DE20316173U1 - Kühlsystem - Google Patents

Kühlsystem Download PDF

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Publication number
DE20316173U1
DE20316173U1 DE20316173U DE20316173U DE20316173U1 DE 20316173 U1 DE20316173 U1 DE 20316173U1 DE 20316173 U DE20316173 U DE 20316173U DE 20316173 U DE20316173 U DE 20316173U DE 20316173 U1 DE20316173 U1 DE 20316173U1
Authority
DE
Germany
Prior art keywords
coolant
vaporizing
heat sink
heat exchanger
hermetically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE20316173U
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to DE20316173U priority Critical patent/DE20316173U1/de
Publication of DE20316173U1 publication Critical patent/DE20316173U1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
DE20316173U 2003-10-22 2003-10-22 Kühlsystem Expired - Lifetime DE20316173U1 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE20316173U DE20316173U1 (de) 2003-10-22 2003-10-22 Kühlsystem

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE20316173U DE20316173U1 (de) 2003-10-22 2003-10-22 Kühlsystem

Publications (1)

Publication Number Publication Date
DE20316173U1 true DE20316173U1 (de) 2005-03-17

Family

ID=34353524

Family Applications (1)

Application Number Title Priority Date Filing Date
DE20316173U Expired - Lifetime DE20316173U1 (de) 2003-10-22 2003-10-22 Kühlsystem

Country Status (1)

Country Link
DE (1) DE20316173U1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7918102B2 (en) 2004-03-26 2011-04-05 Papst Licensing Gmbh & Co. Kg Method and arrangement for cooling a substrate, particularly a semiconductor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7918102B2 (en) 2004-03-26 2011-04-05 Papst Licensing Gmbh & Co. Kg Method and arrangement for cooling a substrate, particularly a semiconductor

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Legal Events

Date Code Title Description
R086 Non-binding declaration of licensing interest
R207 Utility model specification

Effective date: 20050421

R156 Lapse of ip right after 3 years

Effective date: 20070501