DE2334210A1 - Power transistor heat sink - has blind hole in metal block and insulated lead-through for transistor leads in hole bottom - Google Patents

Power transistor heat sink - has blind hole in metal block and insulated lead-through for transistor leads in hole bottom

Info

Publication number
DE2334210A1
DE2334210A1 DE19732334210 DE2334210A DE2334210A1 DE 2334210 A1 DE2334210 A1 DE 2334210A1 DE 19732334210 DE19732334210 DE 19732334210 DE 2334210 A DE2334210 A DE 2334210A DE 2334210 A1 DE2334210 A1 DE 2334210A1
Authority
DE
Germany
Prior art keywords
transistor
heat sink
metal block
blind hole
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19732334210
Other languages
German (de)
Other versions
DE2334210C2 (en
Inventor
Wolfram Dipl Ing Geidel
Manfred Schlitschus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bosch Telecom GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19732334210 priority Critical patent/DE2334210C2/en
Publication of DE2334210A1 publication Critical patent/DE2334210A1/en
Application granted granted Critical
Publication of DE2334210C2 publication Critical patent/DE2334210C2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The power transistor has a great high frequency density, and the heat sink consists of a metal block, retaining the transistor in a blind bore with holes in the bore bottom for insulating passage of the transistor lead wires. The transistor housing is covered top and bottom with heat conductive, insulating discs, and is pressed against the bore bottom by a threaded bolt, between which and the upper heat conductive insulating disc is mounted a spring of material with good heat conductivity.

Description

Licentia Patent-VerwaltungenGmbH PT-BK/Thn/joLicentia Patent-VerwaltungsGmbH PT-BK / Thn / jo

BK 72/99BK 72/99

Kühlkörper für Transistoren hoher LeistungHeat sink for high power transistors

Die vorliegende Erfindung befasst sich mit einem Kühlkörper für Transistoren hoher Leistung mit grosser Hochfrequenzdichtigkeit, bestehend aus einem Metallblock, in dem der Transistor angeordnet ist.The present invention is concerned with a heat sink for high-performance transistors with high high-frequency impermeability, consisting of a metal block in which the transistor is arranged.

Die Verwendung von Transistoren bei sehr hohen Frequenzen stösst besonders dann auf erhöhte Schwierigkeiten, wenn es sich um grosse Leistungen handelt. Diese Schwierigkeiten bestehen darin, die durch die Verlustleistung entstehende Wärme von den in ihren Abmessungen verhältnismässig klein gehaltenen Transistorgehäusen abzuführen.The use of transistors at very high frequencies runs into increased difficulty especially when it are great achievements. These difficulties consist in dissipating the heat generated by the power loss from the transistor housings, which are kept relatively small in terms of their dimensions.

Man ist da schon verschiedene Wege gegangen und hat zur Kühlung um das Transistorgehäuee herum einen sternförmigen Kühl· körper mit Kühlrippen gelegt. Solche Kühlsterne haben denYou have already gone different ways and have a star-shaped cooling system for cooling around the transistor housing. body laid with cooling fins. Such cooling stars have the

409884/0758409884/0758

Nachteil, dass die Kühllamellen wie verkürzte Dipole -wirken und bevorzugt Oberwellen abstrahlen·Disadvantage that the cooling fins act like shortened dipoles and preferentially emit harmonics

Ein weiterer Nachteil solcher Kühlsterne besteht in dem zu geringen Wärmeübergang von dem Transistor gehäuse auf den Kühlstern selbst, was einer Minderung der Ausnutzung des Transistors gleichkommt.Another disadvantage of such cooling stars is the insufficient heat transfer from the transistor to the housing Cooling star itself, which equates to a reduction in the utilization of the transistor.

Auch Kühlschellen und verschiedene Kühlkörper sind vorgeschlagen worden, deren Nachteile darin bestehen, dass sie die Warme nicht ausreichend abführen können und auch für sehr hohe Frequenzen nicht mehr verwendbar sind.Cooling clips and various heat sinks have also been proposed, the disadvantages of which are that they cannot dissipate the heat sufficiently and can no longer be used for very high frequencies either.

Die Aufgabenstellung lautet, einen Kühlkörper für Leistungstransistoren zu schaffen, der eine maximale Wärmeabgabe ermöglicht und auch für sehr hohe Frequenzen eine grosse Dichtigkeit hat und in dem der Transistor elektrisch isoliert gehalten ist.The task is to create a heat sink for power transistors, which allows a maximum heat dissipation and also has a high level of tightness for very high frequencies and in which the transistor is electrically insulated is held.

Erfindungsgemäss wird diese Aufgabe dadurch gelöst, dass der Kühlkörper ein Sackloch ha£, in dem der Transistor angeordnet ist, dessen Anschlussdrähte isoliert durch den Lochboden hindurchragen und dass das Transistorgehäuse oben und unten mit je einer wärmeleitenden Isolierscheibe abgedeckt ist und mit einem Gewindebolzen gegen den Boden gepresst wird. Eine Weiterbildung des Erfindungsgedankens bestehtAccording to the invention, this object is achieved in that the heat sink has a blind hole in which the transistor is arranged, the connecting wires of which protrude insulated through the bottom of the hole and that the transistor housing on top and covered at the bottom with a thermally conductive insulating washer and is pressed against the ground with a threaded bolt. There is a further development of the inventive concept

BK 72/99 409884/0758 - 3 -BK 72/99 409884/0758 - 3 -

darin, die Wärmeausdehnung dadurch abzufangen, dass zwischen Gewindebolzen und der oberen wärmeleitenden Isolierscheibe eine Feder angeordnet ist, die aus einem Werkstoff mit guter Wärmeleitfähigkeit besteht.to intercept the thermal expansion by the fact that between Threaded bolt and the upper thermally conductive insulating washer, a spring is arranged, which is made of a material with good thermal conductivity.

Hit dieser Lösung ist es möglich, die in einem Transistor entstehende Wärme vollständig nach aussen abzuführen und die Abstrahlung der hohen Frequenzen zu vermeiden, wobei das Transistorgehäuse elektrisch isoliert angeordnet ist. Die Verlustwärme wird ausserdem über den Boden des Transistorgehäuses auf kürzestem Wege abgeführt und es wird der kleinste Wärmeübergangswiderstand vom Transistor chip zum Kühlkörper erreicht.Hit this solution it is possible to put that in a transistor to completely dissipate the resulting heat to the outside and to avoid the radiation of high frequencies, whereby the transistor housing is arranged in an electrically insulated manner. The heat loss is also via the bottom of the transistor housing dissipated in the shortest possible way and the smallest heat transfer resistance from the transistor chip to the Heat sink reached.

An Hand der Zeichnung wird die Erfindung in einem Ausführungsbeispiel näher beschrieben.
Im einzelnen zeigen die Figuren:The invention is described in more detail in an exemplary embodiment with reference to the drawing.
The figures show in detail:

die Fig. 1 eine Seitenansicht des Kühlkörpers im Schnitt,, die Fig. 2 die Draufsicht auf den Kühlkörper und die Fig. 3 ein Anwendungsbeispiel in einem elektrischen Topfkreis.Fig. 1 is a side view of the heat sink in section, FIG. 2 shows the top view of the heat sink and FIG. 3 shows an example of an application in an electrical circuit Pot circle.

In der Fig. 1 ist in dem Kühlkörper 1 ein Sackloch 2 eingebohrt, in dessen Boden 2a der Transistor 3 angeordnet ist. Der Transistor 3 ragt mit seinen Anschlussdrahten k isoliert durch den Lochboden 2a hindurch. Zwischen den Transistor und den Lochboden 2a ist eine wärmeleitende IsolierscheibeIn FIG. 1, a blind hole 2 is drilled into the heat sink 1, in the bottom 2a of which the transistor 3 is arranged. The transistor 3 protrudes with its connecting wires k insulated through the perforated base 2a. A thermally conductive insulating disk is located between the transistor and the perforated base 2a

409884/0758 BK 72/99 - k - 409884/0758 BK 72/99 - k -

gelegt, die das Transistorgehäuse 3 von dem Kühlkörper 1 isoliert. Von oben wird das Transistorgehäuse 3 ebenfalls von einer wärmeleitenden Isolierscheibe 6 abgedeckt. Eine Feder 7, als Blatt- oder Tellerfeder ausgebildet, aus einem Werkstoff guter Wärmeleitfähigkeit, z.B. Beryliumbronze, liegt zwischen dem Gewindebolzen 8 und der Isolierscheibe 6. Sie hat die Aufgabe, den Transistor 3 i«· seiner Lage zu halten, den Wärmekontakt des Transistorgehäuses 3 mit den oben und unten abdeckenden wärmeleitenden Isolierscheiben 5 und 6 herzustellen und ausserdem die Wärmeausdehnung abzufangen.placed, which isolates the transistor housing 3 from the heat sink 1. From above, the transistor housing 3 is also from a thermally conductive insulating disk 6 covered. A spring 7, designed as a leaf or plate spring, made of a material good thermal conductivity, e.g. beryllium bronze between the threaded bolt 8 and the insulating washer 6. It has the task of holding the transistor 3 in its position, to establish the thermal contact of the transistor housing 3 with the thermally conductive insulating disks 5 and 6 covering the top and bottom and also to absorb the thermal expansion.

Gewindebohrungen 9 in dem Kühlkörper 1 dienen der Halterung in der zugeordneten Baugruppe.Threaded bores 9 in the heat sink 1 are used for mounting in the assigned assembly.

Die Fig. 2 zeigt den in der Fig. 1 beschriebenen Kühlkörper 1 in einer Draufsicht. Die Positionsziffern entsprechen denen der Fig. 1.FIG. 2 shows the heat sink 1 described in FIG. 1 in a top view. The position numbers correspond to those of Fig. 1.

In der Fig. 3 ist ein anderes Beispiel des Kühlkörpers 1 der Fig. 1 dargestellt. Hier ist die Anordnung dieses Kühlkörpers 1 in einem Topfkreis 10 wiedergegeben, wobei die Anschlussdrähte k mit den zugehörigen Bauelementen 11 verbunden sind.Another example of the heat sink 1 from FIG. 1 is shown in FIG. 3. The arrangement of this heat sink 1 is shown here in a cup circle 10, the connecting wires k being connected to the associated components 11.

409884/07 58
BK 72/99 - 5 - 409884/07 58
BK 72/99 - 5 -

Claims (2)

233^210233 ^ 210 PatentansprücheClaims /Cl*yKühlkörper für Transistoren hoher Leistung mit grosser Hochfrequenzdichtigkeit, bestehend aus einem Metallblock, in dem der Transistor angeordnet ist, dadurch gekennzeichnet, dass der Kühlkörper (l) ein Sackloch (2) hat, in dem der Transistor 3 angeordnet ist, dessen Anschlussdrähte (4) isoliert durch den Lochboden (2a) hindurchragen und dass das Transistorgehäuse (3) oben und unten mit je einer wärmeleitenden Isolierscheibe (5i 6) abgedeckt ist und mit einem Gewindebolzen (8) gegen den Boden (2a) gepresst wird. / Cl * y heat sink for high-performance transistors with high high-frequency impermeability, consisting of a metal block in which the transistor is arranged, characterized in that the heat sink (1) has a blind hole (2) in which the transistor 3 is arranged, its connecting wires (4) protrude insulated through the perforated base (2a) and that the transistor housing (3) is covered at the top and bottom with a heat-conducting insulating washer (5i 6) and is pressed against the base (2a) with a threaded bolt (8). 2. Kühlkörper nach Anspruch 1, dadurch gekennzeichnet, dass zwischen Gewindebolzen (8) und der oberen wärmeleitenden Isolierscheibe (6) eine Feder (7) angeordnet ist, die aus einem Werkstoff mit guter Wärmeleitfähigkeit besteht.2. Heat sink according to claim 1, characterized in that between the threaded bolt (8) and the upper thermally conductive Insulating washer (6) a spring (7) is arranged, which consists of a material with good thermal conductivity. BK 72/" 4 0 9 8 8 A / 0 7 5 8 BK 72 / "4 0 9 8 8 A / 0 7 5 8
DE19732334210 1973-07-05 1973-07-05 Heat sink for high power transistors Expired DE2334210C2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19732334210 DE2334210C2 (en) 1973-07-05 1973-07-05 Heat sink for high power transistors

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732334210 DE2334210C2 (en) 1973-07-05 1973-07-05 Heat sink for high power transistors

Publications (2)

Publication Number Publication Date
DE2334210A1 true DE2334210A1 (en) 1975-01-23
DE2334210C2 DE2334210C2 (en) 1985-06-27

Family

ID=5886023

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19732334210 Expired DE2334210C2 (en) 1973-07-05 1973-07-05 Heat sink for high power transistors

Country Status (1)

Country Link
DE (1) DE2334210C2 (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1057240B (en) * 1957-11-09 1959-05-14 Bosch Gmbh Robert High-performance rectifier of the large surface design with a p-n semiconductor crystal serving as a rectifier element
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
DE1188208B (en) * 1960-03-07 1965-03-04 Pacific Semiconductors Inc Cooling device for semiconductor devices
DE1439269A1 (en) * 1951-01-28 1969-03-27 Siemens Ag High-current rectifier system

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1439269A1 (en) * 1951-01-28 1969-03-27 Siemens Ag High-current rectifier system
DE1057240B (en) * 1957-11-09 1959-05-14 Bosch Gmbh Robert High-performance rectifier of the large surface design with a p-n semiconductor crystal serving as a rectifier element
US3025437A (en) * 1960-02-05 1962-03-13 Lear Inc Semiconductor heat sink and electrical insulator
DE1188208B (en) * 1960-03-07 1965-03-04 Pacific Semiconductors Inc Cooling device for semiconductor devices

Also Published As

Publication number Publication date
DE2334210C2 (en) 1985-06-27

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OD Request for examination
8127 New person/name/address of the applicant

Owner name: AEG-TELEFUNKEN NACHRICHTENTECHNIK GMBH, 7150 BACKN

8127 New person/name/address of the applicant

Owner name: ANT NACHRICHTENTECHNIK GMBH, 7150 BACKNANG, DE

D2 Grant after examination
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8339 Ceased/non-payment of the annual fee