DE29515035U1 - Cover cap for electronic components - Google Patents
Cover cap for electronic componentsInfo
- Publication number
- DE29515035U1 DE29515035U1 DE29515035U DE29515035U DE29515035U1 DE 29515035 U1 DE29515035 U1 DE 29515035U1 DE 29515035 U DE29515035 U DE 29515035U DE 29515035 U DE29515035 U DE 29515035U DE 29515035 U1 DE29515035 U1 DE 29515035U1
- Authority
- DE
- Germany
- Prior art keywords
- electronic components
- cover cap
- cap
- cover
- electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Ceramic Capacitors (AREA)
- Details Of Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29515035U DE29515035U1 (en) | 1995-09-20 | 1995-09-20 | Cover cap for electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE29515035U DE29515035U1 (en) | 1995-09-20 | 1995-09-20 | Cover cap for electronic components |
Publications (1)
Publication Number | Publication Date |
---|---|
DE29515035U1 true DE29515035U1 (en) | 1996-01-11 |
Family
ID=8013208
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE29515035U Expired - Lifetime DE29515035U1 (en) | 1995-09-20 | 1995-09-20 | Cover cap for electronic components |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE29515035U1 (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998019509A1 (en) * | 1996-10-30 | 1998-05-07 | Ericsson Inc. | Gasketed shield can for shielding emissions of electromagnetic energy |
EP0888040A2 (en) * | 1997-06-25 | 1998-12-30 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
US7005573B2 (en) | 2003-02-13 | 2006-02-28 | Parker-Hannifin Corporation | Composite EMI shield |
WO2006125947A2 (en) * | 2005-05-27 | 2006-11-30 | Arka Technologies Limited | Improved printed circuit board assembly |
US7326862B2 (en) | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
EP0919114B1 (en) * | 1996-08-18 | 2011-01-19 | Helmut Kahl | Process for shielding an electric or electronic circuit and shielding cap |
-
1995
- 1995-09-20 DE DE29515035U patent/DE29515035U1/en not_active Expired - Lifetime
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0919114B1 (en) * | 1996-08-18 | 2011-01-19 | Helmut Kahl | Process for shielding an electric or electronic circuit and shielding cap |
WO1998019509A1 (en) * | 1996-10-30 | 1998-05-07 | Ericsson Inc. | Gasketed shield can for shielding emissions of electromagnetic energy |
EP0888040A2 (en) * | 1997-06-25 | 1998-12-30 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
EP0888040A3 (en) * | 1997-06-25 | 1999-08-11 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
US6218610B1 (en) | 1997-06-25 | 2001-04-17 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
US7005573B2 (en) | 2003-02-13 | 2006-02-28 | Parker-Hannifin Corporation | Composite EMI shield |
US7326862B2 (en) | 2003-02-13 | 2008-02-05 | Parker-Hannifin Corporation | Combination metal and plastic EMI shield |
WO2006125947A2 (en) * | 2005-05-27 | 2006-11-30 | Arka Technologies Limited | Improved printed circuit board assembly |
WO2006125947A3 (en) * | 2005-05-27 | 2007-03-22 | Arka Technologies Ltd | Improved printed circuit board assembly |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 19960222 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 19981211 |
|
R157 | Lapse of ip right after 6 years |
Effective date: 20020501 |