DE2836924A1 - Automatic positioning device for electronic components - initiates ultrasound welding of wires between component and support in bonding machine - Google Patents

Automatic positioning device for electronic components - initiates ultrasound welding of wires between component and support in bonding machine

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Publication number
DE2836924A1
DE2836924A1 DE19782836924 DE2836924A DE2836924A1 DE 2836924 A1 DE2836924 A1 DE 2836924A1 DE 19782836924 DE19782836924 DE 19782836924 DE 2836924 A DE2836924 A DE 2836924A DE 2836924 A1 DE2836924 A1 DE 2836924A1
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Germany
Prior art keywords
electronic components
carrier
bonding device
component
evaluation circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19782836924
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German (de)
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DE2836924C2 (en
Inventor
Jean-Francois Dipl P Longchamp
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Blaupunkt Werke GmbH
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Blaupunkt Werke GmbH
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Publication date
Application filed by Blaupunkt Werke GmbH filed Critical Blaupunkt Werke GmbH
Priority to DE19782836924 priority Critical patent/DE2836924A1/en
Publication of DE2836924A1 publication Critical patent/DE2836924A1/en
Application granted granted Critical
Publication of DE2836924C2 publication Critical patent/DE2836924C2/de
Granted legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05551—Shape comprising apertures or cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05563—Only on parts of the surface of the internal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01076—Osmium [Os]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)

Abstract

The positioning device has t.v. camera (3) built into the bonding machine (2) above the support (5) holding the component. The camera's output is processed to determine the component's position. The processor controls the support's movement so that the component moves to a given position in the bonding machine. In this position the component's contacts are ultrasonically welded to the support's contacts via wires. This welding process is initiated as soon as the component and support are in the correct position.

Description

Die vorliegende Erfindung betrifft eine Vorrichtung zur automatischenThe present invention relates to an apparatus for automatic

Positionierung von auf.einem Träger festgelegten elektronischen Bauelementen nach dem Oberbegriff von Anspruch 1.Positioning of electronic components fixed on a carrier according to the preamble of claim 1.

So ist beispielsweise aus der DE-OS 26 22 283 ein Verfahren zur Lokalisierung eines Festkörperplättchens bekannt, bei dem das Festkörperplättchen eine als optisches Gitter ausgebildete Ortungsmarke aufweist, die mit einem Laserstrahl bestrahlt wird, wobei das Beugungsbild des Laserstrahls mit Hilfe eines Photodetektors zur Lokalisierung des Festkörperplättchens ausgewertet wird.For example, DE-OS 26 22 283 describes a method for localization a solid-state plate known, in which the solid-state plate as an optical Has a grid-shaped locating mark that is irradiated with a laser beam, wherein the diffraction image of the laser beam with the help of a photodetector for localization of the solid-state platelet is evaluated.

Ein derartiges Verfahren weist zahlreiche Nachteile auf.Such a method has numerous disadvantages.

So muß zunächst auf das Festkörperplättchen eine Ortungsmarke mit größter Genauigkeit aufgebracht werden, d. h. die Festkörperplättchen müssen für dieses Verfahren besonders vorbereitet werden. Ferner erfordert dieses Verfahren aufwendige Vorrichtungen, insbesondere eine Laserstrahlenquelle.A locating mark must first be placed on the solid-state platelet the greatest possible accuracy, d. H. the solid-state platelets must be used for this procedure must be specially prepared. Furthermore, this procedure requires complex devices, in particular a laser beam source.

Der Erfindung liegt die Aufgabe zugrunde, eine Vorrichtung der eingangs erwähnten Art zu entwickeln, die für elektronische Bauelemente nahezu jeder Art geeignet ist, zu deren Durchführung keine besondere Vorbereitung der elektronischen Bauelemente erforderlich ist und bei der auf besondere Vorrichtungen verzichtet werden kann.The invention is based on the object of providing a device of the initially described to develop the type mentioned, for electronic components of almost every kind is suitable, for the implementation of which no special preparation of the electronic Components is required and dispensed with special devices can be.

Diese Aufgabe wird gemäß der vorliegenden Erfindung dadurch gelöst, daß dem Bond-Gerät eine über dem Träger der elektronischen Bauelemente angeordnete Fernsehkamera zugeordnet ist, die Ausgangssignale der Fernsehkamera einer Auswertungsschaltung zur Lageerkennung der auf dem Träger festgelegten elektronischen Bauelemente zugeführt werden, der Auswertungsschaltung das Bond-Gerät und die Bewegungen des Trägers der elektronischen Bauelemente beeinflussende Steuerstufen nachgeordnet sind, die elektronischen Bauelemente in vorbestimmte Arbeitspositionen unter dem Bond-Gerät gelangen, indem der Träger der elektronischen Bauelemente von einer ersten Steuerstufe beeinflußt bewegt wird, und die Kontakte der elektronischen Bauelemente und die auf dem Träger angeordneten Kontakte durch Ultraschallschweißvorgänge mit Drähten verbunden werden, indem das Bond-Gerät von der zweiten Steuerstufe ausgelöst wird, sobald die elektronischen Bauelemente die vorbestimmten Arbeitspositionen unter dem Bond-Gerät erreicht haben.According to the present invention, this object is achieved by that the bonding device is arranged above the carrier of the electronic components TV camera is assigned, the output signals of the TV camera an evaluation circuit for position detection of the electronic components fixed on the carrier the evaluation circuit, the bond device and the movements of the wearer electronic Subordinate control stages influencing components are the electronic components get into predetermined working positions under the bonding device by the carrier the electronic components are moved influenced by a first control stage, and the contacts of the electronic components and those arranged on the carrier Contacts are connected to wires by ultrasonic welding by the Bond device from the second control stage is triggered as soon as the electronic Components have reached the predetermined working positions under the bonding device.

Gemäß einer vorteilhaften Ausbildung der Erfindung läßt sich der Anwendungsbereich einer derartigen Vorrichtung wesentlich erweitern, indem die Auswertungsschaltung auf die elektronischen Bauelemente und deren Arbeitspositionen programmierbar ist.According to an advantageous embodiment of the invention, the field of application such a device can be expanded significantly by the evaluation circuit is programmable on the electronic components and their working positions.

Eine zuverlässige und einfache Lageerkennung wird gemäß einer vorteilhaften Ausgestaltung der Erfindung dadurch gewährleistet, daß die von der Fernsehkamera aufgenommenen Fernsehbilder als l-Bit-kodierte Fernsehbilder auswertbar sind, indem die Auswertungsschaltung während einer mindestens ein Halbbild dauernden ersten Auswertungsphase den dunkelsten Grauwert des Videosignals ermittelt und einen zwischen diesem dunkelsten Grauwert des Videosignals und dem Videosignalhub liegenden Schwellwert einstellt, wobei die dem Bildfeld der Fernsehkamera zugeordnete Beleuchtung als Dunkelfeldbeleuchtung ausgebildet ist.A reliable and simple position detection is advantageous according to an Embodiment of the invention ensures that the television camera recorded television images can be evaluated as 1-bit-coded television images by the evaluation circuit during a first that lasts at least one field Evaluation phase determines the darkest gray value of the video signal and one between this darkest gray value of the video signal and the video signal swing threshold sets, the lighting assigned to the image field of the television camera as Dark field lighting is formed.

Die Vorteile der vorliegenden Erfindung bestehen insbesondere darin, daß die Lageerkennung der elektronischen Bauelemente in einem einfachen Bildanalyseverfahren mit einer handelsublicnen Schwarzweiß-Fernsehkamera erfolgt, wobei die Auswertung in Echtzeit abläuft und die Kodierung der Videosignale der Fernsehbilder von der Beleuchtungsstärke unabhängig ist. Die erfindungsgemäße Vorrichtung ist insbesondere für die Herstellung von hybrid aufgebauten elektronischen Schaltkreisen geeignet.The advantages of the present invention are, in particular, that the position detection of the electronic components in a simple image analysis process with a commercial black and white television camera, the evaluation runs in real time and the coding of the video signals of the television images from the Illuminance is independent. The device according to the invention is particularly suitable for the production of hybrid electronic circuits.

Die Erfindung wird nachfolgend an den Figuren 1 bis 3 näher erläutert.The invention is explained in more detail below with reference to FIGS. 1 to 3.

Dabei zeigt die Figur 1 den prinzipiellen Aufbau einer erfindungsgemäßen Vorrichtung. Figur 2 zeigt die der Fernsehkamera nachgeschaltete Auswertungsschaltung und die von dieser beeinflußten Steuerstufen.FIG. 1 shows the basic structure of an inventive Contraption. FIG. 2 shows the evaluation circuit connected downstream of the television camera and the tax levels affected by this.

Figur 3 zeigt ein elektronisches Bauelement, welches über einen Draht mit einem auf einem nicht näher dargestellten Träger angeordneten Kontakt verbunden ist.Figure 3 shows an electronic component, which via a wire connected to a contact arranged on a carrier not shown in detail is.

Die Figur 1 zeigt eine erfindungsgemäße Vorrichtung 1 mit dem Bond-Gerät 2 und der diesem fest zugeordneten Fernsehkamera 3 mit der Optik 4, in der das Objektiv und die Drnkelfeldbeleuchtung gemeinsam untergebracht sind. Der Träger 5 der in der Figur 1 nicht näher dargestellten elektronischen Bauelemente liegt auf einem von Antriebsmotoren 8 und 9 in der Ebene des Trägers 5 bewegbaren Tisches und läßt sich von einem mit einem Durchbruch im Arbeitsbereich des Bond-Gerätes 2 versehenen Halteelement 7 auf dem Tisch 6 festlegen. Das Bond-Gerät 2 weist in üblicher Weise eine als Kanüle ausgebildete Nadel auf, durch die der in der Figur 1 nicht näher dargestellte Draht zum Verbinden der elektronischen Bauelemente mit den nicht näher dargestellten Kontakten auf dem Träger 5 geführt wird. Die Verbindung des Drahtes erfolgt dabei durch bei Bond-Geräten übliche Ultraschallschweißungen, wozu die Nadel des Bond-Gerätes 2 in bekannter Weise mit einem Ultraschallgeber verbunden ist.FIG. 1 shows a device 1 according to the invention with the bonding device 2 and this permanently assigned television camera 3 with the optics 4, in which the lens and the pressure field lighting are housed together. The carrier 5 of the in Electronic components not shown in detail in FIG. 1 lie on one of drive motors 8 and 9 in the plane of the carrier 5 movable table and leaves from one provided with an opening in the working area of the bonding device 2 Fix the retaining element 7 on the table 6. The bonding device 2 has in the usual way a needle designed as a cannula, through which the in Figure 1 is not detailed shown wire for connecting the electronic components with the unspecified contacts shown on the carrier 5 is performed. The connection of the wire takes place by means of ultrasonic welds that are customary with bond devices, including the needle of the bonding device 2 is connected in a known manner to an ultrasonic transducer.

Die Funktion der Vorrichtung gemäß der Figur 1 wird nachfolgend mit der Figur 2 an dem Blockschaltbild einer erfindungsgemäßen Vorrichtung näher erläutert Die Ausgangssignale der Fernsehkamera 3 werden der Auswertungsschaltung 10 zugeführt. Während eines ersten Halbbildes werden die Videosignale über den Schalter 13 einem Schwarzwertdetektor 14 zugeführt. Der Schwarzwertdetektor 14 ermittelt und speichert den dunkelsten Grauwert des Videosignals und stellt einen zwischen diesem Grauwert und dem Videosignalhub liegenden Schwellwert des Komperators 15 ein. Dieser Schwellwert sollte bei etwa 30 % des Videosignalhubs liegen.The function of the device according to FIG. 1 is described below with 2 explained in more detail using the block diagram of a device according to the invention the Output signals from the television camera 3 are fed to the evaluation circuit 10. During a first field, the video signals via the switch 13 are a Black level detector 14 supplied. The black level detector 14 determines and stores the darkest gray value of the video signal and places one between this gray value and the threshold value of the comparator 15 lying on the video signal swing. This threshold should be around 30% of the video signal swing.

Der Schwellwert wird nun im nächsten Fernseh-Halbbild zur l-Bit-Kodierung des Fernsehbildes verwendet, indem während der folgenden Auswertungsphase die Videosignale über den Schalter 13 von der Fersehkamera 3 an den Komperator 15 geführt werden. Am Ausgang des Komperators 15 steht somit das in l-Bit-Kodierung digitalisierte Videosignal an, welches nunmehr weiter ausgewertet wird.The threshold value now becomes the 1-bit coding in the next television field of the television picture is used by the video signals during the following evaluation phase be passed via the switch 13 from the television camera 3 to the comparator 15. At the output of the comparator 15 there is thus the one digitized in 1-bit coding Video signal, which is now further evaluated.

Bei der Dunkelfeldbeleuchtung erscheint die glatte Oberfläche des als Halbleiterkristall ausgebildeten elektronischen Bauelements mit dem dunkelsten Grauwert im Fernsehbild, während die Kontakte des elektronischen Bauelements das Licht diffus streuen, so daß diese Kontakte im Fernsehbild als helle Bereiche erscheinen.The smooth surface of the appears in the dark field illumination designed as a semiconductor crystal electronic component with the darkest Gray value in the television picture, while the contacts of the electronic component the Scatter light diffusely so that these contacts appear as bright areas in the television picture.

Die in l-Bit-Kodierung am Ausgang des Komperators 15 anstehenden Videosignale werden der mit Bild- und Zeilenimpulsen von der Synchronstufe 12 getakteten Rasterstufe 16 zugeführt, durch welche die digitalisierten Videosignale einer Rasterquantelung nach einem vorgegebenen Zeilen-und Spaltenraster unterworfen werden. Die Ausgangssignale der Rasterstufe 16 werden dem Echtzeitauswerter 17 zugeführt. Der Echtzeitauswerter 17 analysiert fortwährend den Inhalt des kodierten Bildes und steuert die Speicherung der für die spätere Verarbeitung notwendigen Informationen im schnellen Schreib-Lesespeicher 18.The video signals present in 1-bit coding at the output of the comparator 15 are the raster stage clocked with image and line pulses from the synchronous stage 12 16 supplied, through which the digitized video signals a raster quantization be subjected to a predetermined row and column grid. The output signals the raster stage 16 are fed to the real-time evaluator 17. The real-time evaluator 17 continually analyzes the content of the coded image and controls the storage the information required for subsequent processing in the fast read-write memory 18th

Die von dem Echtzeitauswerter 17 im Schreib-Lesespeicher 18 abgespeicherten Informationen werden von der beispielsweise als Mikroprozessor ausgebildeten Schaltstufe 19 abgerufen und mit den im auf die elektronischen Bauelemente und deren Arbeitspositionen programmierbaren Speicher 20 verglichen.Those stored in the read / write memory 18 by the real-time evaluator 17 Information is obtained from the switching stage, which is designed, for example, as a microprocessor 19 retrieved and with the im on the electronic components and their working positions programmable memory 20 compared.

In Abhängigkeit von dem Ergebnis dieses Vergleichs beeinflußt die Schaltstufe 19 über die Steuerstufe 22 die Bewegung des Trägers der elektronischen Bauelemente derart, daß die elektronischen Bauelemente in vorbestimmte Arbeitspositionen unter dem Bond-Gerät gelangen . Sobald die elektronischen Bauelemente diese vorbestimmten Arbeitspositionen erreichen, löst die Schaltstufe 19 über die Steuerstufe 23 das Bond-Gerät und damit den Ultraschallschweißvorgang aus.Depending on the result of this comparison, the Switching stage 19 via the control stage 22 the movement of the carrier of the electronic Components such that the electronic components in predetermined working positions get under the bond device. As soon as the electronic components have this predetermined Reach working positions, the switching stage 19 solves the control stage 23 Bond device and thus the ultrasonic welding process.

Die Schaltstufe 19 ist über ein Bedienteil 21 beeinflußbar und ihr ist eine weitere Steuerstufe 24 für die Steuerung der übrigen Funktionsabläufe der Vorrichtung nachgeordnet.The switching stage 19 can be influenced via an operating part 21 and you is a further control stage 24 for controlling the other functional sequences of the Downstream device.

Figur 3 zeigt ein elektronisches Bauelement 26, welches mit einem Draht 28 verbunden ist. Gemäß Figur 3 ist das elektronische Bauelement 26, beispielsweise eine Lumineszenzdiode, auf einem Leiterbahnende 25 durch eine elektrisch leitende Verbindung, beispielsweise eine Klebeverbindung, festgelegt. Auf dem Kontakt 27 des elektronischen Bauelements 26 ist der Draht 28 mit einer erfindungsgemäßen Vorrichtung im Bondverfahren unter Ultraschalleinwirkung aufgeschweißt worden. Im Anschluß daran wurde der Draht 28 zu dem Kontakt 29 geführt und mit diesem im Bondverfahren verschweißt und der in der Nadelkanüle geführte Draht von dieser Schweißverbindung abgetrennt. Das Leiterbahnende 25 und der Kontakt 29 sind auf dem nicht näher dargestellten beispielsweise aus Hartpapier oder Keramik bestehenden Träger des elektronischen Bauelements festgelegt.Figure 3 shows an electronic component 26, which with a Wire 28 is connected. According to Figure 3, the electronic component 26, for example a light emitting diode, on a conductor track end 25 through an electrically conductive one Connection, for example an adhesive connection, set. On the contact 27 of the electronic component 26 is the wire 28 with a device according to the invention was welded using the bonding process under the action of ultrasound. Following that the wire 28 was led to the contact 29 and welded to this in the bonding process and the wire guided in the needle cannula is severed from this welded joint. The conductor track end 25 and the contact 29 are on the not shown For example, made of hard paper or ceramic carrier of the electronic Component set.

Erfindungsgemäße Vorrichtungen sind in ihrem Aufbau einfach und weisen eine hohe Zuverlässigkeit auf. Sie sind insbesondere für die serienmäßige Herstellung von hybrid aufgebauten elektronischen Schaltkreisen geeignet.Devices according to the invention are simple and wise in their construction high reliability. They are especially designed for series production suitable for hybrid electronic circuits.

Claims (4)

Vorrichtung zur automatischen Positionierung von elektronischen Bauelementen Ansprüche Vorrichtung zur automatischen Positionierung von auf einem Träger festgelegten elektronischen Bauelementen unter einem Bond-Gerät, dadurch gekennzeichnet, daß dem Bond-Gerät (2) eine über dem Träger (5) der elektronischen Bauelemente (26) angeordnete Fernsehkamera (3) zugeordnet ist, die Ausgangssignale der Fernsehkamera (3) einer Auswertungsschaltung (10) zur Lageerkennung der auf dem Träger (5) festgelegten elektronischen Bauelemente (26) zugeführt werden, der Auswertungsschaltung (10) das Bond-Gerät (2) und die Bewegungen des Trägers (5) der elektronischen Bauelemente (26) beieinflussende Steuerstufen (22, 23) nachgeordnet sind, die elektronischen Bauelemente (26) in vorbestimmte Arbeitspositionen unter dem Bond-Gerät (2) gelangen, indem der Träger (5) der elektronischen Bauelemente (26) von einer ersten Steuerstufe (22) beeinflußt bewegt wird, und die Kontakte (27) der elektronischen Bauelemente (26) und die auf dem Träger (5) angeordneten Kontakte (29) durch Ultraschallschweißvorgänge mit Drähten (28) verbunden werden, indem das Bond-Gerät (2) von der zweiten Steuerstufe (2;3) ausgelöst wird, sobald die elektronischen Bauelemente (26) die vorbestimmten Arbeitspositionen unter dem Bond-Gerät (2) erreicht haben. Device for the automatic positioning of electronic components Claims device for the automatic positioning of fixed on a carrier electronic components under a bonding device, characterized in that the bonding device (2) one above the carrier (5) of the electronic components (26) arranged television camera (3) is assigned, the output signals of the television camera (3) an evaluation circuit (10) for detecting the position of the ones fixed on the carrier (5) electronic components (26) are fed to the evaluation circuit (10) the bonding device (2) and the movements of the carrier (5) of the electronic components (26) are subordinate to influencing control stages (22, 23), the electronic Components (26) move into predetermined working positions under the bonding device (2), by the carrier (5) of the electronic components (26) from a first control stage (22) is influenced moved, and the contacts (27) of the electronic components (26) and the contacts (29) arranged on the carrier (5) by ultrasonic welding processes with wires (28) connected by the bonding device (2) from the second control stage (2; 3) is triggered as soon as the electronic components (26) the predetermined Have reached working positions under the bonding device (2). 2. Vorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Auswertungsschaltung (10) auf die elektronischen Bauelemente (26) und deren Arbeitspositionen programmierbar ist.2. Apparatus according to claim 1, characterized in that the evaluation circuit (10) programmable on the electronic components (26) and their working positions is. 3. Vorrichtung nach den Ansprüchen 1 und 2, dadurch gekennzeichnet, daß die dem Bildfeld der Fernsehkamera (3) zugeordnete Beleuchtung als Dunkelfeldbeleuchtung ausgebildet ist.3. Device according to claims 1 and 2, characterized in that that the lighting assigned to the image field of the television camera (3) as dark field lighting is trained. 4. Vorrichtung nach den Ansprüchen 1 bis 3, dadurch gekennzeichnet, daß die von der Fernsehkamera (3) aufgenommenen Fernsehbilder als l-Bit-kodierte Fernsehbilder auswertbar sind, indem die Auswertungsschaltung (10) während einer mindestens ein Halbbild dauernden ersten Auswertungsphase den dunkelsten Grauwert des Videosignals ermittelt und einen zwischen diesem dunkelsten Grauwert des Videosignals und dem Videosignalhub liegenden Schwellwert einstellt.4. Device according to claims 1 to 3, characterized in that that the television pictures recorded by the television camera (3) are encoded as 1-bit Television images can be evaluated by the evaluation circuit (10) during a The first evaluation phase lasts for at least one field and the darkest gray value of the video signal and one between this darkest gray value of the video signal and adjusts the threshold value lying within the video signal swing.
DE19782836924 1978-08-24 1978-08-24 Automatic positioning device for electronic components - initiates ultrasound welding of wires between component and support in bonding machine Granted DE2836924A1 (en)

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DE19782836924 DE2836924A1 (en) 1978-08-24 1978-08-24 Automatic positioning device for electronic components - initiates ultrasound welding of wires between component and support in bonding machine

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DE19782836924 DE2836924A1 (en) 1978-08-24 1978-08-24 Automatic positioning device for electronic components - initiates ultrasound welding of wires between component and support in bonding machine

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DE2836924A1 true DE2836924A1 (en) 1980-03-06
DE2836924C2 DE2836924C2 (en) 1987-10-15

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EP0062335A2 (en) * 1981-04-03 1982-10-13 Hitachi, Ltd. Automatic assembly system
DE4239039A1 (en) * 1992-11-20 1994-05-26 Css Semiconductor Equipment Gm Acquisition of control data from semiconductor component bond pads - using computer to convert video monitor and X-Y table co-ordinates into bond pad global co-ordinates

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US3909933A (en) * 1973-03-30 1975-10-07 Western Electric Co Method for transferring and bonding articles
DE2722567A1 (en) * 1976-05-19 1977-11-24 Hitachi Ltd POSITION DETECTION SYSTEM
DE2622283A1 (en) * 1976-05-19 1977-12-08 Bosch Gmbh Robert METHOD FOR LOCATING A SOLID PLATE AND SOLID PLATE FOR CARRYING OUT THE METHOD
DE2704266A1 (en) * 1976-09-20 1978-03-23 Cii Honeywell Bull METHOD AND SYSTEM FOR MOUNTING IC CHIPS ON A SUBSTRATE
DE2643810A1 (en) * 1976-09-29 1978-03-30 Licentia Gmbh ADJUSTMENT METHOD

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Publication number Priority date Publication date Assignee Title
US3909933A (en) * 1973-03-30 1975-10-07 Western Electric Co Method for transferring and bonding articles
DE2722567A1 (en) * 1976-05-19 1977-11-24 Hitachi Ltd POSITION DETECTION SYSTEM
DE2622283A1 (en) * 1976-05-19 1977-12-08 Bosch Gmbh Robert METHOD FOR LOCATING A SOLID PLATE AND SOLID PLATE FOR CARRYING OUT THE METHOD
DE2704266A1 (en) * 1976-09-20 1978-03-23 Cii Honeywell Bull METHOD AND SYSTEM FOR MOUNTING IC CHIPS ON A SUBSTRATE
DE2643810A1 (en) * 1976-09-29 1978-03-30 Licentia Gmbh ADJUSTMENT METHOD

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0062335A2 (en) * 1981-04-03 1982-10-13 Hitachi, Ltd. Automatic assembly system
EP0062335A3 (en) * 1981-04-03 1983-08-24 Hitachi, Ltd. Automatic assembly system
DE4239039A1 (en) * 1992-11-20 1994-05-26 Css Semiconductor Equipment Gm Acquisition of control data from semiconductor component bond pads - using computer to convert video monitor and X-Y table co-ordinates into bond pad global co-ordinates
DE4239039C2 (en) * 1992-11-20 2001-08-16 Hesse Gmbh Method for acquiring data from bond pads for controlling a bonder

Also Published As

Publication number Publication date
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