DE2852584A1 - Fast response air temp. sensor - has wire cage protecting semiconductor chip mounted on thin fin, and interconnected wires connecting sensor with connector - Google Patents

Abstract

The air temp. sensor consists of a silicon temp. sensing semiconductor chip mounted on an extremely thin fin having a high surface area to mass ratio. The fin and chip combination are mounted in a frame assembly, with the thermal conductivity of the frame assembly being high and the specific heat being low for max. heat transfer from the fluid being sensed to the silicon chip. The chip and fin assembly are open to the free flow of fluid around the assembly, no insulating material being provided between the fluid media being sensed and the fin and chip assembly. A protective cage is formed around the fin and chip assembly. Suitable connection is made between one electrical terminal of the chip and the fin and between the other electrical terminal of the chip and the external circuitry.

Description

The invention relates to a thermometer, in particular a half

Conductor thermometer for fluids with a semiconductor probe from a circuit plate, which is shaped essentially as a parallelepiped block is. The sensor can be, for example, a silicon semiconductor wafer coated with various foreign atoms to control the resistance of the platelet as a function of temperature changes is endowed.

An important problem with such fluid thermometers is to respond to temperature fluctuations as quickly as possible achieve, and the task of the invention is to provide an improved thermometer for fluids with extremely fast dynamic and static performance to accomplish.

According to the invention is a thermometer for measuring the temperature of a fluid is provided which has a first and second outlet line, a A semiconductor probe having first and second contact surfaces comprising are each electrically connected to the first and second output line, wherein the resistance of the semiconductor probe as a function of its temperature changes, characterized in that the thermometer has a base plate or a Base made of a non-conductive material comprises that at least one cooling fin or fin made of conductive material is attached to the base plate, that the fin has a high surface-to-mass ratio, then in that the semiconductor probe is mounted on the cooling fin so that a its first and second contact surfaces are electrically connected to the cooling fin are further characterized in that the first and second output lines are at least partially are embedded in the base plate or in the base and their respective ends electrically to the cooling fin and to the second contact surface of the semiconductor sensor are connected.

The invention is explained in more detail below. All in the description Features and measures contained therein can be essential to the invention. In the drawings: Figure 1 is a general view of a preferred embodiment the fast response fluid thermometer of the invention; Fig. 2 a plan view of the fluid thermometer of Fig. 1 showing the arrangement of the semiconductor sensor and the wiring, although the two output lines, the semiconductor probe and cooling fin or fin; F sharp. 3 shows a cross section of the fluid thermometer of Fiq. 2 along line 3-3 of Ficr. 2; Fiq. 4 shows a cross section of the wiring between an output line and the semiconductor probe Fig. 2 along the line 4-4; Fig. 5 is a plan view of another embodiment of the fast-responding fluid thermometer of Fig. = Fig. 6 is a partial cross-section through the thermometer of FIG. 5 along the line 6-6 of Ficr. 5 showing a modified arrangement of the semiconductor sensor and the Beschaltuna with the assigned exit line; Fig. 7 shows a cross section like that of FIG. 4 showing the wiring between the output line and the cooling fin along the line 7-7 of FIG. 5; Fig. 8 is a plan view of another modified embodiment of the rapidly responding thermometer according to the invention, partly in detail; 9 shows a cross section through the thermometer Fig. 8 along the line 9-9 of Fig. 8; Fig. 1o a further cross section through the thermometer of Figure 8 taken along line 10-10; 11 shows a cross section with Representation of another fluid thermometer according to the invention, partially in section to show a dette circuit between two cooling fins and the supports; 12 shows a cross section through a further modification of the fluid thermometer according to the invention showing another type of wiring between the output lines, the cooling fin and the semiconductor probe; 13 shows a cross section through a Another modified embodiment of the invention with a representation of a veining the wiring between the output lines, the cooling fin and the semiconductor sensor.

Fig. 14 shows a detail of the electrical connection between the semiconductor probe and one of the exit conduits along line 14-14 of FIG. 13; Fig. 15 a Representation of a further modification of a device for the connections between Output line and the semiconductor probe; 16 is a perspective view a modified embodiment of the semiconductor probe, its output terminals are arranged on a single surface; Fig. 17 is a plan view, partly in Detail of an assembly process for the semiconductor measuring probe of Fig.

16 on a cooling pipe showing the connections between the Semiconductor sensor, the cooling rips and the output line; Figures 18 and 23 show modified embodiments of the invention in which the temperature sensor is applied by thick or thin film processes; 19 is a perspective view View of another embodiment of a fast responding according to the invention Fluid thermometers; Figure 20 is a cross section through the fluid thermometer 19 along the line 20-20 of FIG. 19 showing the wiring between the output leads, the semiconductor probe and the dome-shaped cooling fin; FIG. 21 is a cross section of another embodiment of the thermometer of FIG. 19 with illustration a modified way in which the lines are passed through a plastic molded part; 22 shows a cross section through a Another embodiment of the thermometer of FIG. 19 showing another Wiring procedure for the external services with the semiconductor sensor and the Dome-shaped cooling fin.

Fig. 1 shows a thermometer 20 with three parts, namely a connector 22, a sensor 24 and two connecting lines 26 between the sensor 24 and the connector 22. The connector 22 comprises a housing 28 in which Contact pins and contact sockets are formed which have a plug connection with corresponding To produce contact sockets and pins in the wiring of a truck. A corresponding lock 30 is provided to the housing 28 with the corresponding Lock component of the wiring so that the two parts are not accidentally can be separated.

The thermometer comprises a fitting 34 made of brass or an equivalent Metal that is used for assembly, e.g. in an opening in the intake duct of a motor vehicle Can be screwed in and through a hexagon head nut 36, as in Kraftfahrzeuatechnik usual, can be secured. The thermometer 24 also includes a plastic molding 38 or a base plate that is fixed in the brass fitting 34 arranged and a cooling fin 40 made of conductive material carries at one of its ends, and this cooling rib 40 holds rigidly with respect to the brass fitting 34, as follows is explained in more detail. Lines 26 are in the interior of the plastic base plate 38 cast and led out through the middle of two mounting arms 42,44, which extend parallel to the body of the base plate.

The substantially plate-shaped cooling fin 40 is on each arm 42,44 attached so that they are embedded in these arms after fusing the ends is. The entire unit including the arms 42, 44 and the cooling fin 40 is made protected by a wire cage 46, the two generally U-shaped or dome-shaped Comprises wires which are offset from one another by 90 ° and at their apex are welded together, with their opposite ends in openings the brass fitting 34 are introduced and soldered there. Thus, the temperature measuring Cooling fin 40 and a semiconductor sensor, which is attached to it and will be described in more detail below protected against impact by foreign bodies.

2 shows a plan view of the thermometer 24 of FIG. 1 with illustration a specific design for mounting the semiconductor probe on the cooling fin 40 as well as the connections of the output lines 26 to the cooling fin 40 and on the semiconductor probe. The cooling fin or fin 40 described above is a disk-shaped plate with a semiconductor die 40, the resistance of which changes depending on the temperature and is mounted on this plate is. The plate 48 has two parallel surfaces, one of which is electrical Contact with the plate, while the other surface is electrical is connected to one of the output lines by means, which are described in more detail below explained. There is also a non-conductive ceramic plate on the cooling fin 40 50 by any suitable method, e.g.

attached by gluing. As from Fiq. 2 is the token 50 arranged at a small distance from the mounting arm 44 to allow a line 52, which is part of one of the lines 26 running in the mounting arm 44, by an in of the rib 40 formed opening can be led out and embedded in the arm can. The conduit 52 is then overlapped over the surface of the cooling fin 40 guided and attached to the non-conductive plate 50, as shown in more detail with reference to FIG is described. A line 53 designed as a gold wire connects the line 52 with the other face of the semiconductor die. Likewise, one will be in the middle of the mounting arm 42 potted line 54 through a second formed in the rib 40 Opening led out and overlapping in engagement with the surface of the rib 40 brought. The Leituna 54 is then appropriately made by soldering or conductive adhesives attached to the rib 40.

Fig. 3 shows various features of the unit that are shown in Figs. 1 and 2 are not shown in detail. For example, the leads 26 are in the base or the base plate 38 and encompass extensions 52,54, which are in the corresponding mounting arms 44,42 are encapsulated and via corresponding connectors 60,58 are connected to the lines 26. Fig. 3 shows that lines 52,54 are potted in the mounting arms 44,42 and include end portions that extend over the surfaces the mounting arms are guided and the described with reference to FIG Form connections. The material forming the assembly arms 42,44 is a thermoplastic, wherein the upper ends of the arms 42,44 are heated and melted to a good Form attachment to the rib 40, preferably perpendicular to the direction of the mounting arms. From the left side of the drawing it can be seen that the bottom of the brass base 24 is deeply drawn at point 62 to the cast base plate 38 in the brass fitting 34 hold tight.

In FIG. 4, the heated portion is the upper end of the mounting arm 44 shown melted to secure the attachment between arm 44 and rib 40 to bikbn.

The line 52 is formed in FIG. 4 by one formed in the rib 40 Opening 64 guided and embedded in the arms. The end of the line 52 is bent over or cranked, forming a loop and a flat portion 66. this part 66 is then correspondingly attached to the non-conductive plate 50 by any desired method attached, e.g. by an electrically conductive adhesive that creates a mechanical connection and forms an electrical contact between the flat part 66 and the plate 50.

According to the invention it was found that the dynamic behavior of a semiconductor thermometer can be maximized when the mass of the semiconductor die used as a sensor is kept as small as possible and glued to a metallic rib or fin whose area is compared to the mass of the rib plus the semiconductor die great is. Therefore, the connection is made from one terminal of the semiconductor chip through a electrically conductive bonding of the plate to the metallic lip. The electric Connection between the rib and an output line is made by an on the Edge of the rib by various methods attached line, which are based on Fig. 12-17 are described as an exemplary embodiment.

The metallic rib must be arranged so that the flow of the to measuring fluid parallel to the fin or fin with maximum heat exchange st the fin runs. The temperature change of a thin metal fin of more uniform Thickness immersed in a fluid is primarily a function of the Ratio of surface to mass of the fin. So when approaching a theoretical Plant the response time constant of the temperature for a given material and regardless of the size of the fin the zero point when the thickness of the fin approaches zero.

In practice, the specific weight and the specific also influence Heat the time constant, and both parameters maximize the response time if-they are kept as small as possible. In addition, when the silicon wafer 48 is applied to the fin or fin 40, the heat exchange between the fin 40 and the silicon wafer 48 are important. The thermal contact material between fin 40 and plate 48 must lead high, z. B. made of gold. aside from that the heat flow from the surfaces surrounding the fin or rib must be opposite to the by the die 48 covered area can be maximized. Therefore, the thermal conductivity of the fin is important, and every material with it high thermal conductivity (like aluminum is appropriate.

As described above, the fin is circular thin metal disk 40 with a concentrically mounted semiconductor wafer. After a In an advantageous embodiment, the rib should be tapered or conical Have cross-section, the thickest part of which is the area on which the semiconductor die is mounted, wherein the rib tapers on the circumference to the thickness zero.

The unit carrying the rib must be designed in such a way that the heat flow to or from the wearer is as small as possible, since it is not necessarily from the The temperature of the fluid to be measured arises and therefore the dynamic behavior and affect the static temperature of the die.

In other terms, this means that there is a difference in the Temperature between the platelet and the fluid causes an error in the output signal which is kept as small as possible for any given instantaneous period must become.

As a possible source of error in this signal from the heat flow to the or arises from the rib support, this is arranged at a point that is so far as removed from the die as possible, and in the preferred embodiment is the plate 48 arranged concentrically to the disc, and the Carrier built on the outer edge of the pane. Thus prevents the need a mechanical fastening that the outer edge of the rib or fin forms Washer has a thickness tending towards zero when the rib surface is of sufficient size, the radial heat flow from the inside to the outside or from the outside inward on the plate is essentially zero and thus the heat flow The reason of the mechanical support of the rib is kept as small as possible.

In choosing a suitable material for the rib is as follows Relationship of importance for the study of the various properties of a person Material for its suitability for use according to the invention. For the theoretical The following relationship applies to maximum power: K t (Sp.Hp.) where K = thermal conductivity, % = specific weight, Sp.Hp. = specific heat is.

The most suitable material is a material whose properties maximize the term Mt. In practice, other properties such as costs, Processing ability, environmental impact and availability the Factors influencing the choice of material for the rib.

In Fig. 5 is another embodiment of the invention Fluid thermometers shown are essentially the same as above The basic building blocks described include, like the brass fitting 34, the hexagonal head 36 and the same protective wire cage 46. The modified one shown in FIG Embodiment comprises a plastic element arranged in brass fitting 34 70, in which the lines 26, the plug connectors 58, 60 and two lines 73, 74 are shed. The line 74 is supported by a mounting arm 76 (identical to the Arm 42 of Fig. 3) raised in one piece as part of the plastic element 70 and for attachment to a rib formed from a disk 78 or fin is bent, as explained in more detail with reference to FIG. 7.

6 shows that a cup-shaped part 80 is formed in the fin 78 in which a semiconductor die 82 is arranged. The semiconductor die 82 is by any suitable method such as that described with reference to FIG and the method described below with reference to FIGS. 12-15 electrically to the Line 72 connected. The cup-shaped portion 80 of the rib 78 presents the platelet 82 Protection and increases the uniform heating of the plate 82 by the rib 78.

According to Fig. 7, an opening 86 is formed in the part of the rib 78, the is embedded in the arm 76. Part of the line 74 is passed through the opening. The arm 76 is heated and melted to form a head which the rib 78 attached to the mounting arm 76. The lead 74 is bent over to be in close contact to come with the rib 78 and is attached to this. e.g.

by soldering or gluing.

Fig. 8 shows a further embodiment of the thermometer according to the invention. It has a brass fitting 86 which is similar to the brass fitting described above 34 can be executed. A plastic carrier is located in the hole formed in the fitting 86 88 stored from pressed material. the one base plate 9o and a number of pairs of arms 92, each with an outer arm 94 and an inner arm 96, which extend from the base plate extend out axially and parallel. The carrier arm pairs 94, 96 of FIG. 8 are rigid a generally square rib 98 with four pairs of arms 92,100,102,104 provided are.

According to FIGS. 9, 10 is between the inner and outer arms of each Pairs of arms 92,102 encapsulated a generally U-shaped conductive component 1o6, which consists of a transverse part 108 and two arms 110,112. From Fig. 9 it can be seen that that the arms 11o, 112 from the transverse part 108 to their outer ends in general rejuvenate. It should be noted that the U-shaped part 1o6 is only between the pairs of support arms 92,102 provided. Before attaching a square rib 98, an opening is made 114 drilled in the unit to remove the arm or conductive part 112 from the conductive part 11o to separate, whereby conductive sheets or foils are produced, the opposite the axis of the base plate 9o and the arms 92,102 arranged radially mouth, wherein the Sheets or foils are supported by the arms 92,1o2.

In the pressed base 9o two lines 120,122 are embedded which electrically to the conductive parts 110, 112 by suitable means, e.g. by soldering, are connected. After the assembly of the rib 98, the ends 124, 126 are heated and bent over to rigidly secure the rib 98 between the arms 94,96 of the pair of arms 102 to form (Fig. 9) as well as between the pairs of arms 100 and the Pairs of arms 104 (Fig. 8). As shown in FIGS. 8, 9, the square rib 98 a centrally arranged semiconductor wafer 130 on the bottom, with a corresponding Line 132 connects die 130 to conductive component 112.

The connection of the semiconductor die 103 can be by any suitable Means done. Of course, a suitable insulating material must be used between the line 132 and the rib 98 may be provided so that the conduit 132 is opposite the rib 98 being isolated. The rib 98 overlaps the top of the conductive member silo. Thus, the electrical circuit shown in Fig. 9 runs from the line 120 via the conductive member 11o, the rib 98, the semiconductor die 130, the Line 132, the conductive member 112 to line 122.

Fig. 10 shows a method of connecting the rib 98 to the conductive Component 11o, this being at right angles at its end bent over to make electrical contact with the rib 98. As described above the upper end of the arm 94 is heated and bent over at the end 136 to form a Establish a firm connection between the conductive member 11o and the plate 98.

Fig. 11 shows another embodiment of the quick response fluid thermometer according to the invention. According to the teaching of the invention it seems it that the heat transfer from the fin to the platelet is maximized and the apparent Mass of the aggregate can be kept as small as possible if both sides of each plate are in contact with their own rib or fin. Thus each rib becomes an electrical connection for the wafer as well as for the heat transfer to and from the fin, making the semiconductor die one attained highest efficiency. It is obvious that the ribs are wide enough must stand apart in order to disturb the flow of the fluid to be measured between deWAippen to avoid the heat exchange between thepippen and the Fluid could decrease.

In this modified version, two ribs 140, 142 are provided, which are generally in the form of a disk or plate, the The center of each disc faces the center of the other disc. A semiconductor wafer is located between the two mutually facing ribs 140, 142 144 arranged, the same as those described with reference to the preceding figures Semiconductor wafers is made. As in the previous cases, the ribs 140, 142 are corresponding attached to a thermoplastic component 146, which with two axially extending Arms 148,150 is equipped, in which two lines 152,154 are cast. Figure 11 shows lead 152 bent over and soldered to the face of the rib ISt (which is not in contact with the semiconductor die while the conduction 154 emerges from the support arm 150 shortly before its end and is guided to the rib 140 is, where it is soldered on this. The upper ends of the arms 148,150 are heated and bent to form a rigid attachment for rib 142. Even though only two arms 148,150 are shown, it should be noted that the molded part 146 with each two pairs of arms of identical shape can be equipped, with one pair of arms no electrical cables are encased. The embodiment of FIG. 11 Figure 11 shows a simple method of electrically connecting the ribs 140, 142 to the Semiconductor die 144. This embodiment does not need the sensitive one either Attachment of a lead to the semiconductor die like the previous embodiments.

In a modified form of the last exemplary embodiment, Ribs with an approximately conical or dome shape can be provided, their apex is electrically led to the opposite sides of the semiconductor die.

In the embodiments in which two ribs on a carrier are attached, see Fig. 11, can be a very rigid more mechanical Achieve build-up.

Figures 12-15 show various other methods of attachment of lines on the semiconductor wafer, in particular FIG. 12 shows the attachment a fine gold wire 160 of a lead 162 encapsulated in the base 164, wherein the wire is attached at its other end to a die 166. The platelet 166 is attached to a rib 168 as described above. The electrical connection between the rib 168 and a second one in the base 164 and the line 170 embedded in one of the arms is carried out by bending the End of conduit 170 and a face-to-face arrangement on rib 168.

In FIG. 13, a similar embodiment as in FIG. 12 is shown in relation on the assembly of the rib 168 and its connection to the line 170 is described. However (in lieu of lead 162 of Figure 12) there is one in the other arm of the socket 164 potted line 172 is provided, which is bent at its end in order for the electrical connection to another line to form an open area. In turn the plate 166 is provided, but in this case it is connected to the line 172 connected via a terminal 176. The clamp 176 is insulated against the rib 168 178 sandwiched between the rib 168 and the clip 176. the Terminal 176 terminates near one edge of die 166, and is an electrically conductive one Bridging between lead 176 and the die is in the form of a lead strip 180 provided (Fig. 14).

Figure 15 shows a fairly simple connection between a wafer 182 and a conduit 184 which is substantially parallel to the rib. One A corresponding layer of insulating material 186 is provided on which the line 184 is attached. Line 184 may be line 172 of FIG. 13. The insulating material 186 can be expanded to the level of the lower surface of the plate 182, wherein the line 184 would simply be laid over the insulating material 186, and that Plate 182 arranged on a straight line instead of the loop shown in FIG were.

16, 17 show another embodiment of the semiconductor wafer, in which both output terminals are arranged on one surface. E.g. can a Plate 188 have two terminal projections 19o, 192, which serve as terminals for connection serve the disc and the external line assigned to the plate. Fig. 17 shows this particular connector, with the rib 194 covered with a strip of insulating material 196 and a line strip 198 is equipped.

The plate 188 is then arranged as shown in the drawing, the protrusion 192 being in electrical contact with the conductive strip 198. The conductor strip can then be connected to the support arms for the wafer, shown in FIGS. 3, 9 or 11.

Figure 18 shows the invention using thick film techniques.

Note, although thick film processes are described, the thin film process can be applied just as well. In Fig. 18, the rib 40 forms the support, applied to the different layers by screen printing will. In performing this procedure, an insulating strip 200 is applied to the rib 40 applied, wherein an opening 202 is formed in the strip 200 thereby, that either the area of the opening 202 is covered by an emulsion or that the Area of the opening from the strip 200 is etched.

A semiconductor part 204 is then incorporated into the opening 202, which is in contact with the rib 40. Finally, a conductive strip 206 is put on the portion 204 and applied to the strip 200 to correspond to a conductive strip the strip 198 of FIG. 17 or the line 53 of FIG. In the thin film version the different fonts are sprayed or vaporized, with a corresponding Masking or etching is used to form the required shapes.

A preferred embodiment of the thermometer described above comprises a brass disc with a thickness of about 0.1 mm and a diameter of approx. 11 mm, whereby the response time of the thermometer is approx. 1 sec. for 100 ° temperature change is. The above dimensions ensure a bridge that is sufficiently stiff to while maintaining a large surface area to mass ratio, around the fast target response time to achieve.

The previous embodiments of the invention are designed so that the rib on which the semiconductor die is mounted on both sides exposed to the fluid to be measured.

However, this allows fluid to flow around the entire unit it that under certain circumstances dirt and others Foreign matter Can damage the plate or the cable attached to the plate. The ones in the Fig. 19-23 shown embodiments of the invention represent changes from the The thermometer described above, wherein the rib consists of a dome-shaped Element consists which is sealingly mounted on a base and the semiconductor measuring element and all leads to the platelet on the dome-shaped rib fully through the Dome-shaped rib and the plastic base are encapsulated. That way are the connections and the semiconductor measuring element fully protect against dirt and mechanical damage protected by FreSitoffe, which both on the lines and on the semiconductor probe can impact.

In Fig. 19 is an extremely fast responding fluid thermometer 208 shown with a very stable temperature response, which has a base 210, a measuring head 212, a protective cage 214 for the measuring head 212 and two external lines 216, those for connecting the dome and the semiconductor wafer with external circuit boards to serve. The base has a threaded part 218 which, for example, goes into the intake manifold an internal combustion engine or other device is screwed through which fluid is flowing, the temperature of which is to be measured. As usual in such devices, the base 210 comprises a hex nut 220 which is used for Tightening the thermometer is used. The measuring head 212 comprises a dome-shaped one Rib 224, which (Fig. 20) on the one hand for supplying and dissipating the heat to and serves from the semiconductor plate, while on the other hand this and the associated cables protects against dirt and other foreign matter. The dome 224, which is extremely thin to reduce the mass: surface ratio protected by the cage 214, which comprises two U-shaped wires 226,228 which are against each other Offset by 90 °, introduced into openings formed in the base 210 and there accordingly are attached. In addition, the spherical cap 224 and the base are connected to one another in a sealing manner, whereby the fluid to be measured only flows over the outer surface of the rib can.

Fig. 20 shows a cross-section of the thermometer of Fig. 19 with illustration the inner part of the measuring head 212; the outer line 216 with two Leitngen 230,232 is cast in a plastic or pressed part 234, which is rigidly in the base 210 is arranged with a tongue 236 crimped over the bottom of the press member 234 is to fix this part in the cavity formed by the base 210.

In the embodiment shown in FIG. 20, the line is 230 bent by 90 ° at point 238 so that it mechanically forms the inner surface of the spherical cap 224 touches to produce an electrical connection between it and the dome 224. On the other hand, the line 232 is in the interior space formed by the spherical cap 224 passed directly through the pressing member 234 to a position which is above the surface of the pressing part 234 lies. Between the top of lead 232 and a die 240 is made with the help of a fine gold wire 242, the diameter of which is about 0.05 mm a connection is established.

From Fig. 20 it can be seen that the plate 240, the gold wire 242 and the inner part of the spherical cap 224 are protected against dirt and foreign matter, which can flow past the dome 224. The inside of the dome 224 can Foam around the die 240 and the gold wire 242 to be further protected mechanically.

In Fig. 21 a modified embodiment of the connections is shown, after which the lines 230,233 embedded in a modified plastic molding 246 are. The pressing part 246 is modified in that parts are recessed on surfaces 248,250 are to provide access to the top of lines 230,232 that are now outside of the interior formed by the spherical cap 252 are arranged.

A gold wire appropriately attached to the calotte 252 ensures the connection between the line 230 and the cap 252.

As in the case of Fig. 20, a semiconductor die 258 is inside the dome is mounted at its vertex point and the line 232 is via a second Gold wire 260 connected. The attachment of the die 258 to the Calotte 252 can be made by any suitable method, e.g. by soldering with gold wire, take place, the dome 252 is in a press fit on the upper end of the plastic molded part 246 applied and fastened there.

Fig. 22 shows a further modified embodiment of the connections, the dome 252 again with a semiconductor wafer 258 is equipped and applied in a press fit on a plastic molded part 264- and accordingly is attached. The pressing part 264 comprises a projection projecting axially into the space, which is formed between the spherical cap 252 and the plastic molded part 264. the Line 230 is equipped at its upper end with a flexible contact spring 266, which is in sliding contact with the spherical cap 252 and thereby the electrical connection with the dome.

On the other hand, the line 232 is flexible with a slightly longer one Contact spring 268 is provided, which protrudes through the projection and with the semiconductor die 258 is in sliding contact.

Fig. 23 shows the invention applied by the thick film process, and it should be noted that thin film techniques work just as well.

In Fig. 23, the rib 252 represents the carrier on which through Screen printing different layers can be applied. When carrying out the procedure an insulating strip 270 is deposited on the dome 252, in which insulating strip 270 an opening 272 is formed by the area of the opening 272 either is covered with an emulsion, or that the area of the opening from the strip is etched out. Then, a semiconductor in contact with the dome 252 becomes 274 introduced into the opening 272. Finally, a conductive strip 276 is put on the semiconductor 274 and the strip 270 are deposited with the line 276 within its boundaries remains around a line strip corresponding to line 242 or 260 - In the thin film version, the different layers are sprayed on or vaporized, taking the required shaping by masking or etching is achieved.

In the exemplary embodiments described above, it was found that the ratio of the smallest surface area to the mass of the rib or dome is approximately 4 m² / kg must be.

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Claims (18)

Thermometer Patent claims Thermometers for measuring temperature a fluid having first and second output conduits, a semiconductor probe having a first and second contact surface electrically connected to the first and second Output line are connected, the resistance of the semiconductor probe changes depending on its temperature, characterized in that there is a Base (38) made of non-conductive material and at least one rib (40) made of conductive material Material attached to the base (38) further in that the rib (40) a high surface: mass ratio that the semiconductor probe (48) is mounted on the rib (14) so that either the first or second contact surface the semiconductor probe (48) is electrically connected to the rib (40), further in that the first and second output lines (26) at least partially in the Sockets (38) are embedded and that their respective ends (52,54) are electrical with the rib (40) and with the second contact surface of the semiconductor probe (48) are connected. 2. Thermometer according to claim 1, characterized in that it is at least two support arms, namely a first arm (42) and a second arm (44), which extend parallel to one another from the base (38), further in that the rib (40) is attached to the base (38) substantially at the end of the arms (42, 44) is. 3. Thermometer according to claim 2, characterized in that the rib (40) is embedded in each of the arms (42,44) after the end is fused. 4. Thermometer according to claim 2 or 3, characterized in that the rib (14) is a plate, the plane of which is substantially perpendicular to the arms (42,44), further in that the semiconductor sensor (48) has two contact surfaces forming parallel faces that one of the faces is fixed on the plate (40) is and in that the first output line (26) has a part (52) which protrudes through an opening (64) of the plate (40) in order to communicate with the other surface establish electrical contact. 5. Thermometer according to claim 4, characterized in that the opening (64) of the rib (40) is embedded in one end of the arms (42,44), further thereby, that the first output line (26) has a part (52) embedded in an arm (44) which protrudes through the opening (64) and in that a clamping part (66) protrudes from the arm (44) and makes electrical contact with the other of the parallel Manufactures surfaces. 6. Thermometer according to claim 5, characterized in that the clamp has a loop and a flat part (66), the electrical with the other surface - Establishes contact. 7. Thermometer according to claim 2, characterized in that each axially extending arm (92,102) a radially arranged conductive sheet (110,112) supports, which also extends to the end of the arms (92,1o2), further by, that the metal sheets (110,112) are correspondingly connected to the first and second output lines (120,122) are connected and in that the sheet metal associated with the first line (120) (110) has an edge which overlaps part of the surface of the rib (98), to make electrical contact with it. 8. Thermometer according to claim 2, characterized in that the semiconductor sensor (144) has two parallel contact surfaces, then in that two ribs (140, 142) are provided, which are formed by mutually facing plates substantially further in that these plates (140,142) are supported by two arms (148,150) that the semiconductor probe (144) is arranged between the plates (140,142) is, further in that the contact surfaces are in electrical contact with that of the first output line (152) associated rib (142), and finally thereby, that the other contact surface is in electrical contact with the other rib (140) stands, which in turn is connected to the second output line (154). 9. Thermometer according to claim 2, characterized in that the rib (168) is essentially formed from a flat plate (168) that a part the first output line (170) is embedded in one of the arms (164) and the Flat portion of a clamp (176) is in contact with one side of the plate (168), further in that one of the contact surfaces of the semiconductor probe (166) is in contact with this side stands, further by the fact that part of the second output line (172) is embedded in the other arm (164) and a clamp (176) is parallel to the plate (168) and in that an insulating device (178) between the plate side (168) and the clamp (176) of the second output line (172) and finally in that the terminal (176) is electrically connected to the other contact surface of the semiconductor probe (166) is connected. 10. Thermometer according to claim 9, characterized in that the clamp (176) of the second output line (172) near an edge of the semiconductor probe (166) ends, then in that an electrically conductive bridge (180) between the end of the clip (176) and the other contact surface. 11. Thermometer according to claim 1, characterized in that the rib (194) is a plate that the semiconductor probe (188) has an area of which protrudes a first (190) and a second clamp (192), the ends of which respectively form the first and second contact surfaces, further in that one of the Clamps (192) is in electrical contact with the RipPe (194) that the other terminal (190) is connected to an electrical line (198), which in turn is connected to the second Output line is guided and in that an insulation (196) between this Surface and the other terminal (190) and the line (198) is arranged. 12. Thermometer according to claim 1, characterized in that the rib (224) is dome-shaped and in sealing engagement with the base (210) stands, with the fluid to be measured only over the outer surface of the dome (224) can flow, further in that the semiconductor probe (240) with a Surface is mounted on the inner surface of the dome (224) and ultimately thereby, that a second surface is electrically connected to the second output line (232) is. 13. Thermometer according to claim 12, characterized in that the the first (230) and the second line (232) are at least partially encapsulated in the base (210) are. 14. Thermometer according to claim 12 or 13, characterized in that that in the by the dome (224) and the base (210) gebil Deten interior foam is arranged. 15. Thermometer according to one of claims 12-14, characterized in that that the first (230) and second output line (232) through a contact spring (266,268) are completed, the elastic with the dome (252) and the Semiconductor sensors (253) are engaged. 16. Thermometer according to one of claims 1-14, characterized in that that the semiconductor sensor (274) is applied in the thick film process to the dome (252) applied plate is. 17. Thermometer according to one of claims 10-14, characterized in that that the semiconductor sensor (274) is applied in the thin film process to the dome (252) applied plate is. 18. Thermometer according to one of the preceding claims, characterized in that that the ratio of surface to mass 2 of the dome (252) has a minimum value of about 4 m / kg.