DE2127650B2 - Electrical resistor contact formation - using fluxing paste of org binder and silver - Google Patents
Electrical resistor contact formation - using fluxing paste of org binder and silverInfo
- Publication number
- DE2127650B2 DE2127650B2 DE19712127650 DE2127650A DE2127650B2 DE 2127650 B2 DE2127650 B2 DE 2127650B2 DE 19712127650 DE19712127650 DE 19712127650 DE 2127650 A DE2127650 A DE 2127650A DE 2127650 B2 DE2127650 B2 DE 2127650B2
- Authority
- DE
- Germany
- Prior art keywords
- paste
- contacts
- silver
- resin
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/144—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals or tapping points being welded or soldered
Abstract
Description
21 27 βδυ21 27 βδυ
Die Erfindung wwd nachfolgend anhand eines Ausführungsbcispiels näher erläuten:The invention is based on a Explain the execution example in more detail:
Auf einem kontinuierlich gezogenen Glasfaden mit aufgebrachter Lackruß-Widerstandsschicht auf der Basis der Glyptalharze, der als Träger des Mikrowiderstands dient, wird an den Kontaktstellen gürtelweise stromleitende Paste aufgetragen, die aus einem organischen Bindemittel auf der Basis der Glyptalharze und feindispersem Silber im Gewichtsverhältnis 1: 24 zusammengesetzt ist.On a continuously drawn glass thread with an applied paint soot resistance layer on the Base of the glyptal resins, which act as the carrier of the micro-resistance is used, conductive paste is applied to the contact points in a belt, which consists of a organic binder based on glyptal resins and finely dispersed silver in a weight ratio of 1:24 is composed.
Die stromleitende Paste muß zwei Hauptforderungen genügen:The conductive paste must meet two main requirements:
1. Sie soll eine gute Bindung mit der Lackruß-Widerstandsschicht aufweisen, was durch die Affinität zwischen Pastenstoff und Widersiandsschicht erreicht wird.1. It should have a good bond with the carbon black resistive layer have what is achieved by the affinity between paste and resistance layer will.
2. Sie soll zum Verzinnen fähig sein, was durch die Flußeigenschaften der Glyptalharze gewährleistet wird.2. It should be capable of tinning, which is ensured by the flow properties of the glyptal resins.
Als Paste kann folgende Mischung verwendet werden:The following mixture can be used as a paste:
Feindisperses Silber 100 Gew.-TeileFinely dispersed silver 100 parts by weight
Glyptalharz 10 Gew.-TeileGlyptal resin 10 parts by weight
Dibutylphthalat 16 Gew.-TeileDibutyl phthalate 16 parts by weight
Lösungsmittel: Xylol und
Terpentinöl im Verhältnis
0,4 al je Ig feindispersen
SilbersSolvent: xylene and
Turpentine oil in proportion
0.4 al per Ig finely dispersed
Silver
Nach dem Aufbringen der stromleitenden Paste werden die Gürtel bei einer Temperatur von 280 bis 300° C innerhalb von 30 bis 60 s eingebrannt. After applying the conductive paste, the belts are kept at a temperature of 280 Baked in up to 300 ° C within 30 to 60 s.
Hiernach sind auf die Pastengürtel Alkohol-Kolophonium- bzw. Salizyl-Glyzerin-Flußmittel aufzutragen und die mit Flußmittel versetzten Stellen innerhalb von 3 bis 5 s mit Blei-Zink-Lot unter Anwendung von Niedertemperaturzusätzen, z. B. Kadmium, beiAfter this, alcohol-rosin or salicyl-glycerine flux should be applied to the paste belts and the areas treated with flux within 3 to 5 s with lead-zinc solder using of low temperature additives, e.g. B. Cadmium
ίο einer Temperatur von 140 bis 180=C zu verzinnen. ίο to be tinned at a temperature of 140 to 180 = C.
Die Einbrenntemperatur der Paste und die Verzinntemperatur müssen wesentlich niedriger sein als die Temperatur der Strukturänderung der Widerstandsschicht, was die erforderliche Voraussetzung für die Erhaltung des konstanten Widerstandswertes der Widerstandsschicht ist.The baking temperature of the paste and the tinning temperature must be considerably lower than the temperature of the structural change of the resistive layer, which is the necessary condition for the Preservation of the constant resistance value of the resistance layer is.
Nach dem Verzinnen wird der mit Pastengürteln versehene Glasfaden in Abschnitten jeweils mitten im Gürtel abgeschnitten, wodurch man die einzelnen Mikrowiderstände mit verzinnten Kontakten gewinnt. Der Vorteil des erfindungsgemäßen Verfahrens liegt darin, daß es gestattet, verzinnte Kontakte der Mikrowiderstände herzustellen, die deren Montage durch unmittelbares Löten in eine Schaltung gewährleisten, wobei das erfindungsgemäße Verfahren für Widerstände mit verzinnten Kontakten vollautomatisiert werden kann.After tinning, the glass thread provided with paste belts is cut in sections in the middle of the Cut off the belt, thereby gaining the individual micro-resistors with tinned contacts. The advantage of the method according to the invention is that it allows tin-plated contacts of the micro-resistors manufacture, which ensure their assembly by direct soldering in a circuit, whereby the inventive method for resistors with tinned contacts is fully automated can be.
Claims (3)
Iischen Kontakte bei einer Temperatur von hoch- Außerdem ist es bekannt (DT-PS 8 21 060), eineTemperatures of approximately 300 c C baked-in io metallic conductivity is described (DT-PS is described, with synthetic resins of the same type 5 94 402), with which resistance layers are used in contact, and then the metal on which a contact is to grind.
Iischen contacts at a temperature of high In addition, it is known (DT-PS 8 21 060), a
Paste ein Harz aus der Gruppe der Glyptalharze Leitende Lacke auf Kunstharzbasis wurden mehr-At least 180 0 C applied to the cured paste metallic Kor.tiktschicht on a carbon layer, characterized in that 15 resistance to burn and at the contact points as a mineral carrier a glass thread and as special prefabricated contact pieces such as caps, synthetic resin, the soot resistance layer and the clamps or Pressing on solder lugs.
Paste a resin from the group of glyptal resins Conductive varnishes on a synthetic resin basis have been
dit auf einen mineralischen Träger aufgebracht ist, Schließlich ist ein Glasfaden-Widerstand bekanntThe invention relates to a method for applying metallic contacts consisting of at least one manganate material to a resist (US Pat 512) known,
dit is applied to a mineral carrier. Finally, a glass filament resistor is known
des Mikrowiderstands aufgetragen werden: jedoch Vorzugsweise enthält die Paste Glyptalharz undContacts of glass thread micro-resistors known 60 of the asbestos carrier according to the above-mentioned in the article "Some properties of conductive glues were known processes per se, the paste on the and their effect on the stability of the contact continuously drawn, with the soot resistance" in " Elektronraja technika «, No. 8, layer-covered glass thread applied in sections in Ring Edition 2 (23), Central Research Institute for Elek- form, and after tinning tronik, Moscow, 1971), according to which the contacts 65 with radial cuts the middle of the rings obtained individual glass filament resistances from an electrically conductive mass on the metal coating,
of the micro-resistor: however, the paste preferably contains glyptal resin and
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712127650 DE2127650C3 (en) | 1971-06-03 | Method for applying metallic contacts on a carbon-synthetic resin resistance layer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19712127650 DE2127650C3 (en) | 1971-06-03 | Method for applying metallic contacts on a carbon-synthetic resin resistance layer |
Publications (3)
Publication Number | Publication Date |
---|---|
DE2127650A1 DE2127650A1 (en) | 1972-12-14 |
DE2127650B2 true DE2127650B2 (en) | 1976-08-19 |
DE2127650C3 DE2127650C3 (en) | 1977-03-31 |
Family
ID=
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT376517B (en) * | 1981-06-30 | 1984-11-26 | Siemens Bauelemente Ohg | METHOD FOR THE PRODUCTION OF AREA-LIMITED, SOLDERABLE METAL LAYERS ON ELECTRICAL COMPONENTS |
AT376833B (en) * | 1981-06-30 | 1985-01-10 | Siemens Bauelemente Ohg | METHOD FOR ATTACHING METAL CONTACTS ON ELECTRICAL COMPONENTS |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AT376517B (en) * | 1981-06-30 | 1984-11-26 | Siemens Bauelemente Ohg | METHOD FOR THE PRODUCTION OF AREA-LIMITED, SOLDERABLE METAL LAYERS ON ELECTRICAL COMPONENTS |
AT376833B (en) * | 1981-06-30 | 1985-01-10 | Siemens Bauelemente Ohg | METHOD FOR ATTACHING METAL CONTACTS ON ELECTRICAL COMPONENTS |
Also Published As
Publication number | Publication date |
---|---|
DE2127650A1 (en) | 1972-12-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C3 | Grant after two publication steps (3rd publication) | ||
E77 | Valid patent as to the heymanns-index 1977 | ||
8339 | Ceased/non-payment of the annual fee |