DE2752742A1 - Cascade circuit for UHF amplifier - has N-channel MISFET connected by drain to emitter of series bipolar NPN transistor - Google Patents
Cascade circuit for UHF amplifier - has N-channel MISFET connected by drain to emitter of series bipolar NPN transistorInfo
- Publication number
- DE2752742A1 DE2752742A1 DE19772752742 DE2752742A DE2752742A1 DE 2752742 A1 DE2752742 A1 DE 2752742A1 DE 19772752742 DE19772752742 DE 19772752742 DE 2752742 A DE2752742 A DE 2752742A DE 2752742 A1 DE2752742 A1 DE 2752742A1
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- 230000002441 reversible effect Effects 0.000 claims abstract description 4
- 230000005669 field effect Effects 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000012876 carrier material Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 229910052594 sapphire Inorganic materials 0.000 claims description 2
- 239000010980 sapphire Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/06—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration
- H01L27/07—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common
- H01L27/0705—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type
- H01L27/0711—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors
- H01L27/0716—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration the components having an active region in common comprising components of the field effect type in combination with bipolar transistors and diodes, or capacitors, or resistors in combination with vertical bipolar transistors and diodes, or capacitors, or resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/04—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only
- H03F3/16—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements with semiconductor devices only with field-effect devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Amplifiers (AREA)
Abstract
Description
Kaskadeschaltung aus zwei in Reihe geschalteten TransistorenCascade connection of two transistors connected in series
Die Erfindung betrifft eine Kaskade schaltung aus zwei in Reihe geschalteten Transistoren für vorzugsweise UHP1-Verstärker.The invention relates to a cascade circuit comprising two series-connected Transistors for preferably UHP1 amplifiers.
Es gibt bereits eine Kaskade schaltung in Form einer MOS-FET-Tetrode, bei der zwei MOS-Feldeffekttransistoren in Reihe geschaltet sind.There is already a cascade circuit in the form of a MOS-FET tetrode, in which two MOS field effect transistors are connected in series.
Eine derartige herkammliche MOS-FET-Tetrode ist in Fig. 1 dargestellt. Auf einem zum Beispiel p-leitenden Substrat 1 befindet sich eine p-leitende epitaktische Schicht 2, in der n-leitende Zonen 3, 4, 5, 6 und 7 vorgesehen sind. Die Zonen 3 und 4 dienen als Source des ersten Feldeffekttransistors. Die Zone 5 dient als Drain des ersten Feldeffekttransistors und gleichzeitig als Source des zweiten Feldeffekttransistors. Die Zonen 6 und 7 dienon als Drain des zweiten Feldeffekttransistors. Auf der Zone 3 ist eine Source-Elektrode S vorgesehen, die einerseits über eine Leitung 12 mit dem Substrat 1 und andererseits mit einem Anschluß 8 verbunden ist. Über einem Kanal 13 zwischen der Zone 4 und der Zone 5 befindet sich eine Gate-Elektrode G1, die mit einos Anschluß 9 veztunden ist. Ebenso befindet sich über einem Kanal 14 zwischen der Zone 5 und der Zone 6 eine Gate-Elektrode G2, die mit einem Anschluß 10 verbunden ist. Schließlich ist noch über der Zone 7 eine Draln-Zloktrodo D vorgesehen, die mit einem Anschluß 11 verbunden ist.Such a conventional MOS-FET tetrode is shown in FIG. On a p-conductive substrate 1, for example, there is a p-conductive epitaxial Layer 2, in which n-conductive zones 3, 4, 5, 6 and 7 are provided. Zones 3 and 4 serve as the source of the first field effect transistor. Zone 5 serves as a drain of the first field effect transistor and at the same time as the source of the second field effect transistor. The zones 6 and 7 serve as the drain of the second field effect transistor. On the zone 3, a source electrode S is provided, which on the one hand via a line 12 with the substrate 1 and on the other hand to a terminal 8 is connected. Over a canal 13 between the zone 4 and the zone 5 is a gate electrode G1, the with one connection 9 is veztunden. There is also a channel 14 between the zone 5 and the zone 6 have a gate electrode G2, which is connected to a terminal 10 is. Finally, a Draln-Zloktrodo D is provided above zone 7, which is connected to a terminal 11.
Bei Betrieb dieser MOS-FET-Tetrode bildet sich eine Raumladungszone 16, die zu Kapazitäten 17, 18 zwischen der Zone 5 und der Schicht 2 beziehungsweise zwischen der Zone 6, 7 und der Schicht 2 führt.When this MOS-FET tetrode is operated, a space charge zone is formed 16 leading to capacities 17, 18 between zone 5 and layer 2 respectively between the zone 6, 7 and the layer 2 leads.
Der über die Gate-Elektrode G1 gesteuerte Strom fließt über die Zone 5, die gleichzeitig Drain für den Transistor I und Source für den Transistor II darstellt, über den Kanal 14 in die Drain-Zone 6, 7.The current controlled by the gate electrode G1 flows across the zone 5, the drain for transistor I and source for transistor II at the same time represents, via the channel 14 into the drain zone 6, 7.
Bei dieser MOS-FET-Tetrode geht wegen der beträchtlich hohen Eingangsimpedanz des Transistors II mit steigender Frequenz ein erheblicher Stromanteil als Parallelableitstrom von der Zone 5 zum Substrat 1 hin verloren. Wegen der geringen Steilheit der Kennlinie des Transistors II ist bei ftmultiplikativerll Mischung (als "multiplikative" Mischschaltung wird eine Schaltung mit einem Oszillator an der Gate-Elektrode G2 bezeichnet, was im Prinzip eine Schaltung mit Drain-Modulation für den Transistor I bedeutet) oder bei Regelung über die Gate-Elektrode G2 ein hoher Steuerspannungshub erforderlich; außerdem werden im Regelbetrieb Steuerpotentiale außerhalb der Betriebspotentiale an der Drain-Elektrode D und an der Source-Elektrode S benötigt.This MOS-FET tetrode works because of the considerably high input impedance of the transistor II with increasing frequency a considerable current share as parallel leakage current lost from zone 5 to substrate 1. Because of the low steepness of the characteristic of transistor II is at multiplicative / mixing (as a "multiplicative" mixing circuit a circuit with an oscillator at the gate electrode G2 is called what in principle means a circuit with drain modulation for the transistor I) or in the case of regulation via the gate electrode G2, a high control voltage swing is required; in addition, control potentials are outside the operating potentials in normal operation at the drain electrode D and at the source electrode S required.
Die Ausgangskapazität der MOS-FET-Tetrode ist wegen des hohen Flächenbedarfs für die Drain-Zone 7 und für die Kontaktierfläche der Drain-Elektrode D für praktische Anwendungen im UHF-Gebiet zu groß und etwa um einen Faktor 2 größer als bei Bipolartransistoren. Schließlich kann auch die Kanallänge des Kanals 14 unter der Gate-Elektrode G2 aus Sperrspannungsgrtinden nicht beliebig verkürzt werden.The output capacitance of the MOS-FET tetrode is due to the large area required for the drain zone 7 and for the contact surface of the drain electrode D for practical Applications in the UHF area too large and about a factor of 2 larger than with bipolar transistors. Finally, the channel length of the channel 14 under the gate electrode G2 can also be selected Blocking voltage reasons cannot be shortened arbitrarily.
Es ist daher Aufgabe der Erfindung, eine Kaskadeschaltung der eingangs genannten Art mit hoher Verstärkung, großem Regelumfang und großer Regelsteilheit anzugeben, die innerhalb der Betriebspotentiale für die Schaltung vollregelbar ist, die eine geringe Ausgangskapazität, eine hohe Sperrspannung, eine hohe Arbeits- frequenz und einen hohen Eingangswiderstand für Wechselspannung aufweist und insbesondere für VHF- und UHF-Verstärker mit hoher Mischsteilheit und geringem Oszillatorspannungsbedarf geeignet ist.It is therefore an object of the invention to provide a cascade circuit of the initially mentioned named type with high gain, large control range and high control steepness specify which is fully controllable within the operating potential for the circuit, which have a low output capacitance, a high reverse voltage, a high working frequency and has a high input resistance for AC voltage, and in particular For VHF and UHF amplifiers with a high mixer slope and low oscillator voltage requirement suitable is.
Diese Aufgabe wird erfindungsgemäß dadurch gelöst, daß Drain eines Feldeffekttransistors mit dem Emitter eines Bipolartransistors zusammengeschaltet ist.This object is achieved in that the drain of a Field effect transistor interconnected with the emitter of a bipolar transistor is.
Die niederohmige Eingangsimpedanz des Bipolartransistors zwingt nahezu den gesamten Stromfluß aus dem Kanal des Feldeffekttransistors in den Emitter des Bipolartransistors. Damit ist der kapazitive Nebenschluß der Zone 5 zum Substrat 1 und zur Schicht 2 praktisch wirkungslos.The low-resistance input impedance of the bipolar transistor is almost compelling the entire current flow from the channel of the field effect transistor into the emitter of the Bipolar transistor. This is the capacitive shunt of zone 5 to the substrate 1 and to layer 2 practically ineffective.
Durch die hohe Steilheit des Bipolartransistors wird die Regelsteilheit etwa um einen Faktor 3 verbessert, womit die' Anforderungen an einen Uberlagerungsoszillator hinsichtlich Spannungsamplitude gesenkt und damit unter anderem die Störstrahlungsprobleme entschärft werden.The steepness of the regulation is due to the steepness of the bipolar transistor about a factor of 3 improved, which means that the 'requirements for a local oscillator reduced in terms of voltage amplitude and thus among other things the interference radiation problems be defused.
Die Regelung erfolgt mit äußerst geringer Streuung genau der Basisspannung; eine volle Abregelung wird bereits innerhalb des Betriebsspannungsbereichs mit Kollektorspannung/Sourcespannung erreicht.The regulation is carried out with an extremely small spread of the base voltage; full curtailment is already within the operating voltage range with collector voltage / source voltage achieved.
Mit dem flächenkleineren Bipolartransistor wird die Ausgangskapazität verringert, was insbesondere für die Multichip-Integration gilt.With the smaller-area bipolar transistor, the output capacitance reduced, which is especially true for multichip integration.
Die HF- und die ZF-Ausgangsimpedanz ist wesentlich höher als bei für UlIF-Verhalten speziell optimierten Feldettekttransistor-Kaskaden.The HF and IF output impedance is much higher than for for UlIF behavior specially optimized field transistor cascades.
Mit dem Bipolartransistor werden die Sperrspannungsprobleme versieden, die sonst bei einem XOS-Feldeffekttransistor eng mit den HF-Eigenschaften wegen der kurzen Kanallinge verknüpft sind.With the bipolar transistor, the reverse voltage problems are separated, which is otherwise closely related to the RF properties of an XOS field effect transistor the short canal lengths are linked.
Schließlich werden bei der erfindungsgemäßen Kaskadeschaltung die günstigen Verzerrungs- und Rauscheigenschaften des Feldeffekttransistors beibehalten.Finally, in the cascade circuit according to the invention, the Maintain favorable distortion and noise properties of the field effect transistor.
Nachfolgend wird die Erfindung an Hand der Zeichnung näher erläutert. Es zeigen: Fig. 1 einen Schnitt durch eine herkömmliche MOS-FET-Tetrode, Fig. 2 ein Schaltbild der erfindungsgemäßen Kaskadeschaltung, Fig. 3 einen Schnitt durch ein Ausführungsbeispiel der Erfindung, Fig. 4 ein Schaltbild der erfindungsgemäßen Kaskadeschaltung mit Eingangs-Phasenumkehr, Fig. 5 Kennlinien zur Erläuterung des AusfUhrungsbeispiels der Fig. 4, und Fig. 6 Signale zur Erläuterung des Betriebs des Ausführungsbeispiels der Fig. 4.The invention is explained in more detail below with reference to the drawing. The figures show: FIG. 1 a section through a conventional MOS-FET tetrode, FIG. 2 a circuit diagram of the cascade circuit according to the invention, FIG. 3 a section through an embodiment of the invention, Fig. 4 is a circuit diagram of the invention Cascade circuit with input phase reversal, Fig. 5 characteristic curves to explain the 4 and FIG. 6 signals for explaining the operation of the embodiment of FIG. 4.
In Fig. 2 ist ein N-Kanal-MIS-Feldeffekttransistor 20 mit seiner Drain-Elektrode D mit dem Emitter E eines NPN-Bipolartransistors 21 zusammengeschaltet. Den Eingang dieser Schaltung bildet die Gate-Elektrode D des Feldeffekttransistors 20, während der Ausgang am Kollektor K des Bipolartransistors 21 vorgesehen ist.In Fig. 2 is an N-channel MIS field effect transistor 20 with its drain electrode D is connected to the emitter E of an NPN bipolar transistor 21. The entrance this circuit forms the gate electrode D of the field effect transistor 20, while the output at the collector K of the bipolar transistor 21 is provided.
Steuersignale liegen an der Basis B des Bipolartransistors 21 und an der Gate-Elektrode G des Feldeffekttransistors 20.Control signals are applied to the base B of the bipolar transistor 21 and at the gate electrode G of the field effect transistor 20.
Mit dieser erfindungsgemäßen Kaskadeschaltung aus dem Feldeffekttransistor 20 und dem Bipolartransistor 21 werden unter Beibehaltung der günstigen Verzerrungseigenschaften des Feldettekttransistors 20 die Hochfrequenzeigenschaften, die Mischsteilheit und -verstärkung sowie die Ausgangskapazität und die Spannungsfestigkeit gegenüber der herkömmlichen MOS-FET-Tetrode verbessert.With this cascade circuit according to the invention from the field effect transistor 20 and the bipolar transistor 21 are while maintaining the favorable distortion properties of the field effect transistor 20, the high-frequency properties, the mixing slope and gain as well as the output capacitance and the dielectric strength compared to the conventional MOS-FET tetrode improved.
Bei der Erfindung werden also ein Feldeffekttransistor in Source-Schaltung und ein Bipolartransistor in Basis-Schaltung zu einer Kaskade zusammengeschaltet. Diese Zusammenschaltung kann als Hybridbaustein oder in monolithischer Integration erfolgen.In the case of the invention, a field effect transistor is used in a source circuit and a bipolar transistor connected together in a basic connection to form a cascade. This interconnection can take the form of a hybrid module or monolithic integration take place.
Fig. 3 zeigt nun ein Beispiel einer integrierten Kaskadeschaltung nach der Lehre der Erfindung. Dabei werden in Fig. 3 füreinander entsprechende Teile die gleichen Bezugszeichen verwendet wie in Fig. 1.3 now shows an example of an integrated cascade circuit according to the teaching of the invention. Corresponding parts are shown in FIG. 3 the same reference numerals are used as in FIG. 1.
Im linken Teil der Fig. 3 ist der Feldeffekttransistor 20 dargestellt, während der rechte Teil der Fig. 3 den Bipolartransistor 21 zeigt. Der Feldeffekttransistor 20 besteht aus der n+-leitenden Source-Zone 3, der n-leitenden Zone 4, der n+-leitenden Source-Zone 7 und der n-leitenden Zone 6 in der p-leitenden Schicht 2. Zwischen den Zonen 4 und 6 bildet sich unter der Gate-Elektrode G mit dem Gate-Anschluß 25 der Kanal 13. Auf der Zone 3 ist die Source-Elektrode S mit dem Source-Anschluß 26 vorgesehen. Auf der Drain-Zone 7 ist die Drain-Elektrode D mit dem Drain-Anschluß 27 vorgesehen.In the left part of Fig. 3, the field effect transistor 20 is shown, while the right part of FIG. 3 shows the bipolar transistor 21. The field effect transistor 20 consists of the n + -conducting source zone 3, the n -conducting zone 4, the n + -conducting Source zone 7 and the n-conductive zone 6 in the p-conductive layer 2. Between the zones 4 and 6 is formed under the gate electrode G with the gate terminal 25 the channel 13. On the zone 3 is the source electrode S with the source connection 26 provided. On the drain zone 7 is the drain electrode D with the drain connection 27 provided.
Der Bipolartransistor 21 besteht aus einer n+-leitenden vergrabenen Schicht (buried-layer) 30 mit einer n+-leitenden Kontakt-Anschlußzone 31, aus einer n-leitenden Zone 32, aus einer p-leitonen Zone 33 und aus einer n+-leitenden Zone 34. Die Zonen 30, 31 und 32 bilden die Kollektor-Zone des Bipolartransistors 21.The bipolar transistor 21 consists of an n + -type buried Layer (buried layer) 30 with an n + -conductive contact connection zone 31, from a n-conductive zone 32, from a p-conductive zone 33 and from an n + -conductive zone 34. The zones 30, 31 and 32 form the collector zone of the bipolar transistor 21.
Die Zone 33 bildet die Basis-Zone des Bipolartransistors 21. Die Zone 34 bildet die Emitter-Zone des Bipolartransistors 21. Auf der Zone 34 ist eine Emitter-Elektrode E mit einem Emitter-Anschluß 35 vorgesehen. Auf der Zone 33 ist eine Basis-Elektrode B mit dem Basis-Anschluß 36 vorgesehen. Auf der Zone 31 ist die Kollektor-Elektrode K mit dem Kollektor-Anschluß 37 vorgesehen.The zone 33 forms the base zone of the bipolar transistor 21. The zone 34 forms the emitter zone of the bipolar transistor 21. On the zone 34 is an emitter electrode E with an emitter terminal 35 is provided. On the zone 33 is a base electrode B with the base connection 36 is provided. The collector electrode is on zone 31 K is provided with the collector connection 37.
Die Anschlüsse 27 und 35 der Drain-Elektrode D beziehungsweise der Emitter-Elektrode E sind durch eine Leitung 38 verbunden.The terminals 27 and 35 of the drain electrode D and the Emitter electrodes E are connected by a line 38.
Diese Leitung 38 kann gegebenenfalls auch direkt auf der Iso- lierschicht über der Oberfläche der Schicht 2 beziehungsweise der in sie eingebetteten Zonen als Leiterbahn geführt werden.This line 38 can optionally also directly on the insulation layer over the surface of the layer 2 or the zones embedded in it be led as a conductor track.
Die einzelnen Zonen in der Schicht 2 beziehungsweise im Halbleitersubstrat 1 für den Feldeffekttransistor 20 und dem Bipolartransistor 21 können durch Diffusion oder durch Ionenimplantation hergestellt werden.The individual zones in layer 2 or in the semiconductor substrate 1 for the field effect transistor 20 and the bipolar transistor 21 can by diffusion or made by ion implantation.
Fig. 4 zeigt eine Abwandlung des Ausführungsbeispiels der Fig. 2 mit Eingangs-Phasenumkehr. Ein Vorstrom I, der beispielsweise durch eine integrierte Stromquelle 40 oder einen Widerstand erzeugt wird, steuert das Drain-Potential des Feldeffekttransistors 20 über das Potential an der Basis-Elektrode B des Bipolartransistors 21 so um, daß der als Eingangstransistor arbeitende Feldeffekttransistor 20 invers betrieben wird. Damit kann das Eingangssignal während der gesamten Steuerperiode, beispielsweise eines Oszillators, ausgenutzt werden. Es wird so eine Steigerung der Mischverstärkung um 3 dB erzielt.Fig. 4 shows a modification of the embodiment of FIG Input phase reversal. A bias current I, for example through an integrated Current source 40 or a resistor is generated, controls the drain potential of the Field effect transistor 20 via the potential at the base electrode B of the bipolar transistor 21 so that the field effect transistor working as an input transistor 20 inversely is operated. This means that the input signal can be used during the entire control period, for example an oscillator. It will be such an increase the mixer gain by 3 dB.
Fig. 5 zeigt die Abhängigkeit des Drain-Stroms ID von der Kollektorspannung UK mit der Gate-Spannung UG als Parameter. Die Differenz UM'TUBE (UBE = Basis-Emitter-Spannung des Bipolartransistors 21) ist in Fig. 5 durch Linien 51, 52 dargestellt. Im unteren Teil der Fig. 5 ist der Signalverlauf UB-UBE aufgetragen.5 shows the dependence of the drain current ID on the collector voltage UK with the gate voltage UG as a parameter. The difference UM'TUBE (UBE = base-emitter voltage of the bipolar transistor 21) is shown in FIG. 5 by lines 51, 52. At the bottom The signal curve UB-UBE is plotted in part of FIG. 5.
Fig. 6 a zeigt den Verlauf der Steuerspannung Ust beziehungsweise der Basisspannung U3 an der Basis-Elektrode des Bipolartransistors 21.Fig. 6 a shows the course of the control voltage Ust or the base voltage U3 at the base electrode of the bipolar transistor 21.
Fig. 6 b zeigt den Verlauf der Eingangsspannung UE beziehungsweise der Gate-Spannung UG an der Gate-Elektrode G des Feldeffekttransistors 20. Fig. 6 c zeigt schließlich den Verlauf des Ausgangstroms IA an dem Kollektor K des Bipolartransistors 21.Fig. 6 b shows the profile of the input voltage UE or the gate voltage UG at the gate electrode G of the field effect transistor 20. Fig. 6c finally shows the profile of the output current IA at the collector K of the bipolar transistor 21.
Der störende Einfluß des Substratpotentials des Halbleitersubstrats 1 auf die Steilheit von Feldeffekttransistoren, insbesondere MIS-Feldeffekttransistoren, der besonders beim Ausführungsbeispiel der Fig. 4 auftritt, aber auch bei MIS-Tetroden wirksam ist, kann durch Verwendung eines hochohmigen Trägermaterials für das Substrat 1 ausgeschlossen werden, wie zum Beispiel durch Saphir oder semiisolierendes Halbleitermaterial.The disturbing influence of the substrate potential of the semiconductor substrate 1 on the steepness of field effect transistors, in particular MIS field effect transistors, which occurs particularly in the embodiment of FIG. 4, but also in MIS tetrodes can be effective by using a high-resistance carrier material for the substrate 1, such as sapphire or semi-insulating semiconductor material.
9 Patentansprüche 6 Figuren9 claims 6 figures
Claims (9)
Priority Applications (1)
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DE19772752742 DE2752742C2 (en) | 1977-11-25 | 1977-11-25 | Cascade connection of two transistors connected in series |
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DE19772752742 DE2752742C2 (en) | 1977-11-25 | 1977-11-25 | Cascade connection of two transistors connected in series |
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DE2752742A1 true DE2752742A1 (en) | 1979-05-31 |
DE2752742C2 DE2752742C2 (en) | 1982-07-01 |
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DE19772752742 Expired DE2752742C2 (en) | 1977-11-25 | 1977-11-25 | Cascade connection of two transistors connected in series |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0763895A2 (en) * | 1995-09-14 | 1997-03-19 | Siemens Aktiengesellschaft | Circuit arrangement and semiconductor body with a power switch |
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1977
- 1977-11-25 DE DE19772752742 patent/DE2752742C2/en not_active Expired
Non-Patent Citations (1)
Title |
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"Radio and Electronics Constructor", July 1975, Vol. 28, No. 12, S. 719 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0763895A2 (en) * | 1995-09-14 | 1997-03-19 | Siemens Aktiengesellschaft | Circuit arrangement and semiconductor body with a power switch |
EP0763895A3 (en) * | 1995-09-14 | 1999-07-07 | Siemens Aktiengesellschaft | Circuit arrangement and semiconductor body with a power switch |
Also Published As
Publication number | Publication date |
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DE2752742C2 (en) | 1982-07-01 |
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