DE20303068U1 - Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fan - Google Patents
Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fanInfo
- Publication number
- DE20303068U1 DE20303068U1 DE20303068U DE20303068U DE20303068U1 DE 20303068 U1 DE20303068 U1 DE 20303068U1 DE 20303068 U DE20303068 U DE 20303068U DE 20303068 U DE20303068 U DE 20303068U DE 20303068 U1 DE20303068 U1 DE 20303068U1
- Authority
- DE
- Germany
- Prior art keywords
- cooling
- heat sink
- heat dissipation
- fan
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßt The description text was not recorded electronically
Der Beschreibungstext wurde nicht elektronisch erfaßtThe description text was not recorded electronically
Claims (10)
dass die nebeneinander verbundenen Kühlbleche (22) in der Mitte mit einer Durchgangsbohrung (22a) zur Aufnahme des Lüfters (24) sowie oben und unten mit einer Vielzahl von Aufnahmeschlitzen (22b) zur Unterbringung der Wärmeableitungsröhrchen (21) versehen ist, und das Kühlgehäuse (23) umgekehrt U-förmig ausgebildet ist und eine Vielzahl von Kühllöchern (23a) aufweist, und dass das Kühlgehäuse (23) an einer Seite ein Fenster (23b) besitzt,
und dass der Lüfter (24) innerhalb eines Lüfterträgers (25) aufgenommen ist, der dann durch das Fenster (23b) des Kühlgehäuses (23) in die Durchgangsbohrung (22a) der nebeneinander verbundenen Kühlbleche (22) einsteckbar ist, sodass der Lüfter (24) im Inneren der nebeneinander verbundenen Kühlbleche (22) untergebracht ist.1. Cooling device with heat dissipation tube and a removable fan, which is attached to the top of a central unit ( 1 ), wherein the cooling device ( 2 ) has a metallic lower plate ( 3 ), which is in contact with the surface of the central unit ( 1 ), and wherein the cooling device ( 2 ) also has a plurality of C heat dissipation tubes ( 21 ), a plurality of cooling plates ( 22 ) connected to one another, a cooling housing ( 23 ) and a fan ( 24 ), all of which lie on top of the metallic base plate ( 3 ) , and wherein the cooling device ( 2 ) is fastened to the central unit ( 1 ) by a holding device ( 4 ), characterized in that
that the side-by-side cooling plates ( 22 ) are provided in the middle with a through hole ( 22 a) for receiving the fan ( 24 ) and above and below with a plurality of receiving slots ( 22 b) for accommodating the heat dissipation tubes ( 21 ), and that The cooling housing ( 23 ) has an inverted U-shape and has a plurality of cooling holes ( 23 a), and that the cooling housing ( 23 ) has a window ( 23 b) on one side,
and that the fan ( 24 ) is accommodated within a fan carrier ( 25 ) which can then be inserted through the window ( 23 b) of the cooling housing ( 23 ) into the through hole ( 22 a) of the cooling plates ( 22 ) connected next to one another, so that the fan ( 24 ) is housed inside the side-by-side cooling plates ( 22 ).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20303068U DE20303068U1 (en) | 2003-02-25 | 2003-02-25 | Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fan |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20303068U DE20303068U1 (en) | 2003-02-25 | 2003-02-25 | Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fan |
Publications (1)
Publication Number | Publication Date |
---|---|
DE20303068U1 true DE20303068U1 (en) | 2003-06-05 |
Family
ID=7980345
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE20303068U Expired - Lifetime DE20303068U1 (en) | 2003-02-25 | 2003-02-25 | Cooling system for computer has metallic baseplate carrying large number of cooling fins with central apertures accommodating cooling fan |
Country Status (1)
Country | Link |
---|---|
DE (1) | DE20303068U1 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1712980A3 (en) * | 2005-04-11 | 2007-10-03 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
DE102009047206A1 (en) * | 2009-11-26 | 2011-06-01 | Scythe Eu Gmbh | Cooler for cooling CPU of computer system, has secondary finned cooling unit with heat guiding pipes inserted into grooves of primary finned cooling unit, where pipes are attached to base plate and thermally coupled at secondary unit |
CN107288905A (en) * | 2017-07-19 | 2017-10-24 | 德清京达电气有限公司 | A kind of CPU radiator fans |
-
2003
- 2003-02-25 DE DE20303068U patent/DE20303068U1/en not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1712980A3 (en) * | 2005-04-11 | 2007-10-03 | Zalman Tech Co., Ltd. | Apparatus for cooling computer parts and method of manufacturing the same |
DE102009047206A1 (en) * | 2009-11-26 | 2011-06-01 | Scythe Eu Gmbh | Cooler for cooling CPU of computer system, has secondary finned cooling unit with heat guiding pipes inserted into grooves of primary finned cooling unit, where pipes are attached to base plate and thermally coupled at secondary unit |
CN107288905A (en) * | 2017-07-19 | 2017-10-24 | 德清京达电气有限公司 | A kind of CPU radiator fans |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
R207 | Utility model specification |
Effective date: 20030710 |
|
R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20060418 |
|
R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20090427 |
|
R158 | Lapse of ip right after 8 years |
Effective date: 20110901 |