Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
B23K1/00—Soldering, e.g. brazing, or unsoldering
Landscapes
Engineering & Computer Science
(AREA)
Mechanical Engineering
(AREA)
Connections Effected By Soldering, Adhesion, Or Permanent Deformation
(AREA)
Description
BERLIN. GEDRUCKT IN DER REICHSDRUCKEREI.BERLIN. PRINTED IN THE REICHSDRUCKEREI.
Claims (2)
Patent-Ansprüche: 45 55Patent Claims: 45 551. Lötverbindung, dadurch gekennzeichnet, daß gleichzeitig eine größere Anzähl
feiner Lotfäden in z. B. Strähnen- oder Zopfform verwendet wird, im übrigen aber Q0
in an sich bekannter Weise gelötet wird.1. Solder connection, characterized in that at the same time a larger number of fine solder threads in z. B. strand or plait shape is used, but otherwise Q 0 is soldered in a known manner.2. Lötverbindung nach Anspruch 1, dadurch gekennzeichnet, daß Lotfäden verwendet
werden, deren Außenseite mit einem glasur- oder emailartigen Überzug von Lötmitteln
versehen ist.2. Solder connection according to claim 1, characterized in that solder threads are used
the outside of which is covered with a glaze-like or enamel-like coating of solder
is provided.
A method of forming a gold plating electrode, a substrate based on the electrode formation method, and a wire bonding method using this electrode formation method