DE2065347A1 - Laminates for printed circuits - by laminating sheets of heat-hardenable or thermoplastic resins into phosphoric acid-treat - Google Patents

Laminates for printed circuits - by laminating sheets of heat-hardenable or thermoplastic resins into phosphoric acid-treat

Info

Publication number
DE2065347A1
DE2065347A1 DE19702065347 DE2065347A DE2065347A1 DE 2065347 A1 DE2065347 A1 DE 2065347A1 DE 19702065347 DE19702065347 DE 19702065347 DE 2065347 A DE2065347 A DE 2065347A DE 2065347 A1 DE2065347 A1 DE 2065347A1
Authority
DE
Germany
Prior art keywords
laminate according
phosphoric acid
printed circuits
heat
thermoplastic resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE19702065347
Other languages
German (de)
Inventor
Ottavio Eugene H D
John J Grunwald
William P Innes
Michael S Lombardo
Harold L Rhodenizer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Priority to DE19702065347 priority Critical patent/DE2065347A1/en
Publication of DE2065347A1 publication Critical patent/DE2065347A1/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
    • H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
    • H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
    • H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
    • C25D11/02—Anodisation
    • C25D11/04—Anodisation of aluminium or alloys based thereon
    • C25D11/18—After-treatment, e.g. pore-sealing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1152—Replicating the surface structure of a sacrificial layer, e.g. for roughening
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1407—Applying catalyst before applying plating resist

Abstract

An Al-plated laminate for printed circuits etc. is prepd. by (1) anodically treating an Al foil in an electrolytic bath contg. 10-60wt.% phosphoric acid for 1-30 mins. at a current density of 10.7-80.7 mA/cm2, and (2) bonding 1 or both surfaces of the treated Al foil to a substrate which is either a heat-hardenable resin layer or a thermoplastic resin layer. The use of a polymeric adhesive as inter-layer between a metal and a synthetic carrier is avoided. Al can be used in place of the more expensive Cu.

Description

Aluminiumplattierter Sehichtstoff fur gedruckte Schaltungen und dergleichen Die Erfindung betrifft einen aluminiumplattierten Sehichtstoff für gedruckte Schaltungen und dergleichen. Aluminum clad sealant for printed circuit boards and the like The invention relates to an aluminum-clad visual sealant for printed circuits and the same.

Leitermetallplattierte Schichtstoffe werden heute sehr viel zur Harstellung von gedruckten Schaltungen verwendet, um unter anderem die notwendige Verdrahtung der auf einer solchen Schaltkarte angeordneten elektronischen Bauelemente in eine Form zu bringen, die eine maschinelle, reproduzierbare und wirtschaftliche Herstellung ermöglichto Nach Stand der technik sind bisher vor allem die kupferkaschierten Platten zur Herstellung von gedruckten Schaltungen bekannt, die als Isolierträger eine Hartpapiersorte verwenden, Bei einer solchen Platte wirkt sich besonders nachteilig aust daß die Verwendung eines polymeren Haftüberzugs auf dem Isolierträger aus Hartpapier oder Harttextil erforderlich ist, um eine zufriedenstellende Haftung des Kupfers an dem dielektrischen Schichtträger zu bewirken0 Es besteht weiterhin der wesentliche Nachteil, daß Kupfer ein sehr teures Leitermetall isto Daraus ergibt sich die Aufgabe, einen leitermetallplattierten Schichtstoff zu schaffen, der ohne Verwendung eines polymeren Haftüberzuges als Zwischenträger auskommt.Conductor metal clad laminates are very much used today for manufacture used by printed circuits to, among other things, provide the necessary wiring of the electronic components arranged on such a circuit card into a To bring form that a machine, reproducible and economical production enableso Up to now, the most up-to-date technology has been the copper-clad plates known for the production of printed circuits that use a type of hard paper as an insulating carrier use, with such a plate is particularly disadvantageous that the Use of a polymeric adhesive coating on the insulating support made of hard paper or Hard textile is required to ensure satisfactory adhesion of the copper to the dielectric substrate too cause 0 The The main disadvantage is that copper is a very expensive conductor metal set themselves the task of creating a conductive metal clad laminate that does not have a Use of a polymeric adhesive coating as an intermediate carrier is sufficient.

Die Aufgabe- wird erfindungsgemäß dadurch gelöst, dk ein aus der wärmehärtbare Harzschichttäger und thermoplastische Harzschichtträger umfassenden Gruppe ausgewählter Schichtträger mit anodisch behandelter Aluminiumfolie verbunden ist, wobei gegen den Schichtträger die Fläche der Aluminiumfolie anliegt, die in einem etwa 10 bis 60 Gewichtsprozente Phosphorsäure enthaltenden elektrolytischen Bad für die Dauer von 1 bis etwa 30 Minuten bei einer Stromdichte von etwa 10,7 bis etwa 80,7 mA/cm2 anodisch behandelt worden ist.The object is achieved according to the invention in that one of the thermosetting Resin film supports and thermoplastic resin film supports Layer support is connected to anodically treated aluminum foil, against the surface of the aluminum foil rests on the support, which is about 10 to Electrolytic bath containing 60 percent by weight of phosphoric acid for the duration from 1 to about 30 minutes at a current density of about 10.7 to about 80.7 mA / cm2 has been treated anodically.

Weitere Ausgestaltungen der Erfindung finden sich in den Unteransprüchen.Further refinements of the invention can be found in the subclaims.

Die mit der Erfindung erzielten Vorteile bestehen insbesondere darin daß sich Aluminium leichter als Kupfer bei dem "additiven" Verfahren von dem Kunststoffschichtträger ablösen läßt und dazu wesentlich billiger .als das I,eitermetall Kupfer isto Weitere Einzelheiten und Vorteile der Erfindung sind nach stehend näher erläutert.The advantages achieved with the invention are in particular that aluminum is easier to remove than copper in the "additive" process from the plastic substrate can be removed and also much cheaper than the pure metal copper is another Details and advantages of the invention are explained in more detail below.

Der erfindungsgemäße leitermetallplattierte Schichtträger besitzt einen Metallüberzug aus Aluminium, das mit einem wärmegehärteten Harz durch Wärme und Druck verbunden ist und eine gegen das Harz anliegende, anodisch behandelte Oberfläche hat. In diesem Fall kann die Metallfeinblechfolie so dünn wie möglich sein, da diese Plattierung selbst nicht für eine mögliche Schaltung bildende Verwendung in Frage kommt, sondern von dem als Schaltkarte dienenden Träger vor dem Aufbringen iräendeiner Schaltung vollständig abgelöst oder abgeätzt winde Als Leitermetall können neben reinem Aluminiumfeinblech und reiner Aluminiumfolie auch Aluminiumlegierungen wie beispielsweise Aluminium-Kupfer, Aluminium-Magnesium, Aluminium-Kupfer-Magnesium-Zink usw, verwendet werden.The conductive metal clad substrate of the present invention has a metal coating made of aluminum coated with a thermosetting resin by heat and pressure is connected and an anodized against the resin Surface has. In this case, the metal sheet metal foil so be as thin as possible, as this plating itself is not suitable for a possible circuit Formative use comes into question, but from the carrier serving as a circuit card completely peeled off or etched off before applying a circuit As a conductor metal, in addition to pure aluminum sheet and pure aluminum foil also aluminum alloys such as aluminum-copper, aluminum-magnesium, Aluminum-Copper-Magnesium-Zinc, etc. can be used.

Die Dicke des Aluminiumfeinblechs oder der Aluminiumfolie läßt sich über einen weiten Bereich variieren und beträgt im allgemeinen etwa 0,0254 bis etwa 0,2489 mm oder mehr, jedoch vorzugsweise 0,0254 bis etwa 0 62 mm Als Schichtträger werden die verschiedensten, dem Fachmann bekannten Kunststoffschichtträger verwendet. Zu den brauchbaren Kunststoffen gehören diejenigen, die sowohl aus thermoplestischen als auch aus wärmehärtbaren Harzen hergestellt sindc Typische wärmehärtbare Harze sind hierfür die Phenolharze, wie beispielsweise die Mischpolymere aus Phenol, Resorcin, einem Kresol oder einem Xylenol mit Formaldehyd oder Furfurol. Auch die durch Reaktion von Dicarboxylverbindungen mit zweiwertigen Alkoholen hergestellten Polyester, wie beispielsweise die Reaktionsprodukte von Phthal- oder Maleinsäureanhydrid mit Mono-, Di- oder Polväthylenglvkolen. bilden eine geeignete Gruppe von wärmehärtharen Harzen Zu einer besonders wertv-ollen Gruppe von wärmehärtbaren Harzen für die Zwecke nach der Rrfindung zählen die Epoxyharze, wie beispielsweise das Reaktionsprodukt aus Epichlorhydrin und Bisphenol A. Zu den für die Zwecke der Erfindung brauchbaren thermoplastischen Harzen gehören die Polyolefine, wie beispielsweise die Polypropylenen, Polysulfone, @BS-Kunststoffe, Polycarbonste, Polyphenylenoxide usw.The thickness of the aluminum sheet or the aluminum foil can be varied vary over a wide range and is generally about 0.0254 to about 0.2489 mm or more, but preferably 0.0254 to about 0 62 mm as a support A wide variety of plastic substrates known to those skilled in the art are used. Usable plastics include those made from both thermoplastic and made of thermosetting resins are typical thermosetting resins are the phenolic resins, such as the mixed polymers of phenol, resorcinol, a cresol or a xylenol with formaldehyde or furfural. Even by reaction polyesters made from dicarboxyl compounds with dihydric alcohols, such as for example the reaction products of phthalic or maleic anhydride with mono-, Di- or Polväthylenglvkolen. form a suitable group of thermosetting resins Subsequent to a particularly valuable group of thermosetting resins for the purpose the Rrfindung include the epoxy resins, such as the reaction product Epichlorohydrin and bisphenol A. Among those useful for the purposes of the invention thermoplastic resins include the polyolefins, such as the polypropylenes, Polysulfones, @ BS plastics, polycarbonates, polyphenylene oxides, etc.

Die nach der Erfindung verwendeten wärmehärtbaren Harze liegen in Form von als vorbereitete Aufnahmefdlien bekannten dünnen Hsrzfolien vor0 In diesen Aufnahmefolien befinden sich die wärmehärtbaren Harze in einem als B-Stufe bekannten, teilweise ausgehärteten Zustand, wobei diese bei Wärme und Druck noch schmelzbar sind, aber bei genügender Wärme und genügendem Druck völlig ausgehärtet werden können, so daß -zähe, unschmelzbare wärmegehärtete Folien erhalten werden0 Die verwendeten dünnen Folien aus wärmehärtbarem Harz enthalten üblicherweise Verstärkungseleme-nte,wie z.-i. Glasfasern, Asbest, Glimmer, Papier, Nylonfaser usw., wobei die-VerstärkungFselemente etwa 30 bis 60 Gewichtsprozente des verstärkten Kunststoffes betragen. Ein typischer polye-ster- oder epoxyverstärkter Schichtträger mit einer Dicke von 3,175 + 0,127 mm und einem Harzgehalt von etwa 38 + 2 % besitzt zwölf Glasgewebelagen, wobei die Zugfestigkeit eines solchen Schichtträgers etwa 3515 kg/cm2 und die Druckfestigkeit (trocken) etwa~4371 kg/cm beträgt, Als bevorzugtes Verstärkungsmittel dient Glasfaser, wobei als Glasfaser jede faserige Glaseinheit bezeichnet wird, die endlose Garne, Glasseidenstränge, Verstärkungsfilze, feste Garne, Gewebe und Stapelfasern enthält. Die Glasplattierter fasergewebe sind- entweder wärmebehandelt oder mit einem Chromacrylatkomplex, einem aminaktiven Monosilan oder einem epoxyaktiven Monosilan chemisch- behandelt worden, die als Kopplungsmittel zwischen dem Glas und dem Harz wirken und die Haftung; des -Harzbindemittels und des Glases verbessern.The thermosetting resins used in the invention are in In the form of thin plastic sheets known as prepared recording sheets Recording sheets, the thermosetting resins are in a stage known as B-stage, partially cured state, although this is still fusible under heat and pressure but can be fully cured with sufficient heat and pressure, so that tough, infusible thermoset films are obtained thin sheets of thermosetting resin usually contain reinforcing elements such as z.-i. Glass fiber, asbestos, mica, paper, nylon fiber, etc., being the reinforcement elements be about 30 to 60 percent by weight of the reinforced plastic. A typical one polye-ster or epoxy reinforced substrate with a thickness of 3.175 + 0.127 mm and a resin content of about 38 + 2% has twelve layers of glass fabric, the The tensile strength of such a substrate is about 3515 kg / cm2 and the compressive strength (dry) is about ~ 4371 kg / cm, glass fiber is used as the preferred reinforcing agent, where glass fiber is any fibrous glass unit that contains endless yarns, Contains fiberglass strands, reinforcement felts, solid yarns, woven fabrics and staple fibers. The glass clad fiber fabrics are either heat treated or with a chrome acrylate complex, chemically treated with an amine-active monosilane or an epoxy-active monosilane which act as a coupling agent between the glass and the resin and the adhesion; the resin binder and the glass.

Ein zur Verwendung bei dem additiven Verfahren zur Herstellung von Schaltkarten geeigneter aluminiumplattierter Schichtstoff besteht beispielsweise aus einem mit wärmehärtbaren Epoxy beschichteten und imprägnierten Glasfasergewebebogen mit einer gegen das Harz anliegenden anodisch behandelten Aluminiumfolienoberfläche, wobei der sich an-Länglich in der B-Stufe befindende wärmehärtbare Epoxyharz unter Einwirkung von Wärme und Druck weiter ausgehärtet wurde.One for use in the additive method of making Aluminum-clad laminate suitable for circuit boards consists for example from one with thermosetting Epoxy coated and impregnated Glass fiber fabric sheet with an anodized aluminum foil surface resting against the resin, wherein the thermosetting epoxy resin located at-oblong in the B-stage under Cured further under the influence of heat and pressure.

Einen ähnlichen Aufbau. zeigt ein auf beiden Seiten mit Aluminiumfolie,plattierter Schichtstoff, bei dem jeweils die anodisch behandelten Oberflächen der Aluminiumfolie den mit wärmehärtbarem Epoxy beschichteten und imprägnierten Glasfasergewebebogen berühren, wobei der ursprünglich teilweise ausgehärtete, d.h. sich im Zustand der B-Stufe befindende, wärmehärtbare Harz unter Einwirkung. von ärme-und Druck weiter ausgehärtet wurde. Sofern der aluminiuniplattierte Schlchtstoff nur auf einer Seite plattiert ist, wird ein Bogen aus (nichtoxydierter) Aluminiumfolie benutzt.A similar structure. shows one clad with aluminum foil, on both sides Laminate, in each of which the anodized surfaces of the aluminum foil the sheet of glass fiber fabric coated and impregnated with thermosetting epoxy touch, the originally partially cured, i.e. in the state of B-stage thermosetting resin under action. of poor and pressure on has been cured. Provided that the aluminum-plated material is only on one side is plated, a sheet of (non-oxidized) aluminum foil is used.

Der gleiche Aufbau-Wie bei einem atuminiumplattierten Schichtstoff mit wärmehärtbarem Harzschichtträger liegt bei einem mit thermoplastischem Harzschichtträger vor, wobei wieder die anodisch behandelte Oberfläche der Aluminiumfolie dem Kunststoff- zugekehrt ist und beide Grenzflächen unter Einwirkung eines Preßvorganges bei einer bestimmten Temperatur miteinander verbunden worden sind.Same construction as an aluminum clad laminate with thermosetting resin support is one with thermoplastic resin support before, again the anodized surface of the aluminum foil to the plastic is facing and both interfaces under the action of a pressing process at one have been connected to each other at a certain temperature.

P.atentansprüche:Patent claims:

Claims (6)

P a t e n -t a n s p r ü c h e 1 @ Aluminiumplattierter Schichtstoff für gedruckte Schaltungen uiid dergleiche-n,. dadurch gekennzeichnet, daß ein aus der wärmehärtbare Harzschichtträger und thermoplastische Harzschichtträger umfassenden Gruppe ausgewählter Schichtträger mit anodisch behandelter Aluminiumfolie verbunden ist, wobei gegen den Schichtträger die Fläche der Aluminiumfolie anliegt, die. in einem etwa 10 bis 60 Gewichtsprozente Phosphorsäure enthaltenden elektrolytischen Bad für die Dauer von etwa 1 bis etwa 30 Minuten bei einer Stromdichte von etwa 10,7 bis etwa 80,7 mA/cm2 anodisch behandelt worden ist. P a t e n -t a n s p r ü c h e 1 @ Aluminum clad laminate for printed circuits uiid the same-n ,. characterized in that one off comprising the thermosetting resin base and thermoplastic resin base Group of selected substrates bonded with anodized aluminum foil is, with the surface of the aluminum foil resting against the support that. in an electrolytic containing about 10 to 60 percent by weight phosphoric acid Bath for from about 1 to about 30 minutes at a current density of about 10.7 to about 80.7 mA / cm2 has been anodized. 2 Schichtstoff nach Anspruch 1, dadurch gekennzeichnet, daß der Schichtträger aus einem wärmehärtbaren Harz besteht 2 Laminate according to claim 1, characterized in that the layer support consists of a thermosetting resin 3. Schichtstoff nach Anspruch 1, dadurch gekennzeichnet, daß der Schichtträger aus einem thermopIastischen Harz be-stehtb 3. Laminate according to claim 1, characterized in that that the substrate consists of a thermoplastic resin 4. Schichtstoff nach anspruch 2, dadurch gekennzeichnet, daß das wärmehärtbare Harz ein glasfaserverstärktes Epoxyharz ist 4. Laminate according to claim 2, characterized in that the thermosetting resin is a glass fiber reinforced one Epoxy resin is 5. Schichtstoff nach Anspruch 2, dadurch gekennzeichnet, daß das wärmehärtbare Harz ein glasfaserverstärktes Phenolharz ist0 5. Laminate according to claim 2, characterized in that the thermosetting Resin is a glass fiber reinforced phenolic resin0 6. Schichtstoff nach Anspruch 3, dadurch gekennzoichnet, daß das thermoplastische Harz Polypropylen ist.6. Laminate according to claim 3, characterized indicated that the thermoplastic resin is polypropylene. 7o Schichtstoff nach Anspruch ), dadurch gekennzeichnet, daß das thermoplastische Harz ein ABS-Kunststoff (ein Acrylonitril-Butadien-Styrol-Mischpolymer) ist.7o laminate according to claim), characterized in that the thermoplastic Resin is an ABS plastic (an acrylonitrile-butadiene-styrene copolymer).
DE19702065347 1969-12-31 1970-12-30 Laminates for printed circuits - by laminating sheets of heat-hardenable or thermoplastic resins into phosphoric acid-treat Pending DE2065347A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19702065347 DE2065347A1 (en) 1969-12-31 1970-12-30 Laminates for printed circuits - by laminating sheets of heat-hardenable or thermoplastic resins into phosphoric acid-treat

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US88947269A 1969-12-31 1969-12-31
DE19702065347 DE2065347A1 (en) 1969-12-31 1970-12-30 Laminates for printed circuits - by laminating sheets of heat-hardenable or thermoplastic resins into phosphoric acid-treat

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