DE29901853U1 - Sputteranlage - Google Patents

Sputteranlage

Info

Publication number
DE29901853U1
DE29901853U1 DE29901853U DE29901853U DE29901853U1 DE 29901853 U1 DE29901853 U1 DE 29901853U1 DE 29901853 U DE29901853 U DE 29901853U DE 29901853 U DE29901853 U DE 29901853U DE 29901853 U1 DE29901853 U1 DE 29901853U1
Authority
DE
Germany
Prior art keywords
sputtering system
sputtering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29901853U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WC Heraus GmbH and Co KG
Original Assignee
Leybold Materials GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Leybold Materials GmbH filed Critical Leybold Materials GmbH
Priority to DE29901853U priority Critical patent/DE29901853U1/de
Publication of DE29901853U1 publication Critical patent/DE29901853U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3476—Testing and control
    • H01J37/3482—Detecting or avoiding eroding through
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
DE29901853U 1999-02-03 1999-02-03 Sputteranlage Expired - Lifetime DE29901853U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29901853U DE29901853U1 (de) 1999-02-03 1999-02-03 Sputteranlage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29901853U DE29901853U1 (de) 1999-02-03 1999-02-03 Sputteranlage

Publications (1)

Publication Number Publication Date
DE29901853U1 true DE29901853U1 (de) 1999-07-01

Family

ID=8068870

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29901853U Expired - Lifetime DE29901853U1 (de) 1999-02-03 1999-02-03 Sputteranlage

Country Status (1)

Country Link
DE (1) DE29901853U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009054060A1 (de) * 2009-11-20 2011-05-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Beschichten eines Substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009054060A1 (de) * 2009-11-20 2011-05-26 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Beschichten eines Substrates
US20120241310A1 (en) * 2009-11-20 2012-09-27 Schoepka Ulrich Device and method for coating a substrate
DE102009054060B4 (de) * 2009-11-20 2014-10-16 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung und Verfahren zum Beschichten eines Substrates

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19990812

R150 Term of protection extended to 6 years

Effective date: 20020326

R157 Lapse of ip right after 6 years

Effective date: 20050901