DE2543109A1 - Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components - Google Patents

Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components

Info

Publication number
DE2543109A1
DE2543109A1 DE19752543109 DE2543109A DE2543109A1 DE 2543109 A1 DE2543109 A1 DE 2543109A1 DE 19752543109 DE19752543109 DE 19752543109 DE 2543109 A DE2543109 A DE 2543109A DE 2543109 A1 DE2543109 A1 DE 2543109A1
Authority
DE
Germany
Prior art keywords
adhesive
contact
microcapsules
broken
conductive adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19752543109
Other languages
German (de)
Inventor
Lothar Ing Grad Goehlich
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Original Assignee
Siemens AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG filed Critical Siemens AG
Priority to DE19752543109 priority Critical patent/DE2543109A1/en
Publication of DE2543109A1 publication Critical patent/DE2543109A1/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1163—Chemical reaction, e.g. heating solder by exothermic reaction

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)

Abstract

The contact, for electrical connections has its surface covered with microcapsules containing a conducting adhesive so that the contact resistance between the two connected parts is reduced. The capsules contain different components in a two or multiple component adhesive system. When the capsules are broken these components react to form the bond. Each component contains a dispersed metal powder. The capsules are held to the contact surface initially by a thin film of adhesive. The advantage of this method of making connections lies not only in improving contact but also in avoiding intermediate metal parts.

Description

Kontaktteil für eine elektrisch leitende VerbindungContact part for an electrically conductive connection

3eim Verbinden von elektrischen Bauteilen und Leitungen werden im gesamten elektrotechnischen Bereich neben mechanischer Festigkeit vor allem ein niedriger und zeitlich konstanter Ubergangswiderstand gefordert. Die gestellten technischen Bedingungen werden zwar von stoffschlüssigen Verbindungen erfüllt, jedoch sind derartige Verbindungen meist zu aufwendig. Dagegen sind kraft-und formschlüssige elektrische Verbindungen durch Schrauben, Krimpen, Wrappen, Klemmen usw. zwar mit einem geringeren Aufwand verbunden, sie sind jedoch in einer Reihe von Anwendungsfällen technisch nicht befriedigend, weil der Übergangswiderstand der Verbindung zeitlichen Änderungen unterworfen ist. Insbesondere bei kraftschlüssigen Verbindungen mit nichtkupfernen Metallteilen können sich Korrosionseinflüsse negativ bemerkbar machen. So bestehen beispielsweise Bedenken gegen den Einsatz von Aluminium als Leitermaterial in der Installations- und Nachrichtentechnik, wenn die bisher üblichen Verbindungstechniken angewendet werden E ollen.When connecting electrical components and lines, the entire electrotechnical area in addition to mechanical strength low and constant transition resistance over time is required. The posed Technical conditions are met by material connections, however such connections are usually too expensive. In contrast, there are force-fit and form-fit electrical connections through screws, crimps, wraps, clamps, etc. with Less overhead, but they are in a number of use cases technically unsatisfactory because the contact resistance of the connection is temporal Is subject to change. Especially in the case of frictional connections with non-copper ones Metal parts can have a negative impact on corrosion. So insist for example, concerns about the use of aluminum as a conductor material in the Installation and communication technology, if the connection technology used up to now E olls are used.

für die Isolierung elektrischer Zweiter von Bernmelde- oder Starkstromkabeln sowie zur Herstellung selbstdichtender Kabelmäntel für derartige Kabel ist es bekannt, mikroverkapselte Reaktionskomponenten zu verwenden, die nach der Zerstörung der Mikrokapseln miteinander reagieren, beispielsweise aushärten oder aufschäumen (DT-OS 1 590 957, D2-OS 1 590 958).for the insulation of electrical second from Bern signal or power cables as well as for the production of self-sealing cable sheaths for such cables, it is known To use microencapsulated reaction components, which after the destruction of the Microcapsules react with one another, for example harden or foam (DT-OS 1 590 957, D2-OS 1 590 958).

Der Erfindung liegt die Aufgabe zugrunde, Kontaktteile für eine kraft- oder formschlüssige elektrisch leitende Verbindung derart auszugestalten, daß die mit einem derartigen Kontaktteil hergestellte Verbindung ein günstigeres Verhalten des Übergangs-.fiderstandes zeigt. Zur Lösung dieser Aufgabe ist vorgesehen, daß die Oberfläche des Kontaktteiles mit IIikrokapseln bedeckt ist, die einen leitfähigen Kleber enthalten.The invention is based on the object of providing contact parts for a force or such a form-fitting electrically conductive connection to design that the connection made with such a contact part is a cheaper one Shows behavior of the transition resistance. To solve this task it is intended that the surface of the contact part is covered with microcapsules that are conductive Glue included.

Bei Verwendung derartiger Kontaktteile zerplatzen die Mikrokapseln beim Zusammenfügen der Bauteile, wobei der Kleber in die Zwischenräume zwischen den Kontaktflächen eindringt. Mit Hilfe des elektrisch leitenden Klebers werden dabei der anfängliche Übergangswiderstand der Verbindungsstelle verkleinert, da sich eine größere Berührungsfläche der Kontaktteile ergibt. Weiterhin werden die Berührungszonen der Verbindungsstelle gegen korrodierende Gase und Plüssigkeiten weitgehend abgedichtet, so daß die zeitliche Änderung des Übergangswiderstandes durch atmosphärische Einflüsse verringert wird. Zusätzlich wird die mechanische Festigkeit der Verbindungsstelle durch Verkleben der Kontaktteile erhöht.When using such contact parts, the microcapsules burst when assembling the components, with the adhesive in the spaces between penetrates the contact surfaces. Be with the help of the electrically conductive adhesive the initial contact resistance of the connection point is reduced because there is a larger contact area of the contact parts. Furthermore, the Contact zones of the connection point against corrosive gases and fluids largely sealed, so that the change in contact resistance over time is reduced by atmospheric influences. In addition, the mechanical Strength of the connection point increased by gluing the contact parts.

Mit Vorteil werden im Rahmen der Erfindung Mehr-Komponenten-Kleher verwendet, wobei die Komponenten des Klebers getrennt in den Mikrokapseln angeordnet sind. Vorzugsweise wird ein Zwei-Komponenten-Eleber verwendet, wobei man derart vorgehen kann, daß das eine Kontaktteil mit der einen Komponente des Klebers und das andere Kontaktteil mit der anderen Komponente des Klebers beschichtet ist.In the context of the invention, multi-component adhesives are advantageous used, with the components of the adhesive arranged separately in the microcapsules are. Preferably, a two-component Eleber is used, with one such can proceed that a contact part with one component of the adhesive and the other contact part is coated with the other component of the adhesive.

Um die elektrisch leitende Eigenschaft des Klebers sicherzustellen, ist dieser bzw. sind die Komponenten des Klebers mit einem elektrisch gut leitenden Metallpulver vermischt.To ensure the electrically conductive properties of the adhesive, is this or are the components of the adhesive with a good electrical conductivity Metal powder mixed together.

Die Haftung der Mikrokapseln auf den Kontaktteilen kann durch selbsthaftende Eigenschaften der Mikrokapseln oder auch mittels einer filmartigen Klebeschicht sichergestellt sein.The adhesion of the microcapsules to the contact parts can be achieved by self-adhesive Properties of the microcapsules or by means of a film-like adhesive layer be assured.

Durch die im Rahmen der Erfindung vorgesehene 3edeckung der Kontaktteile mit einem Mikroverkapselten Kleber kann der iNinsatzbereich vieler Verbindungstechniken erweitert und die Qualität der Verbindungen verbessert werden. Beispielsweise können unterlegscheiben, Kabelschuhe und Anschlußhülsen mit einem mikroverkapselten, elektrisch leitenden Kleber beschichtet werden. In der Nachrichtentechnik kann die Verwendung eines mikroverkapselten Klebers bei Schirmverhindungen, bei A-derverbindimgshblsen wie beispiels reise bei sogenann-ten U-Verbindern und auch bei anderen Aderverbindungen eingesetzt werden. Weiterhin wird der Einsatz von Aluminium als Leitermaterial für Nachrichtenkabeladern sowie für Installationsleitungen bei Verwendung eines mikroverkapselten leitfähigen Klebers im Bereich der Kontaktstellen problemloser.Through the coverage of the contact parts provided in the context of the invention A microencapsulated adhesive can be used for many connection techniques expanded and the quality of the connections improved. For example, can washers, cable lugs and connecting sleeves with a microencapsulated, electrical conductive adhesive can be coated. In communications engineering, the use of a microencapsulated adhesive for shielding, for connecting tubes such as travel with so-called U-connectors and also with other wire connections can be used. Furthermore, the use of aluminum as a conductor material for Communication cable cores as well as for installation lines when using a microencapsulated conductive adhesive in the area of the contact points more easily.

Im 3ereich der Nachrichtont echnik ist es bei der Verdrahtung von Geräten und Anlagen üblich, die sogenannte "Wire-Wrap-Technik" anzuwenden, die bisher nur für abisolierte Drähte benutzt wird.In the field of messaging technology, it is the wiring of Devices and systems common to use the so-called "wire-wrap technology", which so far is only used for stripped wires.

Durch 3eschichtung der Wickelstifte mit einem mikroverkapselten elektrisch leitenden Kleber kann diese Technik auch für isolierte Drähte angewendet werden, weil der Zweiter kraft- und formschlüssig auf dem Wickelstift gehalten wird, wodurch die mechanische Spannung zwischen wickelstift und Zweiter aufrechterhalten bleibt.By layering the winding pins with a micro-encapsulated electrical conductive glue, this technique can also be used for insulated wires, because the second is held positively and non-positively on the winding pin, whereby the mechanical tension between the winding pin and the second is maintained.

izeben der Verbesserung der Kontakteigenschaften herkömmlicher Verbindungstechniken sind durch die Verwendung eines mikroverkapselten elektrisch leitenden Klebers auch Verbindungen zwischen Leitern ohne zusätzliche Metallteile maglich. Beispielsweise kann man in einen Isolierkörper eine Vertiefung mit einer bestimmten Menge des mikroverkapselten leitenden Klebers ausfüllen. Für den Verbindungsvorgang werden die isolierten oder abisolierten Leiter in die Vertiefung gepreßt, wobei die evtl. vorhandene Isolierung abgeschert wird. Die Leiter zerquetschen und mischen die Mikrokapseln mit den Kleberkomponenten. Unmittelbar nach dem Einpressen der Leiter werden diese durch Klemmung in der Vertiefung des Isolierkörpers gehalten. Später, nach Aushärtung des leitenden Klebers, sind die Leiter auch zusätzlich formschlüssig verankert.In addition to improving the contact properties of conventional connection techniques are through the use of a microencapsulated electrically conductive adhesive too Connections between conductors without additional metal parts possible. For example you can make a recess with a certain amount of the microencapsulated in an insulating body Fill in conductive adhesive. For the connection process, the isolated or The stripped conductor is pressed into the recess, removing any insulation that may be present is sheared off. The conductors crush and mix the microcapsules with the adhesive components. Immediately after the conductors are pressed in, they are clamped in the recess of the insulator held. Later, after the conductive adhesive has hardened, are the ladder is also anchored in a form-fitting manner.

Eine weitore Anwendung der nouen Kontaktteile besteht beim Anschlagen von mansiven Leitern oder Litzen an Anschlußhülsen, wobei es vorteilhaft ist, die Innenoberfläche der Anschlußhülse mit dem mikroverkapselten, leitfähigen Kleber zu beschichten.Another application of the new contact parts is when hitting of mansive conductors or litz wires to connecting sleeves, it being advantageous to use the Inner surface of the connecting sleeve with the microencapsulated, conductive adhesive to coat.

5 Ansprüche ohne Figur5 claims without a figure

Claims (5)

Schutzansprüche 1. Kontaktteil für eine kraft- oder formschlüssige, elektrisch leitende Verbindung, dadurch ge-ennzeichnet, daß die Oberfläche des Kontaktteiles mit Mikrokapseln bedeckt ist, die eihen leitfähigen Kleber enthalten. Protection claims 1. Contact part for a force-fitting or form-fitting, electrically conductive connection, characterized in that the surface of the contact part is covered with microcapsules containing a conductive adhesive. 2. Kontaktteil nach Anspruch 1, dadurch gelLernzeichnet, daß die Mikrokapsoln jeweils eine Komponente eines Mehr-Komponenten-Klebers enthalten. 2. Contact part according to claim 1, characterized in that the Microcapsols each contain one component of a multi-component adhesive. 3. kontaktteil nach Anspruch 2, dadurch gekennzeichnet, daß die Mikrokapseln nur die eine Komponente eines Zwei-Komponenten-Klebers enthalten. 3. contact part according to claim 2, characterized in that the microcapsules only contain one component of a two-component adhesive. 4. Kontaktteil nach Anspruch 2 oder 3, dadurch gekennzeichnet, daßder Kleber oder die Komponente des Klebers mit einen elektrisch gut leitenden Metallpulver vermischt sind. 4. Contact part according to claim 2 or 3, characterized in that the Glue or the component of the glue with an electrically conductive metal powder are mixed. 5. Kontaktteil nach einen der Ansprüche 1 bis 4, dadurch gekennzeichnet, daß die Mikrokapseln mittels einer filmartigen Klebeschicht auf der Oberfläche des Kontaktteiles haften. 5. Contact part according to one of claims 1 to 4, characterized in that that the microcapsules by means of a film-like adhesive layer on the surface of the The contact part.
DE19752543109 1975-09-25 1975-09-25 Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components Pending DE2543109A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19752543109 DE2543109A1 (en) 1975-09-25 1975-09-25 Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752543109 DE2543109A1 (en) 1975-09-25 1975-09-25 Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components

Publications (1)

Publication Number Publication Date
DE2543109A1 true DE2543109A1 (en) 1977-04-07

Family

ID=5957587

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752543109 Pending DE2543109A1 (en) 1975-09-25 1975-09-25 Electric connector with contact coating with microcapsules - can be broken to release conductive adhesive components

Country Status (1)

Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334809A (en) * 1990-02-14 1994-08-02 Particle Interconnect, Inc. Particle enhanced joining of metal surfaces

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5334809A (en) * 1990-02-14 1994-08-02 Particle Interconnect, Inc. Particle enhanced joining of metal surfaces
US5835359A (en) * 1990-02-14 1998-11-10 Particle Interconnect Corporation Electrical interconnect using particle enhanced joining of metal surfaces

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