority
- DE
- Germany
- Prior art keywords
- doping solution
- doping
- solution
- solution according
- dopant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 10
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002253 acid Substances 0.000 claims abstract description 6
- 239000002019 doping agent Substances 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000003054 catalyst Substances 0.000 claims abstract description 3
- 229910052698 phosphorus Inorganic materials 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- VEQPNABPJHWNSG-UHFFFAOYSA-N Nickel(2+) Chemical compound [Ni+2] VEQPNABPJHWNSG-UHFFFAOYSA-N 0.000 claims 1
- 229910001453 nickel ion Inorganic materials 0.000 claims 1
- -1 phosphorus compound Chemical class 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- DLYUQMMRRRQYAE-UHFFFAOYSA-N phosphorus pentoxide Inorganic materials O1P(O2)(=O)OP3(=O)OP1(=O)OP2(=O)O3 DLYUQMMRRRQYAE-UHFFFAOYSA-N 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- WRECIMRULFAWHA-UHFFFAOYSA-N trimethyl borate Chemical compound COB(OC)OC WRECIMRULFAWHA-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 150000001639 boron compounds Chemical class 0.000 description 1
- 235000011089 carbon dioxide Nutrition 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 235000011007 phosphoric acid Nutrition 0.000 description 1
- 150000003016 phosphoric acids Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/22—Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
- H01L21/2225—Diffusion sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Catalysts (AREA)
- Paints Or Removers (AREA)
Abstract
Description
Dotierlösung für HalbleiterDoping solution for semiconductors
Stand der Technik Die Erfindung geht aus von einer Dotierlösung nach der Gattung des Hauptanspruchs.PRIOR ART The invention is based on a doping solution the genre of the main claim.
Aus der DE-PS 23 40 111 ist bereits eine Dotierlösung dieser Art bekannt. Diese Lösung bildet nach dem Aufschleudern auf die Siliziumplatte einen weichen Überzug, der anschließend in einem Trockenofen bei einer Temperatur von 200 C gehärtet werden muß. Erst danach ist der Dotierfilm so hart, daß er durch das übliche handling vor der Diffusion nicht mehr beschädigt werden kann. Vor dem Härten ist aber der weiche Film empfindlich gegen Beschädigungen. Beschädigungen führen aber andererseits zu Ungleichmäßigkeiten bei der anschließend auszuführenden Diffusion und beeinflussen daher die Ausbeute nachteilhaft.A doping solution of this type is already known from DE-PS 23 40 111. After being spun onto the silicon plate, this solution forms a soft one Coating that is then hardened in a drying oven at a temperature of 200 C. must become. Only then is the doping film so hard that it can be damaged by normal handling can no longer be damaged prior to diffusion. But before hardening is that soft film sensitive to damage. On the other hand, damage leads to damage to irregularities in the diffusion to be carried out afterwards and influence them hence the yield is disadvantageous.
Vorteile der Erfindung Die erfindungsgemäße Dotierlösung mit dem kennzeichnenden Merkmal des Hauptanspruchs bietet demgegenüber den Vorteil, daß die Filme bereits während des Aufschleuderns der Lösungen trocknen.Advantages of the invention The doping solution according to the invention with the characterizing Feature of the main claim has the advantage that the Movies dry while the solutions are being spun on.
Nach dem AuSschleudern, das typisch 10 Sekunden lang bei 3 000 Umdrehungen pro Minute erfolgt, sind die Filme hart und deshalb gegen Beschädigungen geschützt.After centrifuging, typically for 10 seconds at 3,000 revolutions per minute, the films are hard and therefore protected against damage.
Beschreibung des Ausführungsbeispiels Die Dotierlösungen gemäß der Erfindung wurden speziell zur Herstellung von pn-Ubergängen in Siliziumplatten entwickelt und enthalten deshalb entweder eine Bor- oder eine Phosphorverbindung. Sie sind zum Aufschleudern auf Siliziumplatten geeignet, das in an sich bekannter Weise ausgeführt wird.Description of the exemplary embodiment The doping solutions according to FIG Invention were specially developed for the production of pn junctions in silicon wafers and therefore contain either a boron or a phosphorus compound. they are suitable for spin-coating on silicon plates, which is carried out in a manner known per se will.
Außer dem Dotierungsstoff enthalten die Lösungen einen Filmbildner, der in folgender Weise hergestellt wird: Tetraetylorthosilikat und Ethanol (absolut) werden in verschiedenen Verhältnissen gemischt (Gewichtsverhältnis Tetraethylorthosilikat: Ethanol zwischen 5 : 1 und 1 : 5). Dann wird als Katalysator eine 37prozentige wässrige Salzsäurelösung zugesetzt, und zwar 0,4 ml HCl auf 100 g Tetraethylorthosilikat. Außerdem werden 17 g Wasser auf 100 g Tetraethylorthosilikat zugegeben.In addition to the dopant, the solutions contain a film former, which is produced in the following way: tetraethyl orthosilicate and ethanol (absolute) are mixed in different proportions (weight ratio tetraethyl orthosilicate: Ethanol between 5: 1 and 1: 5). Then a 37 percent aqueous catalyst is used Hydrochloric acid solution added, namely 0.4 ml of HCl to 100 g of tetraethylorthosilicate. In addition, 17 g of water are added to 100 g of tetraethyl orthosilicate.
In diese fertige Jilmbildnermischung wird die Bor- bzw. Phosphorverbindung eingerührt. Als Borverbindung wird Trimethylborat (C3H9B03) verwendet. Die Konzentration beträgt dabei bis zu 40 g Trimethylborat pro 100 g Dotierlösung. Als Phosphorverbindung wird Phosphorpentoxid (P205) verwendet. Die Konzentration beträgt dabei bis zu 15 gP205 pro 100 g D)otierlösung.The boron or phosphorus compound is incorporated into this finished film-forming mixture stirred in. Trimethyl borate (C3H9B03) is used as the boron compound. The concentration is up to 40 g trimethyl borate per 100 g doping solution. As a phosphorus compound Phosphorus pentoxide (P205) is used. The concentration is up to 15 gP205 per 100 g of D) solution.
In die Phosphordotierlösung kann zur Einstellung der Schaltzeit des Bauelements Nickelchlorid beigemischt werden (6,5 g Nicl2 . 6H2o pro 100 g Dotierlösung).In the phosphorus doping solution to adjust the switching time of the Component nickel chloride are added (6.5 g Nicl2.6H2o per 100 g doping solution).
Der besondere Vorteil bei der Herstellung der Phosphordotierlösung besteht darin, daß Phosphorpentoxid direkt zum Filmbildnergemisch hinzugefügt werden kann, ohne daß dazu eine aufwendige Kühlung mit Trockeneis oder die Beimischung inerter Lösungsmittel wie Äther notwendig wäre. Auch ist der Umweg über Phosphorsäuren nicht notwendig.The particular advantage in the production of the phosphorus doping solution consists in adding phosphorus pentoxide directly to the film former mixture can without the need for costly cooling with dry ice or admixture inert solvent such as ether would be necessary. Also the detour is via phosphoric acids unnecessary.
Der Vorteil der erfindungsgemäßen Dotierlösung gegenüber bekannten Dotierlösungen besteht in dem besonders guten Trocknungsverhalten der Lösung. Wesentlich für dieses Trocknungsverhalten ist in der Zusammensetzung des ilmbildners der Gehalt an Säure. Höhere Säuregehalte führen dabei zu schnellerer Trocknung. Die katalytische Wirkung der Wasserstoffionen bzw.The advantage of the doping solution according to the invention over known ones Doping solutions consist in the particularly good drying behavior of the solution. Essential for this drying behavior is the content in the composition of the film former of acid. Higher acid contents lead to faster drying. The catalytic Effect of the hydrogen ions or
Hydroniumionen, die durch die Säure geliefert werden, besteht dabei darin, daß das Tetraethylorthosilikat mit Wasser zu Alkohol und Siliziumdioxid umgesetzt wird. Der Alkohol verdunstet, und das Siliziumdioxid bildet den harten Film, in den der Dotierungsstoff eingebettet ist.Hydronium ions supplied by the acid exist in that the tetraethylorthosilicate reacted with water to form alcohol and silicon dioxide will. The alcohol evaporates, and the silicon dioxide forms the hard film in which the dopant is embedded.
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823215149 DE3215149A1 (en) | 1982-04-23 | 1982-04-23 | Doping solution for semiconductors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19823215149 DE3215149A1 (en) | 1982-04-23 | 1982-04-23 | Doping solution for semiconductors |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3215149A1 true DE3215149A1 (en) | 1983-10-27 |
Family
ID=6161720
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE19823215149 Withdrawn DE3215149A1 (en) | 1982-04-23 | 1982-04-23 | Doping solution for semiconductors |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE3215149A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0206938A2 (en) * | 1985-06-21 | 1986-12-30 | Fairchild Semiconductor Corporation | Germanosilicate spin-on glasses |
DE19500392A1 (en) * | 1995-01-09 | 1996-07-18 | Siemens Ag | Integrated circuit structure (TI2> has diffusion zone formed in wall of groove fully enclosing silicon island in monocrystalline surface layer |
-
1982
- 1982-04-23 DE DE19823215149 patent/DE3215149A1/en not_active Withdrawn
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0206938A2 (en) * | 1985-06-21 | 1986-12-30 | Fairchild Semiconductor Corporation | Germanosilicate spin-on glasses |
EP0206938A3 (en) * | 1985-06-21 | 1988-02-10 | Fairchild Semiconductor Corporation | Germanosilicate spin-on glasses |
US4935095A (en) * | 1985-06-21 | 1990-06-19 | National Semiconductor Corporation | Germanosilicate spin-on glasses |
DE19500392A1 (en) * | 1995-01-09 | 1996-07-18 | Siemens Ag | Integrated circuit structure (TI2> has diffusion zone formed in wall of groove fully enclosing silicon island in monocrystalline surface layer |
US5747867A (en) * | 1995-01-09 | 1998-05-05 | Siemens Aktiengesellschaft | Integrated circuit structure with interconnect formed along walls of silicon island |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8139 | Disposal/non-payment of the annual fee |