DE3172141D1 - Production of metal clad laminates - Google Patents

Production of metal clad laminates

Info

Publication number
DE3172141D1
DE3172141D1 DE8181107545T DE3172141T DE3172141D1 DE 3172141 D1 DE3172141 D1 DE 3172141D1 DE 8181107545 T DE8181107545 T DE 8181107545T DE 3172141 T DE3172141 T DE 3172141T DE 3172141 D1 DE3172141 D1 DE 3172141D1
Authority
DE
Germany
Prior art keywords
production
metal clad
clad laminates
laminates
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
DE8181107545T
Other languages
German (de)
English (en)
Inventor
Masayuki Oizumi
Masaharu Abe
Yasuo Fushiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Application granted granted Critical
Publication of DE3172141D1 publication Critical patent/DE3172141D1/de
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/12—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B29/00—Layered products comprising a layer of paper or cardboard
    • B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/0036—Heat treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B2038/0052—Other operations not otherwise provided for
    • B32B2038/0076—Curing, vulcanising, cross-linking
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/028—Paper layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1194—Thermal treatment leading to a different chemical state of a material, e.g. annealing for stress-relief, aging
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
DE8181107545T 1980-09-25 1981-09-22 Production of metal clad laminates Expired DE3172141D1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55133814A JPS5758396A (en) 1980-09-25 1980-09-25 Method of producing metal foil lined laminated board

Publications (1)

Publication Number Publication Date
DE3172141D1 true DE3172141D1 (en) 1985-10-10

Family

ID=15113656

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8181107545T Expired DE3172141D1 (en) 1980-09-25 1981-09-22 Production of metal clad laminates

Country Status (5)

Country Link
US (1) US4410388A (enExample)
EP (1) EP0048945B1 (enExample)
JP (1) JPS5758396A (enExample)
CA (1) CA1175335A (enExample)
DE (1) DE3172141D1 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4591088A (en) * 1983-05-31 1986-05-27 Hughes Aircraft Company Solder reflow process for soldering shaped articles together
FR2554046B1 (fr) * 1983-10-28 1986-05-09 Gen Electric Stratifie recouvert de metal et procede de fabrication
JPS61141550A (ja) * 1984-12-14 1986-06-28 鐘淵化学工業株式会社 積層板の処理方法
US4786528A (en) * 1986-05-20 1988-11-22 International Business Machines Corporation Process for treating reinforced polymer composite
US4803022A (en) * 1987-05-06 1989-02-07 Glasteel Industrial Laminates, Inc. Method of continuously bonding and curing a zinc-coated metal-clad polyester-epoxy-glass fiber laminate
US5057372A (en) * 1989-03-22 1991-10-15 The Dow Chemical Company Multilayer film and laminate for use in producing printed circuit boards
CA2045987A1 (en) * 1990-08-06 1992-02-07 Haruhiko Maki Continuous production of metal clad laminates
US5098781A (en) * 1990-12-28 1992-03-24 General Electric Company Thermoplastic film, reinforced hollow glass microsphere reinforced laminates for thin low dielectric constant substrates
FR2677803B1 (fr) * 1991-06-11 1993-08-20 Europ Composants Electron Procede de fabrication de condensateurs a films de polyethylene naphtalene metallises de type empile ou bobine.
US5527998A (en) * 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
JP7896375B2 (ja) * 2022-06-23 2026-07-29 株式会社レゾナック 樹脂付き金属箔の製造方法、積層板の製造方法、プリント配線板の製造方法及び半導体パッケージの製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2149812A (en) * 1931-12-28 1939-03-07 Globe Union Inc Method of drying battery plates
US2553192A (en) * 1947-09-09 1951-05-15 Gen Motors Corp Method of curing positive storage battery plates
LU33479A1 (enExample) * 1954-05-31
US3217065A (en) * 1960-12-16 1965-11-09 Monsanto Co Laminated structures
US3388036A (en) * 1965-07-12 1968-06-11 Gen Electric Metal-coated plastic laminate
US3352960A (en) * 1965-08-18 1967-11-14 Andermac Inc Plastic tube bending method
US3794552A (en) * 1971-07-12 1974-02-26 Riverside Labor Inc Laminating materials for low pressure laminates,method of making same,and laminates thereof
US3936575A (en) * 1973-02-21 1976-02-03 Sumitomo Bakelite Company, Limited Flexible metal-clad laminates and method for manufacturing the same
US3988408A (en) * 1974-09-16 1976-10-26 International Business Machines Corporation Stabilization of printed circuit board core laminates
US4012267A (en) * 1975-07-10 1977-03-15 Bell Telephone Laboratories, Incorporated Process for producing pultruded clad composites
SU620463A1 (ru) * 1976-10-04 1978-08-25 Научно-Исследовательский Институт Бетона И Железобетона Госстроя Ссср Способ тепловлажностной обработки бетонных изделий в термоформах
JPS5546970A (en) * 1978-09-28 1980-04-02 Kanegafuchi Chemical Ind Laminated plate for electricity and its preparation
GB2075423B (en) * 1979-03-26 1983-04-20 Kanegafuchi Chemical Ind Method of and device for continuously fabricating laminate

Also Published As

Publication number Publication date
JPS5758396A (en) 1982-04-08
EP0048945B1 (en) 1985-09-04
EP0048945A3 (en) 1982-08-04
EP0048945A2 (en) 1982-04-07
JPS6217532B2 (enExample) 1987-04-17
US4410388A (en) 1983-10-18
CA1175335A (en) 1984-10-02

Similar Documents

Publication Publication Date Title
AU544967B2 (en) Method of producing multi-layered metal effect lacquerings
GB2108427B (en) Continuous production of copper clad laminates
DE3168588D1 (en) Production of aluminium alloy sheet
JPS5725949A (en) Manufacture of laminate
EP0038632A3 (en) Process for producing carbonitride of metal
JPS56133458A (en) Production of metal layer
EP0470584A3 (en) Continuous production of metal clad laminates
EP0048945A3 (en) Production of metal clad laminates
EP0048491A3 (en) Production of electrical laminates
JPS56144151A (en) Continuous manufacture of laminated board
DE3162065D1 (en) Process for making ductile laminates
JPS5718247A (en) Manufacture of laminate
GB2068412B (en) Electrodeposition of metals
JPS5712644A (en) Manufacture of laminate
JPS56146754A (en) Manufacture of laminate
ZA814781B (en) Hypertempering of metals
JPS57188347A (en) Manufacture of metal plated laminated board
JPS57142362A (en) Manufacture of grooved decorative board
JPS5746802A (en) Manufacture of bending workpiece
JPS5724253A (en) Continuous manufacture of laminated board
JPS5732943A (en) Manufacture of laminate for plating
GB2073088B (en) Production of metal strip
JPS5699260A (en) Production of metal phthalocyanine
JPS5753598A (en) Production of metal soap
JPS56144959A (en) Manufacture of steel cord-rubber laminate

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee