DE29720342U1 - Desoldering device - Google Patents

Desoldering device

Info

Publication number
DE29720342U1
DE29720342U1 DE29720342U DE29720342U DE29720342U1 DE 29720342 U1 DE29720342 U1 DE 29720342U1 DE 29720342 U DE29720342 U DE 29720342U DE 29720342 U DE29720342 U DE 29720342U DE 29720342 U1 DE29720342 U1 DE 29720342U1
Authority
DE
Germany
Prior art keywords
desoldering device
desoldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29720342U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Technology Solutions GmbH
Original Assignee
Wincor Nixdorf International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wincor Nixdorf International GmbH filed Critical Wincor Nixdorf International GmbH
Priority to DE29720342U priority Critical patent/DE29720342U1/en
Publication of DE29720342U1 publication Critical patent/DE29720342U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0486—Replacement and removal of components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
DE29720342U 1997-11-17 1997-11-17 Desoldering device Expired - Lifetime DE29720342U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29720342U DE29720342U1 (en) 1997-11-17 1997-11-17 Desoldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29720342U DE29720342U1 (en) 1997-11-17 1997-11-17 Desoldering device

Publications (1)

Publication Number Publication Date
DE29720342U1 true DE29720342U1 (en) 1998-02-12

Family

ID=8048723

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29720342U Expired - Lifetime DE29720342U1 (en) 1997-11-17 1997-11-17 Desoldering device

Country Status (1)

Country Link
DE (1) DE29720342U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19903957B4 (en) * 1999-01-25 2008-05-21 Finetech Gmbh & Co.Kg Method and apparatus for removing solder
DE102007041960B3 (en) * 2007-09-03 2009-05-20 Siemens Ag Replacing a component e.g. optical component fastened on support e.g. electrical printed circuit board by replacement module using thermally meltable composite material, comprises heating the composite material in the area of the component

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19903957B4 (en) * 1999-01-25 2008-05-21 Finetech Gmbh & Co.Kg Method and apparatus for removing solder
DE102007041960B3 (en) * 2007-09-03 2009-05-20 Siemens Ag Replacing a component e.g. optical component fastened on support e.g. electrical printed circuit board by replacement module using thermally meltable composite material, comprises heating the composite material in the area of the component

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19980326

R150 Term of protection extended to 6 years

Effective date: 20010201

R081 Change of applicant/patentee

Owner name: FUJITSU SIEMENS COMPUTERS GMBH, DE

Free format text: FORMER OWNER: SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 33106 PADERBORN, DE

Effective date: 20010301

R151 Term of protection extended to 8 years

Effective date: 20040217

R152 Term of protection extended to 10 years

Effective date: 20060124

R071 Expiry of right