DE3210996A1 - Circuit board with metal inlay - Google Patents

Circuit board with metal inlay

Info

Publication number
DE3210996A1
DE3210996A1 DE19823210996 DE3210996A DE3210996A1 DE 3210996 A1 DE3210996 A1 DE 3210996A1 DE 19823210996 DE19823210996 DE 19823210996 DE 3210996 A DE3210996 A DE 3210996A DE 3210996 A1 DE3210996 A1 DE 3210996A1
Authority
DE
Germany
Prior art keywords
metal
circuit board
insulating material
circuit boards
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19823210996
Other languages
German (de)
Inventor
Rüdiger Dipl.-Phys. 7000 Stuttgart Ihle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alcatel Lucent Deutschland AG
Original Assignee
Standard Elektrik Lorenz AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Standard Elektrik Lorenz AG filed Critical Standard Elektrik Lorenz AG
Priority to DE19823210996 priority Critical patent/DE3210996A1/en
Publication of DE3210996A1 publication Critical patent/DE3210996A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2045—Protection against vibrations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

In order to achieve good vibration damping on circuit boards with metal inlay, a metal-plastic composite plate is inserted between the layers of insulating material. According to another solution, the metal inlay is connected to the layers of insulating material by a damping adhesive. <IMAGE>

Description

Leiterplatte mit Metalleinlage Printed circuit board with metal insert

Die Erfindung bezieht sich auf Leiterplatten mit Metalleinlage.The invention relates to printed circuit boards with a metal insert.

Es sind Leiterplatten bekannt, bei denen die Isolierstoffplatte, auf deren Außenseiten die Leiterbahnen aufgebracht sind, aus zwei Schichten besteht, zwischen die eine Metallschicht, vorzugsweise aus einer Aluminiumlegierung, eingefügt ist. Solche, auch als Metallkern-Leiterplatten bezeichnete Schaltungsplatten erhalten dadurch eine größere mechanische Stabilität als Leiterplatten ohne Metalleinlage. Auf diese Weise können insbesondere Biegesteife und Bruchfestigkeit wesentlich erhöht werden. Auch die Wärmeleitung kann damit günstig be-einflußt werden. Hinsichtlich des Schwingungsverhaltens der Leiterplatten tritt jedoch keine nennenswerte Verbesserung ein.There are circuit boards known in which the insulating plate on the outside of which the conductor tracks are applied, consists of two layers, inserted between the one metal layer, preferably made of an aluminum alloy is. Such circuit boards, also known as metal core circuit boards, are obtained thus greater mechanical stability than printed circuit boards without a metal insert. In this way, bending stiffness and breaking strength in particular can be increased significantly will. The heat conduction can also be favorably influenced in this way. Regarding However, there is no significant improvement in the vibration behavior of the circuit boards a.

Für bestimmte Anwendungsfälle ist aber das Schwingungsverhalten der Leiterplatten von Bedeutung, nämlich dort, wo sie ständig oder zeitweilig Stößen und Schwingungen in besonderem Maße ausgesetzt sind. Dies ist z.B. beim Einsatz in Geräten des Mobilfunks oder mobiler Vermittlungen sowohl im zivilen, aber mehr noch im militärischen Bereich der Fall Mehr noch als die Leiterplatten selbst sind dabei die auf ihnen befestigten elektrischen Bauelemente gefährdet.For certain applications, however, the vibration behavior is the Printed circuit boards are important, namely where they are constantly or intermittently bumped and vibrations are particularly exposed. This is e.g. when using in Devices of the mobile radio or mobile switching both in the civil, but even more so The case in the military sector Even more than the circuit boards themselves are included the electrical components attached to them are endangered.

Der Erfindung liegt deshalb die Aufgabe zugrunde, bei Leiterplatten mit Metalleinlage eine gute Schwingungsdämpfung zu erzielen. Eine Lösung dieser Aufgabe ist dadurch gekennzeichnet, daß zwischen zwei die Leiterbahnen tragenden Isolierstoffschichten eine mehrschichtige Metall-Kunststoff-Verbundplatte eingefügt ist.The invention is therefore based on the object in printed circuit boards to achieve good vibration damping with a metal insert. A solution to this Task is characterized in that between two carrying the conductor tracks Layers of insulating material are inserted into a multilayer metal-plastic composite panel is.

Derartige Metall-Kunststoff-Verbundplatten aus Aluminium und Kunststoff sind an sich bekannt und werden in der Bauindustrie als Fassadenverkleidung oder für den Innenausbau verwendet. Auch die Möbelindustrie bedient sich solcher Elemente für die Inneneinrichtungen von Büros und Ladenstraßen.Such metal-plastic composite panels made of aluminum and plastic are known per se and are used in the construction industry as facade cladding or used for interior work. The furniture industry also makes use of such elements for the interiors of offices and shopping streets.

Eine andere Lösung sieht vor, daß die Metalleinlage auf beiden Seiten mittels Dämpfungsklebstoff mit den Isolierstoffschichten verbunden ist.Another solution provides that the metal insert on both sides is connected to the insulating material layers by means of damping adhesive.

Leiterplatten entsprechend den angegebenen Lösungen, und zwar sowohl Einfach- als auch Mehrlagenschaltungen, erfüllen die gestellten Forderungen, d.h. ihr Schwingungsverhalten ist durch eine gute Dämpfung gekennzeichnet. Resonanzen können weitgehend vermieden werden, die Gefahr der Zerstörung von auf den Leiterplatten befestigten elektrischen Bauelementen ist gering. Dies ist besonders auch bei Verwendung der Leiterplatten als Träger für keramische Schaltkreise (Chips) von Vorteil.Printed circuit boards according to the solutions given, both Single and multi-layer circuits meet the requirements, i.e. their vibration behavior is characterized by good damping. Resonances can largely avoid the risk of destruction on the circuit boards attached electrical components is low. This is especially true when using of the printed circuit boards as a carrier for ceramic circuits (chips) is advantageous.

Die Erfindung wird anhand von Beispielen näher beschrieben die in der zugehörigen Zeichnung dargestellt sind. Darin zeigen Fig. 1 einen Teilquerschnitt durch eine erfindungsgemäße Leiterplatte mit Dämpfungsschicht und Fig. 2 einen Teilquerschnitt durch eine andere Ausführung der erfindungsgemäßen Leiterplatte.The invention is described in more detail by means of examples in are shown in the accompanying drawing. 1 shows a partial cross-section through a printed circuit board according to the invention with a damping layer and FIG. 2 shows a partial cross section by another embodiment of the circuit board according to the invention.

Bei der in Fig. 1 gezeigten Leiterplatte 1 ist zwischen die beiden Isolierstoffschichten 2, auf deren Außenseiten die Leiterbahnen 4 aufgebracht eind, eine Dämpfungsschicht 3 eingefügt, die von einer Metall-Kunststoff-Verbumdplatte gebildet wird. Bei dieser Verbundplatte sind zwei Metallschichten, vorzugsweise einer Atuminium-Legierung, durch eine elastische Kunststoffschicht fest miteinander verbunden, wobei der Kunststoff z.B. ein Gummi sein kann. An der Stelle einer Durchverbindung 5, an der die Leiterbahnen 4 beider Seiten miteinander verbunden sind, ist die Metallschicht 3 so gelocht, daß die Durchplattierung von der Metallschicht durch Isolierstoff 6 getrennt ist.In the circuit board 1 shown in Fig. 1 is between the two Insulating material layers 2, on the outer sides of which the conductor tracks 4 are applied, a damping layer 3 inserted by a metal-plastic Verbumdplatte is formed. In this composite panel, two layers of metal are preferred an aluminum alloy, firmly together with an elastic plastic layer connected, whereby the plastic can be, for example, a rubber. At the point of a through connection 5, on which the conductor tracks 4 on both sides are connected to one another, is the metal layer 3 punched so that the metal layer is plated through with insulating material 6 is separated.

Bei der zweiten Ausführung gemäß Fig. 2 ist die Leiterplatte 10 ähnlich aufgebaut, jedoch ist hierbei eine Metallplatte 13 beiderseits mit Dämpfungskleber, einem zähelastischein Kunststoffprodukt beschichtet und über diesen mit den Isolierstoffschichten 2 verbunden. Hinsichtlich der Durchverbindung 5 gilt das oben Gesagte.In the second embodiment according to FIG. 2, the circuit board 10 is similar built up, but here a metal plate 13 is on both sides with damping adhesive, coated with a viscoplastic plastic product and over this with the layers of insulating material 2 connected. With regard to the through connection 5, what has been said above applies.

Dargestellt sind in den Figuren einfache, zweiseitig bedruckte Leiterplatten. Bei Mehrlagenschaltungen (Multiliyer Board) ist die Dämpfungsschicht 3 oder 13 an geei gneter Stelle zwischen zwei der Isolierstoffschichten mit den Le j t erbahmem eingefügt.The figures show simple, double-sided printed circuit boards. In the case of multilayer circuits (multilayer board), the damping layer 3 or 13 is on suitable place between two of the insulating material layers with the Le j t erbahmem inserted.

Claims (2)

Ansprüche Leiterplatte (1) mit Metall-einlage, d a d u r c h g e k e n n z e i c h n e t , daß zwischen zwei Leiterbahnen (4) tragende Isolierstoffschichten (2) eine mehrschichtige MetaLl-K-unststoff-VerbundpLatte (3) eingefügt ist. Claims printed circuit board (1) with metal insert, d a d u r c h g e It is not possible to say that between two conductor tracks (4) supporting layers of insulating material (2) A multilayer metal-plastic composite plate (3) is inserted. 2. Leiterplatte (10) mit Metalleinlage, dadurch gekennzeichnet, daß die MetaLLeinlage(13) mittels Dämpfungsklebstoff (14) mit den Leiterbahnen (4) tragenden Isolierstoff schichten (2) verbunden ist. 2. printed circuit board (10) with metal insert, characterized in that supporting the metal insert (13) with the conductor tracks (4) by means of damping adhesive (14) Insulating material layers (2) is connected.
DE19823210996 1982-03-25 1982-03-25 Circuit board with metal inlay Withdrawn DE3210996A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19823210996 DE3210996A1 (en) 1982-03-25 1982-03-25 Circuit board with metal inlay

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19823210996 DE3210996A1 (en) 1982-03-25 1982-03-25 Circuit board with metal inlay

Publications (1)

Publication Number Publication Date
DE3210996A1 true DE3210996A1 (en) 1983-09-29

Family

ID=6159283

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19823210996 Withdrawn DE3210996A1 (en) 1982-03-25 1982-03-25 Circuit board with metal inlay

Country Status (1)

Country Link
DE (1) DE3210996A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019231672A1 (en) * 2018-05-31 2019-12-05 Microsoft Technology Licensing, Llc Audible signal attenuating printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019231672A1 (en) * 2018-05-31 2019-12-05 Microsoft Technology Licensing, Llc Audible signal attenuating printed circuit board
US10616999B2 (en) 2018-05-31 2020-04-07 Microsoft Technology Licensing, Llc Audible signal attenuating printed circuit board

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