DE2540186A1 - Solderless connection to frame of circuit boards - using spring sheet rolled up at all four sides for insertion into housing - Google Patents

Solderless connection to frame of circuit boards - using spring sheet rolled up at all four sides for insertion into housing

Info

Publication number
DE2540186A1
DE2540186A1 DE19752540186 DE2540186A DE2540186A1 DE 2540186 A1 DE2540186 A1 DE 2540186A1 DE 19752540186 DE19752540186 DE 19752540186 DE 2540186 A DE2540186 A DE 2540186A DE 2540186 A1 DE2540186 A1 DE 2540186A1
Authority
DE
Germany
Prior art keywords
frame
housing
plate
rolled
sides
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19752540186
Other languages
German (de)
Other versions
DE2540186C2 (en
Inventor
Manfred Ing Grad Reiss
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Telecom GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19752540186 priority Critical patent/DE2540186C2/en
Publication of DE2540186A1 publication Critical patent/DE2540186A1/en
Application granted granted Critical
Publication of DE2540186C2 publication Critical patent/DE2540186C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
    • H01R4/64—Connections between or with conductive parts having primarily a non-electric function, e.g. frame, casing, rail
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/12—Resilient or clamping means for holding component to structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The solderless connection to a frame of supporting plates with electronic circuits for insertion in a housing is realised by using a spring sheet (6) rolled up at all four sides and bent away from the supporting plate (2). A wedge-like projection (8a) on the frame's (8) inner side presses on the rolled edge (6a) of the springy plate (6). It is pressed, in turn, by a screwed-on cover so that plate (6) is pressed to the earth coating (2)a) of the plate (2). At the same time the rolled edges (6a) are pressed to the housing frame (1a) walls.

Description

Lötfreie Nasseverbindung für elektrische Schaltungen aufSolderless wet connection for electrical circuits

Trägerplatten Die vorliegende Erfindung befaßt sich mit einer Anordnung für eine lötfreie Masseverbindung von Trägerplatten mit elektronischen Schaltungen zur Aufnahme in einem Gehäuse. Carrier Plates The present invention is concerned with an assembly for a solderless ground connection of carrier plates with electronic circuits for inclusion in a housing.

Besonders in der Hochfrequenztechnik werden zunehmend beschichtete Basismaterialien zur Realisierung elektronischer Schaltungen verwendet. Wichtig ist bei solchen Schaltungen, daß die Massekontaktierung von der Schaltung zum Gehäuse und den dort befindlichen HF-Anschlüssen kurz und eindeutig ist. Bei Basismaterialien, die sich leicht bohren lassen, läßt sich dies z.B. durch Schraubverbindungen erreichen. Bei harten Basismaterialien werden meist Masse-Verbindungen durch Einlöten der Schaltung in das Gehäuse erzielt. Beide Möglichkeiten sind aufwendig, ein Ausfechsein der Schaltung ist im letztgenannten Fall sehr schlvierig.Coated ones are increasingly being used, especially in high-frequency technology Base materials used for the realization of electronic circuits. Important is in such circuits that the ground contact from the circuit to the housing and the HF connections located there are short and clear. For base materials, that can be easily drilled, this can be achieved, for example, by screw connections. In the case of hard base materials, ground connections are usually made by soldering in the circuit in the housing achieved. Both options are costly, one Fitching out the circuit is very difficult in the latter case.

Die Erfindung hat sich die Aufgabe gestellt, eine Massekontaktierung für Schaltungen auf kaschiertem Basismaterial (Trägerplatte) zu schaffen, die einfach in der Herstellung, lötfrei ist und eine sichere Masseverbindung der Trägerpiatte mit dem Gehäuse gewährleistet.The object of the invention is to provide a ground contact for circuits on a laminated base material (carrier plate) to create the simple in the production, is solder-free and a secure ground connection of the carrier plate guaranteed with the housing.

Erfindungsgemäß wird diese Aufgabe dadurch gelöst, daß ein an seinen vier Kanten nach oben eingerollt es und gegen die Trägerplatte abgewinkeltes Federblech durch einen gegen die Rundung des gerollten Federbleches gerichteten, keilförmigen Ansatz an der Innenseite des Druckrahmew den aufschraubbaren Boden auf die Massekaschierung der Trägerplatte preßt und gleichzeitig mit seinen eingerollten Au3enflächen des Federbleches an die Wände des Gehäuserahmer.s drückt, wobei der Druckrahmen und der Boden miteinander verbunden sein können.According to the invention this object is achieved in that a at his It is rolled up four edges and angled spring plate against the carrier plate by a wedge-shaped one directed against the curve of the rolled spring plate Approach on the inside of the pressure frame w the screw-on base on the mass lamination the carrier plate presses and at the same time with its rolled-up outer surfaces of the Spring plate presses against the walls of the housing frame, whereby the pressure frame and the floor can be connected to each other.

Diese Ausführungsform zur Masseverbindung einer Trägerplatte mit ihrem Gehäuse ist einfach in ihrer Herstellung, hat den Vorteil in einer einfachen Anordnung in dem Gehäuse und gewährleistet eine sichere elektrische Kontaktgabe rundum. Ein eventuelles Auswechseln der Trägerplatte ist problemlos.This embodiment for the ground connection of a carrier plate with her Housing is simple to manufacture, has the advantage of simple arrangement in the housing and ensures safe electrical contact all around. A it is easy to change the carrier plate if necessary.

Anhand der Zeichnung soll die Erfindung an einem Austiahrungsbeispiel näher beschrieben werden.Using the drawing, the invention is intended to be based on an exemplary embodiment are described in more detail.

Die Fig. 1 zeigt den Schnitt durch ein Gehäuse mit Trägerplatte und Federblech, die Fig. 2 einen Ausschnitt des Federbleches an seiner Ecke in Draufsicht.Fig. 1 shows the section through a housing with support plate and Spring plate, FIG. 2 shows a section of the spring plate at its corner in a plan view.

In dem Gehäuse 1, bestehend aus Rahmen ia, Boden ib und Deckel Ic, befindet sich eine beschichtete Trägerplatte 2.In the housing 1, consisting of frame ia, base ib and cover Ic, there is a coated carrier plate 2.

Der Boden ib ist mit Schrauben 3 mit dem Rahmen verschraubt.The bottom ib is screwed to the frame with screws 3.

Der Deckel ic wird ebenfalls mit dem Rahmen verschraubt.The cover ic is also screwed to the frame.

Der Rahmen hat innen eine umlaufende Kante 51 die als Xrschlagfläche für die Trägerplatte 2 dient. Ein Federblech 6, das entsprechend der Trägerplatte eine quadratische oder rechteckige Form im Zuschnitt hat, wird an allen Außeiflächen 6a eingerollt. Das an den Ecken 6b eingescnnittenæ Federblech (vgl. den Ausschnitt einer Federblechecke in Fig. 2) hat Außenmaße, die geringfügig größer sind als die Öffnung 7 im Rahmen la, die zur Aufnahme der Trdgerplatte 2 mit elektronischen Schaltungen dient. Das Federblech 6 wird in der gezeichneten Weise auf die in den Rahmen ia eingelegte Trägerplatte 2, deren Massekaschierung 2a dem Federblech 6 zugewandt ist, gelegt. Über einen Druckrahmen 8 wird das Federblech 6 beim Aufschrauben des Bodens ib an die Massekaschierung 2a der Trägerplatte 2 angepreßt. Durch den keilförmigen, gegen die Rundung 6a des gerollten rederbleches 6 gerichteten Ansatz 8a an der Innenseite des Druckrahmens 8 werden dabei die eingerollten Außenfläc#en 6a des Federbleches 6 an die Wände des Rahmens gedrüclst. Dadurch wird ein definierter und kurzer Kontakt von der Massekaschierung 2a der Trägerplatte 2 über das Federblech 6 zum Rahmen la erreicht. Druckrahmen 8 und Boden 1b können auch aus einem Teil bestehen.The frame has a circumferential edge 51 on the inside, which acts as a striking surface for the carrier plate 2 is used. A spring plate 6, which corresponds to the carrier plate has a square or rectangular shape in the cut, is used on all external surfaces 6a rolled up. The spring plate cut into the corners 6b (cf. a spring steel sheet in Fig. 2) has external dimensions that are slightly larger than the Opening 7 in the frame la, which is for receiving the carrier plate 2 with electronic circuits serves. The spring plate 6 is in the manner shown on the in the frame ia inserted carrier plate 2, the earth lamination 2a of which faces the spring plate 6 is laid. About a pressure frame 8, the spring plate 6 is screwed on the Bottom ib pressed against the mass lamination 2a of the carrier plate 2. By the wedge-shaped approach directed against the rounding 6a of the rolled rederbleches 6 8a on the inside of the printing frame 8 are the rolled-up outer surfaces 6a of the spring plate 6 pressed against the walls of the frame. This creates a more defined and short contact from the ground lamination 2a of the carrier plate 2 via the spring plate 6 reached to frame la. Printing frame 8 and base 1b can also be made from one part exist.

LeerseiteBlank page

Claims (2)

P a t e n t a n 5 p r ü c h e 1. Anordnung für lötfreie Masseverbindung von Trägerplatten mit elektronischen Schaltungen zurAufnahme in einem Gehause, dadurch gekennzeichnet, daß ein an seinen vier Kanten nach oben eingerolltes und gegen die Trägerplatte (2) abgewinkeltes Federblech (6) durch einen gegen die Rundung (6a) des gerollten Federbleches (6) gerichteten, keilförmigen Ansatz (8a) an der Innenseite des Druckrahmens (8) den aufschraubbaren Boden (1b) auf die Massekaschierung (2a) der Trägerplatte (2) preßt und gleichzeitig mit seinen eingerollten Außenflächen (6a) des Federbleches (6) an die Wände des Gehäuserahmens (la) drückt. P a t e n t a n 5 p r ü c h e 1. Arrangement for solderless ground connection of carrier plates with electronic circuits for inclusion in a housing, thereby characterized in that a rolled up at its four edges and against the Carrying plate (2) angled spring plate (6) through one against the curve (6a) of the rolled spring plate (6) directed, wedge-shaped extension (8a) on the inside of the pressure frame (8) the screw-on base (1b) onto the earth lining (2a) the carrier plate (2) presses and at the same time with its rolled-up outer surfaces (6a) of the spring plate (6) presses against the walls of the housing frame (la). 2. Anordnung nach Anspruch 1, dadurch gekennzeichnet, daß der Druckrahmen (8) und der Boden (1b) miteinander xerbunden sind.2. Arrangement according to claim 1, characterized in that the printing frame (8) and the bottom (1b) are xerbunden to one another.
DE19752540186 1975-09-10 1975-09-10 Arrangement for contacting the ground plane of a carrier plate for electronic circuits Expired DE2540186C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19752540186 DE2540186C2 (en) 1975-09-10 1975-09-10 Arrangement for contacting the ground plane of a carrier plate for electronic circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19752540186 DE2540186C2 (en) 1975-09-10 1975-09-10 Arrangement for contacting the ground plane of a carrier plate for electronic circuits

Publications (2)

Publication Number Publication Date
DE2540186A1 true DE2540186A1 (en) 1977-03-24
DE2540186C2 DE2540186C2 (en) 1985-03-28

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
DE19752540186 Expired DE2540186C2 (en) 1975-09-10 1975-09-10 Arrangement for contacting the ground plane of a carrier plate for electronic circuits

Country Status (1)

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DE (1) DE2540186C2 (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2849418A1 (en) * 1977-11-14 1979-05-31 Amp Inc ELECTRICAL CONNECTOR FOR CONNECTING AN ELECTRONIC ASSEMBLY TO A SUPPORT
US4164003A (en) * 1976-12-27 1979-08-07 Cutchaw John M Integrated circuit package and connector therefor
EP0199007A2 (en) * 1985-04-23 1986-10-29 Bodenseewerk Gerätetechnik GmbH Circuit board arrangement for high accelerations
US4983840A (en) * 1989-04-28 1991-01-08 Commissariat A L'energie Atomique Measuring system constituted by a radiation detection circuit, a reading circuit and a support such as a cryostat cold finger
DE4036081A1 (en) * 1990-04-26 1991-11-07 Mitsubishi Electric Corp PORTABLE SEMICONDUCTOR STORAGE DEVICE
DE3790062C2 (en) * 1986-02-06 1992-01-23 Fujitsu Ltd., Kawasaki, Kanagawa, Jp
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
EP0393338B1 (en) * 1989-04-15 1994-06-08 ANT Nachrichtentechnik GmbH Device for contacting a planar microwave circuit in a waveguide or a housing
DE10161104C1 (en) * 2001-12-12 2003-07-10 Knorr Bremse Systeme Electrical control device and manufacturing process
DE102007013695A1 (en) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Arrangement of electronic construction unit for use in housing made of plastic, has cover and lower part, where cover is connected with lower part, and cover exercises predetermined force after assembly on electronic construction unit

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4302205C3 (en) * 1993-01-27 2002-11-07 Fujitsu Siemens Computers Gmbh Device for reducing the interference radiation of electrical printed circuit boards

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1931228A1 (en) * 1968-07-22 1970-01-22 Siemens Ag Microwave component
DE2258557A1 (en) * 1972-11-30 1974-06-12 Licentia Gmbh ARRANGEMENT TO ACHIEVE A LOET-FREE GROUND CONTACT
DE2259577A1 (en) * 1972-12-06 1974-06-12 Licentia Gmbh CONTACT SPRING ARRANGEMENT FOR GROUND CONTACT WITH CARRIERS FOR ELECTRONIC CIRCUITS
DE2448286A1 (en) * 1973-10-17 1975-04-24 Philips Nv MICROWAVE ARRANGEMENT IN MICROSTRIP DESIGN

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1931228A1 (en) * 1968-07-22 1970-01-22 Siemens Ag Microwave component
DE2258557A1 (en) * 1972-11-30 1974-06-12 Licentia Gmbh ARRANGEMENT TO ACHIEVE A LOET-FREE GROUND CONTACT
DE2259577A1 (en) * 1972-12-06 1974-06-12 Licentia Gmbh CONTACT SPRING ARRANGEMENT FOR GROUND CONTACT WITH CARRIERS FOR ELECTRONIC CIRCUITS
DE2448286A1 (en) * 1973-10-17 1975-04-24 Philips Nv MICROWAVE ARRANGEMENT IN MICROSTRIP DESIGN

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4164003A (en) * 1976-12-27 1979-08-07 Cutchaw John M Integrated circuit package and connector therefor
DE2849418A1 (en) * 1977-11-14 1979-05-31 Amp Inc ELECTRICAL CONNECTOR FOR CONNECTING AN ELECTRONIC ASSEMBLY TO A SUPPORT
EP0199007A2 (en) * 1985-04-23 1986-10-29 Bodenseewerk Gerätetechnik GmbH Circuit board arrangement for high accelerations
EP0199007A3 (en) * 1985-04-23 1988-07-27 Bodenseewerk Gerätetechnik GmbH Circuit board arrangement for high accelerations
DE3790062C2 (en) * 1986-02-06 1992-01-23 Fujitsu Ltd., Kawasaki, Kanagawa, Jp
EP0393338B1 (en) * 1989-04-15 1994-06-08 ANT Nachrichtentechnik GmbH Device for contacting a planar microwave circuit in a waveguide or a housing
US4983840A (en) * 1989-04-28 1991-01-08 Commissariat A L'energie Atomique Measuring system constituted by a radiation detection circuit, a reading circuit and a support such as a cryostat cold finger
DE4036081A1 (en) * 1990-04-26 1991-11-07 Mitsubishi Electric Corp PORTABLE SEMICONDUCTOR STORAGE DEVICE
US5189638A (en) * 1990-04-26 1993-02-23 Mitsubishi Denki Kabushiki Kaisha Portable semiconductor memory device
DE10161104C1 (en) * 2001-12-12 2003-07-10 Knorr Bremse Systeme Electrical control device and manufacturing process
DE102007013695A1 (en) * 2007-03-19 2008-09-25 Conti Temic Microelectronic Gmbh Arrangement of electronic construction unit for use in housing made of plastic, has cover and lower part, where cover is connected with lower part, and cover exercises predetermined force after assembly on electronic construction unit

Also Published As

Publication number Publication date
DE2540186C2 (en) 1985-03-28

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Owner name: AEG-TELEFUNKEN NACHRICHTENTECHNIK GMBH, 7150 BACKN

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Owner name: ANT NACHRICHTENTECHNIK GMBH, 7150 BACKNANG, DE

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