DE29718477U1 - Device for supporting printed circuit boards in a processing position - Google Patents

Device for supporting printed circuit boards in a processing position

Info

Publication number
DE29718477U1
DE29718477U1 DE29718477U DE29718477U DE29718477U1 DE 29718477 U1 DE29718477 U1 DE 29718477U1 DE 29718477 U DE29718477 U DE 29718477U DE 29718477 U DE29718477 U DE 29718477U DE 29718477 U1 DE29718477 U1 DE 29718477U1
Authority
DE
Germany
Prior art keywords
support
support elements
metal plate
circuit board
processing position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29718477U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE29718477U priority Critical patent/DE29718477U1/en
Publication of DE29718477U1 publication Critical patent/DE29718477U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0061—Tools for holding the circuit boards during processing; handling transport of printed circuit boards
    • H05K13/0069—Holders for printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0173—Template for holding a PCB having mounted components thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/104—Using magnetic force, e.g. to align particles or for a temporary connection during processing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Two-Way Televisions, Distribution Of Moving Picture Or The Like (AREA)

Description

GR 97 G 4452 DEGR 97 G 4452 EN

BeschreibungDescription

Vorrichtung zum Abstützen von Leiterplatten in einer Bearbeitungsposition
5Device for supporting printed circuit boards in a processing position
5

Die Erfindung betrifft eine Vorrichtung zum Abstützen von Leiterplatten in einer Bearbeitungsposition, insbesondere in einer Siebdruckmaschine oder SMD-Bestückmaschine.The invention relates to a device for supporting circuit boards in a processing position, in particular in a screen printing machine or SMD assembly machine.

Wenn Leiterplatten auf einer Seite von oben her bearbeitet werden sollen, ist es erforderlich, die Leiterplatte von unten her möglichst flächig abzustützen. Sind die Leiterplatten auf der von der aktuellen Bearbeitungsseite abgewandten Seite mit Bauelementen bestückt, so muß die Abstützung der Leiterplatte auf Flächenbereiche außerhalb der Bauelemente beschränkt werden. Es ist bekannt, hierzu das Bestückungsmuster der jeweils zu bearbeitenden Leiterplatte auf einer Lochplatte abzubilden, die in einem Flächenraster Aufnahmelöcher für Stützstifte enthält. Die Stützstifte werden von Hand in diejenigen Aufnahmelöcher eingesteckt, die nicht von Bauelementepositionen abgedeckt sind. Anschließend wird die Lochplatte mit den eingesteckten Stützstiften unterhalb der Bearbeitungsposition für die Leiterplatte angeordnet, so daß die Leiterplatte bei Überführung in die Bearbeitungsposition mit den unbestückten Bereichen ihrer Unterseite auf den Stützstiften aufliegt.If circuit boards are to be processed from above on one side, it is necessary to support the circuit board from below as flatly as possible. If the circuit boards are equipped with components on the side facing away from the current processing side, the support of the circuit board must be limited to areas outside the components. It is known to do this by mapping the assembly pattern of the circuit board to be processed on a perforated plate that contains holes for support pins in a surface grid. The support pins are inserted by hand into those holes that are not covered by component positions. The perforated plate with the inserted support pins is then positioned below the processing position for the circuit board, so that the circuit board rests on the support pins with the unpopulated areas of its underside when it is transferred to the processing position.

Nachteilig ist der vergleichsweise hohe Herstellungsaufwand für die Lochplatte und der damit verbundene hohe Preis sowie der hohe Aufwand zum Einsetzen der Stützstifte. Nachteilig ist außerdem, daß sich die erforderliche Größe der Lochplatte aus der größten zu bearbeitenden Leiterplatte ergibt. Schließlich ist der kleinstmögliche Abstand der Abstützpunkte durch das Lochraster begrenzt.The disadvantage is the relatively high manufacturing effort for the perforated plate and the associated high price as well as the high effort required to insert the support pins. Another disadvantage is that the required size of the perforated plate is determined by the largest circuit board to be processed. Finally, the smallest possible distance between the support points is limited by the hole pattern.

GR 91 G 4452 DEGR 91 G 4452 EN

Diese Nachteile werden durch die erfindungsgemäße Vorrichtung nach Anspruch 1 vermieden.These disadvantages are avoided by the device according to the invention as claimed in claim 1.

Vorteilhafte Weiterbildungen der erfindungsgemäßen Vorrichtung sind in den Unteransprüchen angegeben.Advantageous further developments of the device according to the invention are specified in the subclaims.

Die Zeichnung zeigt ein Ausführungsbeispiel der erfindungsgemäßen Vorrichtung, bestehend aus einer Metallplatte 1 und mehreren Stützelementen 2 bis 6, von denen hier nur wenige gezeigt sind. Die Metallplatte 1 weist an mindestens zwei möglichst weit auseinanderliegenden Stellen Zentrierlöcher oder sonstige Zentriermittel zum genauen Positionieren der Metallplatte 1 in einer hier nicht gezeigten Bearbeitungseinrichtung für Leiterplatten 8, z. B. Siebdruckmaschine, auf.The drawing shows an embodiment of the device according to the invention, consisting of a metal plate 1 and several support elements 2 to 6, of which only a few are shown here. The metal plate 1 has centering holes or other centering means at at least two points that are as far apart as possible for the precise positioning of the metal plate 1 in a processing device for circuit boards 8 (not shown here), e.g. a screen printing machine.

Die Stützelemente 2 bis 6 sind aus Gründen der einfacheren Herstellbarkeit im wesentlichen zylinderförmig ausgebildet und weisen eine Höhe auf, die dem lichten Abstand a zwischen der in der Bearbeitungseinrichtung positionierten Metallplatte 1 und der darüber in einer Bearbeitungsposition 9 befindlichen Leiterplatte 8 entspricht. Zum flächigen Abstützen der Leiterplatte 8 ist ein Teil der Stützelemente, hier z. B. das Stützelement 2, als Vollzylinder ausgebildet. Andere Stützelemente, wie die Stützelemente 3 bis 6, dienen zum punktuellen Abstützen der Leiterplatte 8 und weisen dementsprechend ein unteres Fußteil 10 mit größerem Durchmesser und ein oberes Abstützteil 11 mit geringerem Durchmesser auf. Bei einem Teil der Stützelemente, hier das Stützelement 3, ist das Abstützteil 11 konzentrisch, bei den anderen Stützelementen 4, 5 und 6 exzentrisch zu dem Fußteil 10 ausgebildet. Im letzteren Fall besteht der Vorteil darin, daß die Abstützteile 11 und damit die Abstützpunkte benachbarter Stützelemente, z. B. 4 und 5, näher zueinander positioniert werden können, als der durch die Dicke des Fußteils 10 be-The support elements 2 to 6 are essentially cylindrical in shape for reasons of ease of manufacture and have a height that corresponds to the clear distance a between the metal plate 1 positioned in the processing device and the circuit board 8 located above it in a processing position 9. To support the circuit board 8 over its surface, some of the support elements, here for example the support element 2, are designed as solid cylinders. Other support elements, such as the support elements 3 to 6, serve to support the circuit board 8 at specific points and accordingly have a lower base part 10 with a larger diameter and an upper support part 11 with a smaller diameter. In some of the support elements, here the support element 3, the support part 11 is concentric, in the other support elements 4, 5 and 6 it is eccentric to the base part 10. In the latter case, the advantage is that the support parts 11 and thus the support points of adjacent support elements, e.g. 4 and 5, can be positioned closer to each other than the distance defined by the thickness of the foot part 10.

GR 97 G 4452 DEGR 97 G 4452 EN

dingte kleinstmögliche Abstand der Zylinderachsen 12 der Stützelemente 4 und 5. Wie an dem Stützelement 6 zu sehen ist, sind die Stützelemente mit exzentrisch ausgebildetem Abstützteil 11 an ihrem Fußteil 10 mit einer die exzentrische Lage des Abstützteils 11 markierenden Griffmarke 13, hier z. B. in Form einer Nut, versehen.the smallest possible distance between the cylinder axes 12 of the support elements 4 and 5. As can be seen on the support element 6, the support elements with an eccentrically designed support part 11 are provided on their base part 10 with a grip mark 13 marking the eccentric position of the support part 11, here e.g. in the form of a groove.

Eine einfache Positionierbarkeit der Stützelemente 2 bis 6 auf der Metallplatte 1 wird dadurch ermöglicht, daß die Metallplatte 1 aus ferromagnetischem Material, vorzugsweise aus Stahl, besteht und daß die Stützelemente 2 bis 6 an ihren Unterseiten jeweils mit einem Magnet 14 versehen sind.A simple positioning of the support elements 2 to 6 on the metal plate 1 is made possible by the fact that the metal plate 1 consists of ferromagnetic material, preferably steel, and that the support elements 2 to 6 are each provided with a magnet 14 on their undersides.

Um die Stützelemente 2 bis 6 so auf der Metallplatte 1 positionieren zu können, daß sie die hier bestückte Leiterplatte 8 in der Bearbeitungsposition 9 außerhalb der Bereiche von Bauelementen 14 abstützen, sind auf der Metallplatte 1 Markierungen 15 angeordnet, wobei Markierungselemente 16 die Verwendung von Stützelementen mit exzentrischem Abstützteil (z. B. 4 bis 6) und deren Soll-Ausrichtung anzeigen. Diese Markierungen 15 können aufgrund des Bestückungsmusters der Leiterplatte 8 direkt auf die Platte 1 übertragen werden oder auf einer Folie abgebildet sein, die auf der Metallplatte 1 aufgelegt wird.In order to be able to position the support elements 2 to 6 on the metal plate 1 in such a way that they support the circuit board 8 assembled here in the processing position 9 outside the areas of the components 14, markings 15 are arranged on the metal plate 1, with marking elements 16 indicating the use of support elements with an eccentric support part (e.g. 4 to 6) and their desired orientation. These markings 15 can be transferred directly to the plate 1 based on the assembly pattern of the circuit board 8 or can be shown on a film that is placed on the metal plate 1.

Claims (8)

GR 97 G 4452 DE SchutzansprücheGR 97 G 4452 DE Protection claims 1. Vorrichtung zum Abstützen von Leiterplatten (8) in einer Bearbeitungsposition (9), insbesondere in einer Siebdruckmaschine oder SMD-Bestückmaschine, gekennzeichnet durch eine im Bereich der Bearbeitungsposition (9) unterhalb der Leiterplatte (8) und parallel zu dieser ausrichtbare ferromagnetische Metallplatte (1) und mehrere, an ihrer Unterseite mit Magneten (14) versehene und auf der Metallplatte (1) positionierbare Stut&zgr;elemente (2 bis 6), deren Höhe entsprechend dem lichten Abstand (a) zwischen der Leiterplatte (8) und der Metallplatte (1) bemessen ist.1. Device for supporting circuit boards (8) in a processing position (9), in particular in a screen printing machine or SMD assembly machine, characterized by a ferromagnetic metal plate (1) that can be aligned in the area of the processing position (9) below the circuit board (8) and parallel to it and several support elements (2 to 6) that are provided with magnets (14) on their underside and can be positioned on the metal plate (1), the height of which is dimensioned according to the clear distance (a) between the circuit board (8) and the metal plate (1). 2. Vorrichtung nach Anspruch 1, dadurch gekenn-2. Device according to claim 1, characterized in zeichnet, daß die Metallplatte (1) in Abhängigkeit von der jeweils zu bearbeitenden Leiterplatte (8) mit Markierungen (15) für die zu positionierenden Stützelemente (2 bis 6) versehen ist.characterized in that the metal plate (1) is provided with markings (15) for the support elements (2 to 6) to be positioned, depending on the circuit board (8) to be processed. 3. Vorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Stützelemente (2 bis 6) im wesentlichen zylinderförmig ausgebildet sind.3. Device according to claim 1 or 2, characterized in that the support elements (2 to 6) are essentially cylindrical. 4. Vorrichtung nach Anspruch 1, 2 oder 3, dadurch gekennzeichnet, daß zumindest ein Teil der Stützelemente (3 bis 6) aus einem unteren Fußteil (10) größeren Durchmessers und einem oberen Abstützteil (11) geringeren Durchmessers besteht.4. Device according to claim 1, 2 or 3, characterized in that at least some of the support elements (3 to 6) consist of a lower foot part (10) of larger diameter and an upper support part (11) of smaller diameter. 5. Vorrichtung nach Anspruch 4, dadurch gekennzeichnet, daß bei zumindest einem Teil der Stützelemente (3) das Abstützteil (11) konzentrisch zu dem Fußteil (10) ausgebildet ist.5. Device according to claim 4, characterized in that in at least some of the support elements (3) the support part (11) is designed concentrically to the foot part (10). GR 97 G 4452 DEGR 97 G 4452 EN 6. Vorrichtung nach Anspruch 4 oder 5, dadurch gekennzeichnet, daß bei zumindest einem Teil der Stützelemente (4 bis 6) das Abstützteil (11) exzentrisch zu dem Fußteil6. Device according to claim 4 or 5, characterized in that in at least some of the support elements (4 to 6) the support part (11) is eccentric to the foot part (10) ausgebildet ist.
5(10) is formed.
5 7. Vorrichtung nach Anspruch 6, dadurch gekennzeichnet, daß das Fußteil (10) des Stützelements (4 bis 6) mit einer die Lage des exzentrischen Abstützteils (11) markierenden Griffmarke (13) versehen ist.7. Device according to claim 6, characterized in that the foot part (10) of the support element (4 to 6) is provided with a grip mark (13) marking the position of the eccentric support part (11). 8. Vorrichtung nach Anspruch 7, dadurch gekennzeichnet, daß die Markierungen (15) zur Positionierung von Stützelementen (4 bis 6) mit exzentrischem Abstützteil8. Device according to claim 7, characterized in that the markings (15) for positioning support elements (4 to 6) with eccentric support part (11) Markierungselemente (16) zur Anzeige der Ausrichtung der Stützelemente (4 bis 6) aufweisen.(11) marking elements (16) to indicate the orientation of the support elements (4 to 6).
DE29718477U 1997-10-17 1997-10-17 Device for supporting printed circuit boards in a processing position Expired - Lifetime DE29718477U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29718477U DE29718477U1 (en) 1997-10-17 1997-10-17 Device for supporting printed circuit boards in a processing position

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29718477U DE29718477U1 (en) 1997-10-17 1997-10-17 Device for supporting printed circuit boards in a processing position

Publications (1)

Publication Number Publication Date
DE29718477U1 true DE29718477U1 (en) 1998-11-19

Family

ID=8047382

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29718477U Expired - Lifetime DE29718477U1 (en) 1997-10-17 1997-10-17 Device for supporting printed circuit boards in a processing position

Country Status (1)

Country Link
DE (1) DE29718477U1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003009664A1 (en) * 2001-07-19 2003-01-30 Koninklijke Philips Electronics N.V. Device for supporting flat products
CN108529235A (en) * 2018-04-17 2018-09-14 京东方科技集团股份有限公司 Handling device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067695A (en) 1989-05-08 1991-11-26 Micron Technology, Inc. Circuit board support apparatus for use with circuit board lead trimmer
WO1996026809A1 (en) 1995-02-27 1996-09-06 Mpm Corporation Method and apparatus for circuit board pin placement and support

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5067695A (en) 1989-05-08 1991-11-26 Micron Technology, Inc. Circuit board support apparatus for use with circuit board lead trimmer
WO1996026809A1 (en) 1995-02-27 1996-09-06 Mpm Corporation Method and apparatus for circuit board pin placement and support

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
3- 66200 A
5- 14000 A.,E-1373,May 31,1993,Vol.17,No.283
Auto-Adjusting Card Dampening Support System for High-Speed Placement. In: IBM Technical Disclosure Bulletin, Vol.39, No.10, Oct. 1996, S.111,112
JP Patents Abstracts of Japan: 2-190000 A.,E- 989,Oct. 11,1990,Vol.14,No.467

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003009664A1 (en) * 2001-07-19 2003-01-30 Koninklijke Philips Electronics N.V. Device for supporting flat products
CN108529235A (en) * 2018-04-17 2018-09-14 京东方科技集团股份有限公司 Handling device

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