DE2423431C2 - Glow element for electric cigar lighter - Google Patents

Description

3. glow element according to one of claims 1 and 2, characterized in that da3 the contacting surfaces (5, 7) are applied to the semiconductor wafer (1) by flame spraying and are made of temperature-resistant, Scaling-free material, e.g. B. Nickel steel.

4. glow element according to one of claims 1 to 3, characterized in that the one Koniaktierungsfläche (7) runs in a ring around the outer edge of the semiconductor wafer (1) and is welded with a elastic power supply lug (3) is provided.

5. glow element according to one of claims 1 to 4, characterized in that the second contacting surface (5) is arranged in a recess (6) in the middle of the semiconductor wafer (1) and for Welding on a threaded bolt (2) is used to hold the disc (1) and to supply power.

6. glow element according to one of claims 1 to 5, characterized in that the threaded bolt (2) on its with the contacting surface (5) of the Semiconductor wafer (I) welded end to a flange (4) for placing the semiconductor wafer (1) surrounding protective cup.

7. glow element according to one of claims 1 to 6, characterized in that the protective cup (10) between insulating washers (15, 17), the flange (4) and a nut (18) on the threaded bolt (2) is clamped (Fig. 4).

8. glow element according to one of claims 1 to 7, characterized in that in the protective cup (10) a slot (20) for fastening the power supply lug (3) is provided.

9. glow element according to one of claims 1 to 8, characterized in that the semiconductor wafer a raised, reinforced edge zone (25) for resting on a between the flange (28) of the Has threaded bolt (2) and a nut (27) clamped washer (26) (Fig. 9).

10. glow element according to one of claims t to

9, characterized in that the semiconductor wafer (1) is circular (Fig. 1 to 10), square (F i g. 11 and 12), oval or some other shape.

11. glow element according to one of claims 1 to

10, characterized in that (1) a bracket (30, 40) is soldered or welded, which is used on the medium contacting surface (5) of the semiconductor wafer as a contact spring and engages in a to blind hole (31) of the threaded bolt (2) (Figure . 13 to 17).

12. glow element according to one of claims 1 to 10, characterized in that on the middle contacting surface (5) of the semiconductor wafer (1) a helical compression spring (41) is attached or soldered or welded on, which as Pressure contact is used and is in a blind hole (31)

of the threaded bolt (2) (F. g 18 and 19 *

13 glow element according to claim 1 or 12, characterized in that the semiconductor disc be (D bearing end of the threaded bolt (2) as a hollow rivet (32) to hold the insulating and underlay (15 17 and 34) is formed (Fig. 13 and

¹⁸ 14 glow element according to one of claims 1 to 10, characterized in that a claw (42) provided with angled SSS 43) is soldered or welded onto the middle contacting surface (5). into which a flange (45) located on the threaded bolt {2, is inserted (FIGS. 20 and 21). .

15 glow element according to one of claims 1 to 14 characterized in that the Halble.ter- "■ Heibe (D having a contact ring (36) on its raised face (35) on which a pf with Ξ Schutzna ^e (10) connected Cont .ky-.ng (38) is soldered or welded on (Fig. 13, 18 and 20).

With cigar or cigarette lighter !! in the Motor vehicles are installed, glow elements are used, which are fed by the car battery. These elements consist of a sheet metal bowl in which a heating conductor strip is housed in a spiral shape. The the outermost end of the heating conductor is welded to the bowl, jammed or riveted. In the middle of the bowl, the other end is on a pin or a pin Electrically connected threaded bolt This pin or threaded bolt is centrally insulated in the cup

^ Die'ciühelemente are preferably made of one Material made with a rectangular cross-section and wound in a spiral. However, there are also versions in which a spiral made of round He.zle.termaferial is inserted into the bowl in a spiral shape. This Xelements all have the disadvantage that the Shock-like load on the heating conductor * when switching off of the cigar lighter, individual turns of the spiral can emerge from the winding plane and this creates short circuits that destroy the heating conductor winding.

Through various measures, such as. B. by profiling the heating conductor for mechanical interlocking of the windings or by attaching a damping washer to the plug of the lighter to get the This disadvantage should be eliminated to render the bounce harmless. Temperature-resistant ones also have the same purpose Glazes or ceramic pastes into which the Heating conductors are embedded.

To prevent short turns between the individual turns of the spiral were made early. Mica insulation used. At present, special oxidation processes are used on the surface. An electrically insulating oxide layer is applied to the heating conductor. These glow elements continue to have the Disadvantage that one that is bent inwards is deformed. Bimetal spring of the socket with the upper end fell between the heating conductor windings or between The heating conductor winding and the edge of the bowl get caught and can occur due to overheating of the lighter When using wound heating conductors, there is also the disadvantage of the unequal Temperaturver

division with particularly low temperatures in the middle of the glow spiral.

The object of the invention is therefore to avoid the disadvantages mentioned and to create a glow element, which is insensitive to impacts and has a high level of operational safety. This is done according to the Invention achieved in an advantageous manner that the glow element from a disk-shaped, pressed or sintered semiconductor with Koniakiierungsflächen is manufactured. This semiconductor can for example consist of silicon carbide. The contact surfaces can be flame sprayed onto the Semiconductor wafer are applied and made of temperature-resistant, non-scaling material such. B. Nikkeistahl, exist.

The glow element according to the invention does not have a winding made of resistance wire that protects against bouncing is sensitive and which can be destroyed by shorted turns. It is against tobacco particle pollution or tobacco ash is insensitive and therefore has a long lifespan. Because of its simple Design and assembly is an economical mass production possible.

An advantageous further development of the invention consists in that the one contacting surface is ring-shaped runs around the outer edge of the semiconductor wafer and with a welded, elastic power supply lug is provided. Another contact surface can be in a recess in the middle of the Be arranged semiconductor wafer and to weld a threaded bolt for holding the disk and serve for power supply. The threaded bolt can at its with the contacting surface of the semiconductor wafer The welded end has a flange for placing a protective cup surrounding the semiconductor wafer exhibit. The protective cup can be placed between two insulating washers, the flange and a nut on the The threaded bolt must be clamped. The disc-shaped incandescent body is complete with this holder attached without tension. A detrimental effect of the thermal stress becomes effective in this way avoided. Tension caused by the crimping process, temperature changes and use, cannot affect the sensitive pane because of the mechanical tension be absorbed by the support edge of the central connection screw and through the resilient Loop of the power supply lug can not affect. A slot for fastening can be made in the protective cup the power supply lug be provided. The current flows from the central threaded bolt radially to the outer, flame spray applied contact ring, creating a homogeneous glowing Area is achieved in the entire thin area of the disc-shaped incandescent body.

With a correspondingly reinforced edge zone or U-shaped cross-section, the protective cup for making contact can be dispensed with. Additional insulation between the glass and the ceramic heater is in the illustrated construction '· ο not necessary because by the semiconductor wafer is no direct contact is possible only by touch.

In addition to circular, the glow element can also have other geometric shapes, e.g. B. rectangular or square, be formed.

Instead of a rigid connection between the threaded bolt and the semiconductor wafer, a detachable connection can also be used Plug connection can be provided. In a related embodiment of the invention, on the middle contact surface of the semiconductor wafer a bracket soldered or welded on, the serves as a contact spring and is inserted into a blind hole of the threaded bolt. A further embodiment according to the invention has one on the middle one Contacting surface of the semiconductor wafer placed or soldered or welded on in a helical shape Compression spring, which serves as a pressure contact and is supported in a blind hole in the threaded bolt. The the end of the threaded bolt carrying the semiconductor wafer can be used as a hollow rivet for holding the insulating and Be formed stiffening disks. As a third embodiment for the detachable connector, the sees Invention on the middle contact surface provided with an angled tab claw that is soldered or welded and into which a flange located on the threaded bolt is inserted. The semiconductor wafer can have a contacting ring on its raised end face, onto which a Contact ring connected to the protective cup is soldered or welded on.

In the drawing, exemplary embodiments according to the invention are shown, namely shows

F i g. 1 shows a side view of a glow element in section,

F i g. 2 shows a side view of a protective cup in section,

F i g. 3 shows a plan view of the protective cup according to FIG. 2,

F i g. 4 shows a sectional side view of the glow element inserted in the protective cup;

F i g. 5 a plan view of the arrangement according to FIG. 4,

F i g. 6 to 8 different types of fastening of the power supply lug on the protective cup,

F i g. 9 shows a side view of a further embodiment of the glow element in section;

Fig. 10 is a plan view of the element according to Fig. 9,

F i g. 11 and 12 a section through and a plan view on a glow element of square shape,

13 shows a glow element with a clip in section,

F i g. 14 a plan view of the clip according to FIG. 13,

15 shows a section through the clip according to FIG. 13 along the line XV-XV in FIG. 14,

16 shows a further embodiment of the khmmer in the top view,

17 shows a section through the clip along the line XVII-XVII in FIG. 16.

18 shows a glow element with a helical compression spring in section,

F i g. 19 shows a plan view of the glow element according to FIG. 18,

F i g. 20 a glow element with a claw in section and

21 shows a plan view of the semiconductor wafer with a claw.

The glow element according to FIG. 1 consists of the semiconductor wafer 1, the threaded bolt 2 and the power supply lug 3. The threaded bolt 2 has a flange 4 with which the threaded bolt 2 is on a contacting surface 5, which are applied to the semiconductor wafer 1, for example, from an injection molding process Nickel layer is welded on. The contact area 5 is in the center of the semiconductor wafer 1 arranged in a recess 6. The ko-

tapered edge of the semiconductor wafer 1 is with ; provided in an annular contact layer 7, which was also sprayed onto the semiconductor wafer using the flame spraying process and onto which the power supply lug 3 is welded on.

To protect the semiconductor wafer 1 from damage, a Schulznapf 10 is provided (FIG. 2), the by means of the bore 11 and the insulating washer 15 provided with a bore 14 and the one with a bore 16 provided insulating washer 17 on the thread ic bolt 2 is placed. The insulating washer 15 lies against the flange 4 of the threaded bolt 2 this from Fig. 4 emerges. A nut 18 screwed onto the threaded bolt 2 holds the arrangement together. The edge of the cup 10 is still flanged and the power supply lug 3 with the cup 10 welded or jammed, as shown in FIG. 6 to 8 shows. The cup 10 has one for this purpose Slot 20.

In the embodiment according to FIG. 9 and 10, the cup 10 is omitted. Instead, the edge 25 is the semiconductor wafer 1 reinforced. This reinforced edge supports a washer 26, which by the nut 27 on the Flange 28 of threaded bolt 2 is held. The flange 28 is just as wide as the recess 6 of the semiconductor wafer 1 is deep, so that the wafer 26 does not apply any pressure to the semiconductor wafer 1 Tightening the nut 27 exerts.

Both in the embodiment according to FIG. 1 to 8, as well as in the embodiment according to FIGS. 9 and 10 or 11 and 12 is the semiconductor wafer 1 of the glow element Fastened completely free of tension, and tension caused by the flanging process, the temperature change and use can not affect the sensitive disc because the mechanical stresses are absorbed by the flange of the threaded bolt 2 and themselves through the resilient loop of the power supply lug 3 can not affect.

The semiconductor plates of the glow elements according to FIG. 1 to 10 have a circular shape. But they can also have another shape, for example one square shape, as shown in FIG. 11 and 12 show.

The middle contact area 5 of the semiconductor wafer 1 according to FIG. 13 is with one serving as a contact Clip 30 is provided, which can be soldered or welded on. The bracket 30 engages a blind hole 31 provided at the end of the bolt 2. The end of the bolt 2 is in the manner of a hollow rivet

32, the upper end of which becomes a flange

33 is turned over when the two insulating washers 15 and 17 holding the protective cup 10 and the washer 34 are put on. The end face 35 of the semiconductor wafer 1 has an annular contact surface 36, on which a contact ring 38 connected to the protective cup 10 by tabs 37 is soldered or welded on. In Fig. 14 and 15 is the clip 30 from FIG. 13 is shown in plan view and in section. In place of the two-legged Bracket 30 can also join an in-sight bracket 40 as shown in FIG. 16 and 17 in plan and in Section is shown.

In the embodiment according to FIG. 18 and 19 protrudes in the blind hole of the threaded bolt 2 is a screw-shaped attached to the central contact surface 5 Compression spring 41 as a contact element.

Another releasable connection between the semiconductor wafer 1 and threaded bolt 2 is shown in FIG. 20th and 21. Here, a claw 42 is placed on the middle contact surface 5, which is soldered on by means of tabs 43 or is welded on. A located at the end of the threaded bolt 2 is inserted into the opening 44 of the claw 42 The flange 45 is pushed in and then tightened by means of the nut 18, the washers 15. 17 and 34 as well as the protective cup 10 holding Rohrniei 46 serves as an abutment.

In addition 7 sheets of drawings

Claims (2)

Patent claims: 1. glow element for electric cigar lighter, characterized in that the glow element made of a disc-shaped, pressed or sintered semiconductor (1) with contacting surfaces (5,7) exists. 2. glow element according to claim 1, characterized in that that it is made from silicon carbide